Semiconductor device, wiring substrate, and method for manufacturing wiring substrate | Patent Publication Number 20060151870

US 20060151870 A1

Patent NumberUS 07728439 B2

Application Number10536025

Filled DateNov 21, 2003

Priority DateNov 21, 2003

Publication DateJul 13, 2006

Original AssigneeAt&t Company

Current AssigneeGodo Kaisha Ip Bridge 1

Inventor/ApplicantsTomohiro Nishiyama
Masamoto Tago

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