Dummy fill for integrated circuits | Patent Publication Number 20030226757

US 20030226757 A1
Patent NumberUS 07124386 B2
Application Number10164844
Filled DateJun 7, 2002
Priority DateJun 7, 2002
Publication DateDec 11, 2003
Original AssigneePraesagus Inc.
Current AssigneeCadence Design Systems Inc.
Inventor/ApplicantsVikas Mehrotra
Vikas Mehrotra
Taber H. Smith
David White
Taber H. Smith
David White
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