Method for chemical/mechanical planarization of a semiconductor wafer having dissimilar metal pattern densities | Patent Number 06596639

US 06596639 B1
Application Number9415529
Publication Number-
Pendency3 years, 9 months, 18 days
Filled DateOct 8, 1999
Priority DateOct 8, 1999
Publication Date-
Expiration DateOct 8, 2019
Inventor/ApplicantsSudhanshu Misra
Vivek Saxena
William G. Easter
ExaminesPIZARRO CRESPO, MARCOS D
Art Unit2814
Technology Center2800
Assignments
Agere Systems Broadcom
Current
Agere Systems BroadcomBroadcom
Original
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