Routing under bond pad for the replacement of an interconnect layer | Patent Number 08319343
US 08319343 B2Filled DateSep 5, 2006
Priority DateSep 21, 2005
Publication DateMar 22, 2007
Expiration DateSep 20, 2025
Inventor/ApplicantsSeung H. Kang
Michael C. Ayukawa
Vance D. Archer
Taeho Kook
Sailesh M. Merchant
Daniel P. Chesire
Vance D. Archer, III
Mark A. Bachman
Kurt G. Steiner
Michael C. Ayukawa
Vance D. Archer
Taeho Kook
Sailesh M. Merchant
Daniel P. Chesire
Vance D. Archer, III
Mark A. Bachman
Kurt G. Steiner
ExaminesNGUYEN, THINH T
Art Unit2897
Technology Center2800
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