Method for Flip-Chip Bonding Using Copper Pillars | Patent Application Number 14190659

14190659
Not Appealed
Patent Number-
Publication NumberUS 20150243617 A1
Filled DateFeb 26, 2014
Priority DateFeb 26, 2014
Inventor/Applicants
ExaminesTRINH, HOA B
Art Unit2817
Technology Center2800
Assignments
Agere Systems Broadcom
Current
Lsi Broadcom
Current
Lsi BroadcomBroadcom
Original
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