Semiconductor device and method of manufacturing the same | Patent Number 12165997

US 12165997 B2
Application Number17711705
Publication NumberUS 20230026305 A1
Pendency2 years, 8 months, 14 days
Filled DateApr 1, 2022
Priority DateJul 15, 2021
Publication DateJan 26, 2023
Expiration DateJul 14, 2041
Inventor/ApplicantsChing-Hung Kao
Kuei-Yu Deng
ExaminesOWENS, DOUGLAS W
Art Unit2823
Technology Center2800
Assignments
Taiwan Semiconductor Manufacturing Company
Current
Taiwan Semiconductor Manufacturing Company
Original
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