Techniques for MRAM MTJ top electrode to via interface | Patent Number 12167614

US 12167614 B2
Application Number17533385
Publication NumberUS 20220093684 A1
Pendency3 years, 18 days
Filled DateNov 23, 2021
Priority DateAug 29, 2018
Publication DateMar 24, 2022
Expiration DateAug 28, 2038
Inventor/ApplicantsSheng-Huang Huang
Hung Cho Wang
Harry-Hak-Lay Chuang
Jiunyu Tsai
Examines-
Art Unit0
Technology Center0
Assignments
Taiwan Semiconductor Manufacturing Company
Current
Taiwan Semiconductor Manufacturing Company
Original
Law Firm
You must be logged in to view
Login
Attorneys
Subscription-Only
View Concierge Program
Patent Prosecution report image

Empower your practice with Patexia Publication Prosecution IP Module.

Get access to our exclusive rankings and unlock powerful data.
Check our Latest ReportPurchase IP Module

Looking for a Publication Attorney?

Get in touch with our team or create your account to start exploring a network of over 120K attorneys.