Semiconductor structure and method of wafer bonding | Patent Application Number 18136329

18136329
Not Appealed
Patent NumberUS 12080622 B2
Publication NumberUS 20230268246 A1
Filled DateApr 18, 2023
Priority DateJul 9, 2020
Inventor/ApplicantsChee Hau Ng
Purakh Raj Verma
Chia-Liang Liao
Ching-Yang Wen
ExaminesLEBENTRITT, MICHAEL
Art Unit2829
Technology Center2800
Assignments
United Microelectronics Corporation
Current
United Microelectronics Corporation
Original
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