Planarized semiconductor interconnect topography and method for polishing a metal layer to form interconnect | Patent Number 06232231
US 06232231 NAFilled DateAug 31, 1998
Priority DateAug 31, 1998
Publication Date-
Expiration DateAug 31, 2018
Inventor/Applicants Anantha R. Sethuraman
Christopher A. Seams
Christopher A. Seams
ExaminesLEE, HSIEN MING
Art Unit2823
Technology Center2800
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