Thin form factor flip chip ball grid array | Patent Number 06441499

US 06441499 B1
Application Number9651308
Publication Number-
Pendency1 year, 12 months, 2 days
Filled DateAug 30, 2000
Priority DateAug 30, 2000
Publication Date-
Expiration DateAug 30, 2020
Inventor/ApplicantsSarathy Rajagopalan
Kumar Nagarajan
ExaminesHA, NATHAN W
Art Unit2814
Technology Center2800
Assignments
Hilco Patent Acquisition 55 Llc
Current
Bellnorthern Research
Current
Bell Semiconductor Llc
Current
Lsi Logic Corporation
Original
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