Local interconnect structures for high density | Patent Application Number 13829864

13829864
Not Appealed
Patent NumberUS 09024418 B2
Publication NumberUS 20140264629 A1
Filled DateMar 14, 2013
Priority DateMar 14, 2013
Inventor/ApplicantsGiridhar Nallapati
PR Chidambaram
John Jianhong Zhu
ExaminesPATTON, PAUL E
Art Unit2822
Technology Center2800
Assignments
Qualcomm Technologies Inc.
Current
Qualcomm Technologies Inc.
Original
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