Method of epitaxial-like wafer bonding at low temperature and bonded structure | Patent Number 06563133

US 06563133 B1
Application Number9635272
Publication Number-
Pendency2 years, 9 months, 7 days
Filled DateAug 9, 2000
Priority DateAug 9, 2000
Publication Date-
Expiration DateAug 9, 2020
Inventor/ApplicantsQin-Yi Tong
ExaminesDIAZ, JOSE R
Art Unit2815
Technology Center2800
Assignments
Bank Of America Corporation
Current
Ziptronix
Original
Law Firm
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