Method of manufacturing semiconductor structure and semiconductor structure | Patent Number 12167589

US 12167589 B2
Application Number17804937
Publication NumberUS 20230232615 A1
Pendency2 years, 6 months, 13 days
Filled DateJun 1, 2022
Priority DateMar 3, 2022
Publication DateJul 20, 2023
Expiration DateMar 2, 2042
Inventor/ApplicantsGuangji Li
Guangji LI
Examines-
Art Unit0
Technology Center0
Assignments
Changxin Memory Technologies Inc.
Current
Changxin Memory Technologies Inc.
Original
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