Diamond thin film thermal performance breakthrough could expand semiconductor limits

Two new studies performed at the US Department of Energy’s Argonne National Laboratory have revealed a new pathway for materials scientists to use previously unexplored properties of nanocrystalline-diamond thin films. While the properties of diamond thin films are relatively well-understood, the new discovery could dramatically improve the performance of certain types of integrated circuits by reducing their 'thermal budget.' By using a new technique that altered the deposition process of the diamond films, Sumant and his colleagues at Argonne’s Center for Nanoscale Materials were able to both reduce the temperature to close to 400 degrees Celsius and to tune the thermal properties of the diamond films by controlling their grain size. This permitted the eventual combination of the diamond with two other important materials: graphene and gallium nitride.