Compound, resin, material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography, resist pattern forming method, circuit pattern forming method, and purification method | Patent Number 10364314

US 10364314 B2
Application Number15746107
Publication NumberUS 20180208703 A1
Pendency3 years, 15 days
Filled DateJul 15, 2016
Priority DateJul 15, 2016
Publication DateJul 26, 2018
Expiration DateJul 30, 2023
Inventor/ApplicantsJunya Horiuchi
Kana OKADA
Takashi MAKINOSHIMA
Junya HORIUCHI
Masatoshi Echigo
Takashi Makinoshima
Kana Okada
Masatoshi ECHIGO
ExaminesJANG, BO BIN
Art Unit2894
Technology Center2800
Assignments
Mitsubishi Gaschemical Company Inc.
Current
Mitsubishi Gaschemical Company Inc.Mitsubishi Electric Corporation
Original
Law Firm
You must be logged in to view
Login
Attorneys
Subscription-Only
View Concierge Program
Patent Prosecution report image

Empower your practice with Patexia Publication Prosecution IP Module.

Get access to our exclusive rankings and unlock powerful data.
Check our Latest ReportPurchase IP Module

Looking for a Publication Attorney?

Get in touch with our team or create your account to start exploring a network of over 120K attorneys.