302 may be one or more general processors, digital signal processors, application specific integrated circuits, field programmable gate arrays, servers, networks, digital circuits, analog circuits, combinations thereof, or other now known or later developed devices for analyzing and processing data. The processor 302 may implement a software program, such as code generated manually (i.e., programmed).

The controller 300 may include a memory 304 that may communicate via a bus 308. The memory 304 may be a main memory, a static memory, or a dynamic memory. The memory 304 may include, but is not limited to computer readable storage media such as various types of volatile and non-volatile storage media, including but not limited to random access memory, read-only memory, programmable read-only memory, electrically programmable read-only memory, electrically erasable read-only memory, flash memory, magnetic tape or disk, optical media and the like. In one implementation, the memory 304 includes a cache or random-access memory for the processor 302. In alternative implementations, the memory 304 is separate from the processor 302, such as a cache memory of a processor, the system memory, or other memory. The memory 304 may be an external storage device or database for storing data. Examples include a hard drive, compact disc (“CD”), digital video disc (“DVD”), memory card, memory stick, floppy disc, universal serial bus (“USB”) memory device, or any other device operative to store data. The memory 304 is operable to store instructions executable by the processor 302. The functions, acts or tasks illustrated in the figures or described herein may be performed by the processor 302 executing the instructions stored in the memory 304. The functions, acts or tasks are independent of the particular type of instructions set, storage media, processor or processing strategy and may be performed by software, hardware, integrated circuits, firmware, micro-code and the like, operating alone or in combination. Likewise, processing strategies may include multiprocessing, multitasking, parallel processing and the like.

As depicted, the controller 300 may further include a display 310, such as a liquid crystal display (LCD), an organic light emitting diode (OLED), a flat panel display, a solid-state display, a cathode ray tube (CRT), a projector, a printer or other now known or later developed display device for outputting determined information. The display 310 may act as an interface for the user to see the functioning of the processor 302, or specifically as an interface with the software stored in the memory 304 or in the drive unit 306.

Additionally or alternatively, the controller 300 may include an input device 312 configured to allow a user to interact with any of the components of controller 300. The input device 312 may be a number pad, a keyboard, or a cursor control device, such as a mouse, or a joystick, touch screen display, remote control, or any other device operative to interact with the controller 300.

The controller 300 may also or alternatively include drive unit 306 implemented as a disk or optical drive. The drive unit 306 may include a computer-readable medium 322 in which one or more sets of instructions 324, e.g. software, may be embedded. Further, the instructions 324 may embody one or more of the methods or logic as described herein. The instructions 324 may reside completely or partially within the memory 304 and/or within the processor 302 during execution by the controller 300. The memory 304 and the processor 302 also may include computer-readable media as discussed above.

In some systems, a computer-readable medium 322 includes instructions 324 or receives and executes instructions 324 responsive to a propagated signal so that a device connected to a network 370 may communicate voice, video, audio, images, or any other data over the network 370. Further, the instructions 324 may be transmitted or received over the network 370 via a communication port or interface 320, and/or using a bus 308. The communication port or interface 320 may be a part of the processor 302 or may be a separate component. The communication port or interface 320 may be created in software or may be a physical connection in hardware. The communication port or interface 320 may be configured to connect with a network 370, external media, the display 310, or any other components in controller 300, or combinations thereof. The connection with the network 370 may be a physical connection, such as a wired Ethernet connection or may be established wirelessly as discussed below. Likewise, the additional connections with other components of the controller 300 may be physical connections or may be established wirelessly. The network 370 may alternatively be directly connected to a bus 308.

While the computer-readable medium 322 is shown to be a single medium, the term “computer-readable medium” may include a single medium or multiple media, such as a centralized or distributed database, and/or associated caches and servers that store one or more sets of instructions. The term “computer-readable medium” may also include any medium that is capable of storing, encoding, or carrying a set of instructions for execution by a processor or that cause a computer system to perform any one or more of the methods or operations disclosed herein. The computer-readable medium 322 may be non-transitory and may be tangible.

The computer-readable medium 322 may include a solid-state memory such as a memory card or other package that houses one or more non-volatile read-only memories. The computer-readable medium 322 may be a random-access memory or other volatile re-writable memory. Additionally or alternatively, the computer-readable medium 322 may include a magneto-optical or optical medium, such as a disk or tapes or other storage device to capture carrier wave signals such as a signal communicated over a transmission medium. A digital file attachment to an e-mail or other self-contained information archive or set of archives may be considered a distribution medium that is a tangible storage medium. Accordingly, the disclosure is considered to include any one or more of a computer-readable medium or a distribution medium and other equivalents and successor media, in which data or instructions may be stored.

In an alternative implementation, dedicated hardware implementations, such as application specific integrated circuits, programmable logic arrays and other hardware devices, may be constructed to implement one or more of the methods described herein. Applications that may include the apparatus and systems of various implementations may broadly include a variety of electronic and computer systems. One or more implementations described herein may implement functions using two or more specific interconnected hardware modules or devices with related control and data signals that may be communicated between and through the modules, or as portions of an application-specific integrated circuit. Accordingly, the present system encompasses software, firmware, and hardware implementations.

The controller 300 may be connected to a network 370. The network 370 may define one or more networks including wired or wireless networks. The wireless network may be a cellular telephone network, an 802.11, 802.16, 802.20, or WiMAX network. Further, such networks may include a public network, such as the Internet, a private network, such as an intranet, or combinations thereof, and may utilize a variety of networking protocols now available or later developed including, but not limited to TCP/IP based networking protocols. The network 370 may include wide area networks (WAN), such as the Internet, local area networks (LAN), campus area networks, metropolitan area networks, a direct connection such as through a Universal Serial Bus (USB) port, or any other networks that may allow for data communication. The network 370 may be configured to couple one computing device to another computing device to enable communication of data between the devices. The network 370 may generally be enabled to employ any form of machine-readable media for communicating information from one device to another. The network 370 may include communication methods by which information may travel between computing devices. The network 370 may be divided into sub-networks. The sub-networks may allow access to all of the other components connected thereto or the sub-networks may restrict access between the components. The network 370 may be regarded as a public or private network connection and may include, for example, a virtual private network or an encryption or other security mechanism employed over the public Internet, or the like.

In accordance with various implementations of the present disclosure, the methods described herein may be implemented by software programs executable by a computer system. Further, in an exemplary, non-limited implementation, implementations may include distributed processing, component/object distributed processing, and parallel processing. Alternatively, virtual computer system processing may be constructed to implement one or more of the methods or functionality as described herein.

Although the present specification describes components and functions that may be implemented in particular implementations with reference to particular standards and protocols, the disclosure is not limited to such standards and protocols. For example, standards for Internet and other packet switched network transmission (e.g., TCP/IP, UDP/IP, HTML, and HTTP) represent examples of the state of the art. Such standards are periodically superseded by faster or more efficient equivalents having essentially the same functions. Accordingly, replacement standards and protocols having the same or similar functions as those disclosed herein are considered equivalents thereof.

It will be understood that the steps of methods discussed are performed in one embodiment by an appropriate processor (or processors) of a processing (i.e., computer) system executing instructions (computer-readable code) stored in storage. It will also be understood that the disclosure is not limited to any particular implementation or programming technique and that the disclosure may be implemented using any appropriate techniques for implementing the functionality described herein. The disclosure is not limited to any particular programming language or operating system.

As mentioned above, certain aspects relate to improved inverters and power modules that reduce parasitic inductance and improve performance relative to existing systems. FIGS. 4-13 discuss examples of these improved inverters.

FIG. 4 depicts an exemplary power module package 400, according to one or more embodiments. Power module package 400 may include AC power tab 406, negative DC power tab 408, positive DC power tab 410, and negative DC power tab 412. In some cases, one or more of these tabs may be connected to a power rail. For instance, negative DC power tab 408 and negative DC power tab 412 may be interconnected internally (e.g. using a negative DC power rail), and positive DC power tab 410 may be connected to a positive DC power rail.

In the example depicted, one or more phase switches implemented on one or more dies within power module package 400 perform the DC to AC power conversion. The phase switches may be used to apply pulse width modulated voltage in controlling the output voltage, which in turn may be applied to inductive loads such as motors. The dies may be divided into two or more current pathways on a DC-side of the power module (not considering the output AC side). The pathways may be connected in such a manner that a length of a first pathway between the negative DC power tab 408 and positive DC power tab 410 is equal or approximately equal to a length of a second pathway between negative DC power tab 412 and positive DC power tab 410.

In an example, power module package 400 receives DC power, from a voltage source, via negative DC power tab 408, positive DC power tab 410, and negative DC power tab 412. In turn, the phase switches convert the DC power to AC power and power module package 400 outputs the AC power to AC power tab 406. In some cases, one or more of negative DC power tab 408, positive DC power tab 410, and negative DC power tab 412 may be connected to a bulk capacitor.

As further discussed herein, power module package 400 may include one or more substrates, metal spacers, metal layers, dielectrics, and so forth. For instance, the phase switches may be mounted on the substrates, and connect with each other and/or the inputs and outputs via the metal layers and metal spacers. As depicted, one or more layers of power module package 400 are divided into two sections 402 and 404. But other divisions are possible.

Power module package 400 may have one or more associated control pins or tabs. For example, by applying voltages to one or more of the associated control pins, an operation of the phase switches within power module package 400 may be adjusted. For instance, parameters of the phase switches may be adjusted such as switching frequency, PWM width, output voltage, and so forth. Further, power module package 400 may include one or more temperature pins that output signals from one or more temperature sensors positioned within power module package.

FIG. 5 depicts an exemplary power module package 500, according to one or more embodiments. Power module package 500 may include sections 502 and 504, positive DC power tab 508, negative DC power tab 510, positive DC power tab 512, and AC power tab 406.

As depicted, power module package 500 includes two positive DC tabs and one negative DC tab, as compared to power module package 400 which includes two negative DC tabs and one positive DC power tab. Power module package 500 also has symmetrical current paths, but operates with a reverse signal flow as compared to power module package 400.

In the example depicted, one or more phase switches within power module package 500 receive DC power via positive DC power tab 508, negative DC power tab 510, and positive DC power tab 512. In turn, the phase switches convert the DC power to AC power. Power module package 500 outputs the AC power to AC power tab 506. In some cases, one or more of these tabs may be connected to a bulk capacitor.

FIG. 6 depicts various layers of an exemplary power module package 600, according to one or more embodiments. As depicted, power module package 600 includes various layers, each of which may perform one or more specific functions, as further discussed herein.

The power modules described herein such as power module package 600 may leverage various technologies such as “flex on substrate” (FoS). A substrate is a non-conductive material that provides mechanical support and electrical insulation for the components and conductive traces. FoS may allow a full use of the source thermal path by using openings in a dielectric to directly make a connection to the bottom substrate and may employ thin layers of polyimide routed under a die to make gate connections without interference with source connections. Disclosed power modules may also leverage features such as overmolded exteriors, as well as various features such as electrically conductive metal spacers, vias, and surface mounted thermistors.

Power module package 600 depicts an exploded view of the layers without the optional over molding surrounding, e.g., extending around an outer surface of, the package. Power module package 600 includes DC tabs 602, die 604, metal spacers 606, top exterior substrate 608, top ceramic 610, source substrate 612 with second metal layer, AC lead and signal pins 614, and base substrate 616, bottom ceramic 618, and bottom exterior substrate 620. Examples of suitable dies include, but are not limited to, Silicon Carbide (SiC) metal-oxide-semiconductor field-effect (MOSFET) dies, insulated-gate bipolar transistor (IGBT) dies, and Silicon (Si) MOSFET dies. Examples of top ceramics 610 and bottom ceramics 618 include, but are not limited to, Silicon Nitride ceramics.

Inverter package 600 may include various tabs for connections to external devices. For example, DC tabs 602 include leads such as negative DC power tab 408, positive DC power tab 410, and negative DC power tab 412, as depicted in FIG. 4. Power module package 600 may an include AC lead and signal pins 614.

Power module package 600 may include one or more SiC MOSFET dies 604. Using silicon carbide transistors may result in reduced the switching times relative to, for example, some silicon insulated gate bipolar transistors (Si IGBT).

Power module package 600 may include one or more metal spacers 606. As discussed, metal spacers conduct electricity between the various layers. Exemplary current flow using spacers is discussed further with respect to FIGS. 8 and 10.

Metal spacers 606 provide substrate-to-substrate connections and may resolve assembly challenges including heat and current paths. The metal spacers 606 may be formed of copper, for example, or another electrically and/or thermally conductive material. The metal spacers may provide a connection between a first substrate and a second substrate, thereby conducting current between substrates. In an example, a metal spacer is approximately 2 mm by approximately 2 mm, and may have a thickness similar to that of a die, such as approximately 180 μm, for example. The metal spacers may be surface mount components and placed along with SiC MOSFETS using a same process. The metal spacers may replace wires and clips that some systems may use, and die interconnects may allow the gate, drain, and source to be connected to the same substrate.

In an aspect, power module package 600 may include one or more surface-mount components such as, for example, a temperature sensor, thermistor, capacitor, resistor, or another integrated circuit (IC), such as a gate driver, etc. For example, a temperature measurement from a thermistors may be provided to controller 300. In turn, controller 300 may take one or more actions such as adjusting current, changing winding configuration, sending an alert, and so forth.

Power module package 600 may include one or more substrates such as top exterior substrate 608, source substrate 612, Base substrate 616, and bottom exterior substrate 620. Source substrate 612 may have a metal layer. But other substrates are possible. The substrates used within power module package 600 may have a thermally conductive interface to both sides of a SiC die. In an example, sources are connected to the underlying plane while the gate interconnect is to the flex circuit on second metal. The drains may be connected to the opposing substrate plane. Interconnect may be done with soldering or sintering.

Power module package 600 may include one or more ceramic layers. As depicted, power module package 600 includes top ceramic 610 and bottom ceramic 618.

In some devices, having components placed on both a top and a bottom of a substrate, during assembly, the two substrates must be joined, face-to-face, such that necessary electrical connections between the components on the top substrate and bottom substrate are made. For example, connections between gates may be only 1 millimeter by 1 millimeter, requiring precise alignment of the top substrate and bottom substrate. Improper registration during assembly may lead to production loss and higher costs. Therefore, the power module assembled may provide all components placed on a substrate, thereby avoiding issues of improper registration during assembly when a top substrate is joined to a bottom substrate.

FIG. 7 depicts an exemplary power module package 700, according to one or more embodiments. Power module package 700 includes molding 720, heatsink contact area 730, and heatsink contact area 732. As depicted, power module package 700 may also include various voltage and signal tabs. Molding 720 serves to protect the power module package in harsh or rugged environments such as electric vehicles. Further, power module package 700 includes heatsink contact areas 730 and 732, which facilitate cooling on both sides of the package.

FIG. 8 depicts an exemplary current flow within a power module package 800, according to one or more embodiments. Power module package 800 includes AC tab 806; negative DC power tab 808; positive DC power tab 810; negative DC power tab 812; and phase switch groups 820, 822, 824, and 826. Power module package 800 uses a drain down configuration with second metal layer for symmetric gate signal routing.

In the example depicted, phase switch groups 820, 822, 824, and 826 receive DC input from negative DC power tab 808, positive DC power tab 810, and negative DC power tab 812, convert the DC voltages into an AC voltage according to parameters set by various control signal pins, and output the AC voltage to AC tab 806.

As depicted, phase switch group 820 is located near or adjacent to negative DC power tab 808. Phase switch group 822 and phase switch group 824 are located near or adjacent to positive DC power tab 810. Phase switch group 826 is located near or adjacent to negative DC power tab 812. In some cases, phase switch groups 822 and 824 may be a single group of phase switches.

The phase switch groups facilitate an exemplary current flow on a DC-side of the power module (not considering the AC side). For example, the current may flow from positive DC power tab 810 to negative DC power tabs 808 and 812. For example, a first flow is shown between positive DC power tab 810, through path 830, path 832, spacer 834, path 836, path 838, and to negative DC power tab 808. A second flow is shown between positive DC power tab 810, through path 830, path 842, spacer 844, path 846, path 848, and to the negative DC power tab 812.

In an example, current from positive DC power tab 810 flows into the power module at path 830, through one or more phase switches within phase switch group 822, and is split into two paths, path 832 and 842. Continuing the example, current flows at via path 832, through spacer 834, to another layer of substrate, and continues via path