Electronic device package and fabricating method thereof | Patent Application Number 17837702

17837702
Not Appealed
Patent NumberUS 11961867 B2
Publication NumberUS 20220375985 A1
Filled DateJun 10, 2022
Priority DateNov 18, 2013
Inventor/ApplicantsSung Kyu Kim
Se Woong Cha
No Sun Park
Seung Jae Lee
Ju Hoon Yoon
Yoon Joo Kim
Jin Young Kim
ExaminesMANDALA, VICTOR A
Art Unit2899
Technology Center2800
Assignments
Amkor Technology
Current
Amkor Technology
Original
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