Semiconductor device having multiple overlapping rows of bond pads with conductive interconnects and method of pad placement | Patent Number 05962926

US 05962926 NA
Application Number8940605
Publication Number-
Pendency2 years, 5 days
Filled DateSep 30, 1997
Priority DateSep 30, 1997
Publication Date-
Expiration DateSep 30, 2017
Inventor/Applicants Laxminarayan Sharma
Ashok Srikantappa
Victor Manuel Torres
ExaminesCLARK, JASMINE JHIHAN B
Art Unit2815
Technology Center2800
Assignments
Morgan Stanley Senior Funding Inc.
Current
Motorola Solutions Inc.
Original
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