Package and method of manufacturing the same | Patent Application Number 17377419

17377419
Not Appealed
Patent NumberUS 12165966 B2
Publication NumberUS 20230013491 A1
Filled DateJul 16, 2021
Priority DateJul 16, 2021
Inventor/ApplicantsMeng-Che Tu
Hung-Jui Kuo
Sih-Hao Liao
Yu-Hsiang Hu
ExaminesNGUYEN, THANH T
Art Unit2893
Technology Center2800
Assignments
Taiwan Semiconductor Manufacturing Company
Current
Taiwan Semiconductor Manufacturing Company
Original
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