Package structure and fabricating method thereof | Patent Application Number 18327076

18327076
Not Appealed
Patent NumberUS 12165992 B2
Publication NumberUS 20230307382 A1
Filled DateJun 1, 2023
Priority DateMar 27, 2020
Inventor/ApplicantsSung-Hui Huang
Shang-Yun Hou
Kuan-Yu Huang
Examines-
Art Unit0
Technology Center0
Assignments
Taiwan Semiconductor Manufacturing Company
Current
Taiwan Semiconductor Manufacturing Company
Original
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