Substrate structure for an image sensor package and method for manufacturing the same | Patent Application Number 11131727
11131727
Not Appealed
Patent NumberUS 08314481 B2
Publication NumberUS 20060275943 A1
Filled DateMay 18, 2005
Priority DateMay 18, 2005
Inventor/ApplicantsKevin Chang
Chief Lin
Yves Huang
Chung Hsien Hsin
Chief Lin
Yves Huang
Chung Hsien Hsin
ExaminesTRAN, THANH Y
Art Unit2829
Technology Center2800
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