Methods for placing an EMV chip onto a metal card | Patent Number 11562194

US 11562194 B2
Application Number17233338
Publication NumberUS 20210232885 A1
Pendency1 year, 9 months, 13 days
Filled DateApr 16, 2021
Priority DateFeb 2, 2017
Publication DateJul 29, 2021
Expiration DateFeb 1, 2037
Inventor/ApplicantsJonny B. Vu
ExaminesLEE, SEUNG H
Art Unit2876
Technology Center2800
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