Integrated circuit having structural support for a flip-chip interconnect pad and method therefor | Patent Number 07247552

US 07247552 B2
Application Number11033009
Publication NumberUS 20060154470 A1
Pendency2 years, 6 months, 14 days
Filled DateJan 11, 2005
Priority DateJan 11, 2005
Publication DateJul 13, 2006
Expiration DateJan 10, 2025
Inventor/ApplicantsEdward O. Travis
David G. Wontor
Pak K. Leung
Jie-Hua Zhao
Kevin J. Hess
Scott K. Pozder
Brett P. Wilkerson
ExaminesSARKAR, ASOK K
Art Unit2891
Technology Center2800
Assignments
Morgan Stanley Senior Funding Inc.
Current
Freescale Semiconductor Inc.Nxp Semiconductors
Original
Law Firm
You must be logged in to view
Login
Attorneys
Subscription-Only
View Concierge Program
Patent Prosecution report image

Empower your practice with Patexia Publication Prosecution IP Module.

Get access to our exclusive rankings and unlock powerful data.
Check our Latest ReportPurchase IP Module

Looking for a Publication Attorney?

Get in touch with our team or create your account to start exploring a network of over 120K attorneys.