Method of manufacturing semiconductor device | Patent Publication Number 20020058371

US 20020058371 A1

Patent NumberUS 06544883 B2

Application Number9987029

Filled DateNov 13, 2001

Priority DateNov 13, 2001

Publication DateMay 16, 2002

Original AssigneeNec Electronics Corporation

Current AssigneeRenesas Electronics

Inventor/ApplicantsMasahiko Ohuchi
Masahiko Ohuchi

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