Package structure and manufacturing method thereof | Patent Number 10916685

US 10916685 B2
Application Number16009005
Publication NumberUS 20180366623 A1
Pendency2 years, 8 months, 1 day
Filled DateJun 14, 2018
Priority DateJun 14, 2017
Publication DateDec 20, 2018
Expiration DateJun 13, 2037
Inventor/ApplicantsWei-Te Cheng
Kai-Chieh Liang
Kuo-Ming Chiu
KUO-MING CHIU
Meng-Sung Chou
KAI-CHIEH LIANG
WEI-TE CHENG
MENG-SUNG CHOU
ExaminesKIM, SU C
Art Unit2899
Technology Center2800
Assignments
Liteon Technology Corporation
Current
Liteon Opto Technology Changzhou Co. Ltd.
Current
Liteon Opto Technology Changzhou Co. Ltd.Liteon Technology Corporation
Original
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