100 is two separate components that are secured together using mechanical couplings. For example, the electronics sub-housing 108 can have first threads that mate with second threads of the sensor sub-housing 110. That is, a bottom portion of the electronics sub-housing 108 can be screwed onto a threaded region at a top end of the sensor sub-housing 110. In at least one embodiment, the wireless multimodal soil sensor device 100 includes i) a first temperature sensor, a first relative humidity (Rh) sensor, and an illuminance sensor located in the first portion 104, ii) a second temperature sensor and a first electrical conductivity (EC) sensor located in the second portion 106 at the first distance 128 from a bottom of the elongated housing, and iii) a third temperature sensor, a second EC sensor, and a pH sensor located in the second portion 106 at the second distance 130 from the bottom of the elongated housing.

In a further embodiment, the wireless multimodal soil sensor device 100 includes a first capacitive moisture sensor located in the second portion 106 between the first distance 128 and the first portion 104, and a second capacitive moisture sensor located in the second portion 106 between the first distance 128 and the second distance 130.

In at least one embodiment, the elongated housing 102 of the wireless multimodal soil sensor device 100 includes a probe housing having first threads at a first end and an electronics housing having second threads to mechanically couple with the first threads. The wireless communications component is located within the electronics housing. The probe housing includes a stem shape to be placed in soil at a second end opposite the first end. One or more multimodal soil sensors are placed in the probe housing.

In at least one embodiment, the electronics sub-housing 108 includes a memory device operatively coupled to the processing device 114. The memory component can be a component or subsystem within the wireless multimodal soil sensor device 100 used to store data or instructions for processing. The memory device can retain the operational information and processed data of wireless multimodal soil sensor device 100. The memory device can be volatile or non-volatile memory. The memory device can store the measurement data and instructions of an agronomy engine (or an agronomy application). The instructions of the agronomy engine, when executed by the processing device 114, cause the processing device 114 to identify at least one farming action to be performed based on the measurement data. In at least one embodiment, the agronomy engine can host one or more AI/ML models trained to predict localized farm parameters of at least a portion of a farm. In at least one embodiment, the agronomy engine can use one or more threshold-based processes or algorithms to predict or determine localized farm parameters of at least a portion of a farm (or indoor house plants, lawns, gardens, etc.). The localized farm parameters can include soil nutrients, GDD, irrigation conditions, pest and disease conditions, or the like.

FIG. 2A-FIG. 2B are block diagrams of multimodal soil sensor device with dual-purpose antennas according to at least one embodiment. The multimodal soil sensor device 200 of FIG. 2A includes an external top housing 202 and an external bottom housing 204. When the multimodal soil sensor device 200 is placed in the soil, the external top housing 202 is located above the soil, and the external bottom housing 204 is located below the soil. The multimodal soil sensor device 200 includes a printed circuit board (PCB) 206 with a first antenna and some of the electronics, such as the batter, the wireless module, a temperature sensor, a light sensor, or the like. The PCB with first antenna 206 can be located in the external top housing 202. The multimodal soil sensor device 200 include sensing elements with a second antenna 208. The sensing elements with second antenna 208 can be located in the external bottom housing 204.

The multimodal soil sensor device 210 of FIG. 2B is similar to multimodal soil sensor device 200 as noted by similar reference numbers, except the multimodal soil sensor device 210 includes an external housing 212 that has a different shape than the external top housing 202. As similar to multimodal soil sensor device 200, the multimodal soil sensor device 210 includes PCB with first antenna 206 and sensing elements with second antenna 208.

As illustrated in FIG. 2A and FIG. 2B, the PCB with first antenna 206 can use the external top housing 202 (or external housing 212) as a main resonant arm and the external bottom housing 204, below the soil, as a ground leg to radiate electromagnetic energy to communicate measurement data with another device. This can help in provide a smaller antenna size with the ability to integrate in the small form factor and provide better antenna radiation as the ground leg is buried under the soil. FIG. 2A and FIG. 2B show two different industrial designs (ID 1 and ID 2). In both ID 1 and ID 2, there is a portion of an external top housing 202 (or external housing 212) (above soil) with the PCB. As described above, the PCB can include the battery, the wireless module and the first antenna (antenna 1). The PCB can also include some of the sensors described herein to obtain measurements above the soil. In both IDS 1 and ID 2, there is another portion of the external housing, namely the external bottom housing 204 (below soil) with the sensing elements and the second antenna (antenna 2). The first and second antennas (or respective antenna elements) can be used for radiating electromagnetic energy to communicate measurement data with another device. The first and second antennas (or respective antenna elements) can be used for sensing water flow as described below.

As illustrated in FIGS. 2A and 2B, the first antenna 1 is placed above ground and the second antenna 2 is placed inside the soil. Using a change in impedance and isolation between the two antennas, the first and second antennas can be used to identify whether water is flowing. A processing device disposed on the PCB can measure a change in impedance and isolation between the first antenna 1 and the second antenna 2 and determine whether water is flowing.

In some embodiments, the PCB in the external top housing 202 (or external housing 212) above ground can have a light sensing element (like ambient light sensor, spectroradiometer, etc.). Using the light sensor, the multimodal soil sensor device 200 (or multimodal soil sensor device 210) can measure a greenness level of the vegetation above the ground level and calculate the Normalized Difference Vegetation Index (NDVI) of the plant.

Examples of the external bottom housing 204 are illustrated in FIG. 3A, FIG. 3B, FIG. 4A, FIG. 4B, FIG. 5, and FIG. 6. Examples of the external top housing 202 or external housing 212 are illustrated in FIG. 5 and FIG. 6.

FIG. 3A is a perspective view of an external bottom housing 300 of a wireless multimodal soil sensor device according to at least one embodiment. The external bottom housing 300 can be the second portion 106 of FIG. 1. As described above with respect to the second portion 106, the external bottom housing 300 can be a stem or have a stem shape where the multimodal soil sensors are integrated into the stem that is placed in the soil. The external bottom housing 300 can be a cylindrical housing with a main body 302, a collar 304, and a neck 306, the collar 304 representing a ground level indicator. In at least one embodiment, some of the multimodal soil sensors 122 can be integrated into a main body 302 below the collar 304 for in-ground measurements, and some of the multimodal soil sensors 122 can be integrated into the neck 306 for above-ground measurements.

As described above, the external bottom housing 300 includes the main body 302, the collar 304, and the neck 306. One or more sensor probes can be disposed in the main body 302 or the neck 306. As illustrated, for example, the external bottom housing 300 includes a first sensor probe 308 located at a first distance from the collar 304, and a second sensor probe 310 located at a second distance from the collar 304, the second distance being greater than the first distance. A third sensor probe 312 is located in the neck 306 above the collar 304. It should be noted that sensor probe 312 can be located above ground and does not have to be close to the soil surface. The sensor probe 312 can be at a height depending on a length of the stem for the radio module. As described herein, one or more capacitive moisture sensors can be disposed in the main body 302, where the main body 302 is placed in the soil. As illustrated, for example, the external bottom housing 300 include a first capacitive moisture sensor 314 located between the first distance at the collar 304, and a second capacitive moisture sensor 316 located between the first distance and the second distance.

In at least one embodiment, the first sensor probe 308 includes an EC sensor and a temperature sensor, such as illustrated in FIG. 3B. In at least one embodiment, the second sensor probe 310 includes an EC sensor, a pH sensor, and a temperature sensor, such as illustrated in FIG. 3B. In at least one embodiment, the third sensor probe 312 includes a relative humidity (Rh) sensor and a temperature sensor, such as illustrated in FIG. 3B. Alternatively, the external bottom housing 300 can include more or less sensor probes than illustrated in FIG. 3A-FIG. 3B. Also, different sensing modalities can be implemented at the different sensor probes in the external bottom housing 300.

The sensor probes 308-312 can communicate measurement data to a processing device (e.g., processing device 114 or a wireless communications component (e.g., wireless communications component 112 of FIG. 1) over an interconnect 318, similar to the interconnect 132 described above with respect to FIG. 1. In this embodiment, the interconnect 318 includes a flexible cable that connects the probe sensors sensor probes 308, 310, 312, and the first capacitive moisture sensors 314 and 316 to electronics in the first portion 104 (e.g., first portion 104 of elongated housing 102 or external top housing 202 of FIG. 2A and FIG. 2B).

FIG. 3B is a side view of the external bottom housing 300 of FIG. 3A according to at least one embodiment. As illustrated in FIG. 3B, the external bottom housing 300 can have specific dimensions and the one or more probe sensors can be located at specific lengths, corresponding to specific depths in the soil. Although FIG. 3B identifies some example dimensions, the external bottom housing 300 can have varying dimensions. For example, the first sensor probe 308 is located at 6 inches from the collar 304 and the second sensor probe 310 is located at 12 inches from the collar 304. Alternatively, the sensor probes can be located at different distances.

As illustrated in FIG. 3B, the neck 306 can include threads and one or more O-rings to couple the external bottom housing 300 to an external top housing (e.g., first portion 104 of elongated housing 102 or external top housing 202 of FIG. 2A and FIG. 2B).

FIG. 4A is a side view of an inner carrier 402 of an external bottom housing 400 according to at least one embodiment. The external bottom housing 400 can be the second portion 106 of FIG. 1. As described above with respect to the second portion 106, the external bottom housing 400 can be a stem or have a stem shape where the multimodal soil sensors are integrated into the stem that is placed in the soil. The external bottom housing 400 can have an inner carrier 402 (illustrated in FIG. 4A) and an outer casing 406 (illustrated in FIG. 4B). The external bottom housing 400 can be a cylindrical housing with a main body 404, a collar 408, and a neck 410, the collar 408 representing a ground level indicator. In at least one embodiment, some of the multimodal soil sensors 122 can be integrated into the inner carrier 402 below the collar 408 for in-ground measurements, and some of the multimodal soil sensors 122 can be integrated into the neck 410 for above-ground measurements.

As described above, the external bottom housing 400 includes the main body 404, the collar 408, and the neck 410. One or more sensor probes can be disposed in the main body 404 or the neck 410. As illustrated, for example, the inner carrier 402 includes a first sensor probe 412 located at a first distance from the collar 408, a second sensor probe 414 located at a second distance from the collar 408, the second distance being greater than the first distance, and a third sensor probe 416 located at a third distance from the collar 408, the third distance being greater than the second distance. A fourth sensor probe 418 is located in the neck 410 above the collar 408, when the outer casing 406 is placed over the inner carrier 402. The fourth sensor probe 418 can be located above ground and does not have to be close to the soil surface. The sensor probe 312 can be at a height depending on a length of the stem for the radio module. In another embodiment, one or more capacitive moisture sensors can be disposed in the main body 302.

In at least one embodiment, the first sensor probe 412 includes an EC sensor and a temperature sensor, such as illustrated in FIG. 4B. In at least one embodiment, the second sensor probe 414 includes an EC sensor and a temperature sensor, such as illustrated in FIG. 4B. In at least one embodiment, the third sensor probe 416 includes a pH sensor, such as illustrated in FIG. 4B. In at least one embodiment, the fourth sensor probe 418 includes a relative humidity (Rh) sensor and a temperature sensor, such as illustrated in FIG. 4B. Alternatively, the external bottom housing 400 can include more or less sensor probes than illustrated in FIG. 4A-FIG. 4B. Also, different sensing modalities can be implemented at the different sensor probes in the external bottom housing 400.

The sensor probes 412-418 can communicate measurement data to a processing device (e.g., processing device 114 or a wireless communications component (e.g., wireless communications component 112 of FIG. 1) over an interconnect 424, similar to the interconnect 132 described above with respect to FIG. 1. In this embodiment, the interconnect 424 includes two flexible cables that that connect the probe sensors sensor probes 412, 414, 416, and 418 to electronics in the first portion 104 (e.g., first portion 104 of elongated housing 102 or external top housing 202 of FIG. 2A and FIG. 2B).

As illustrated in FIG. 4A, the external bottom housing 400 includes a battery compartment to secure a battery. In at least one embodiment, the batter is coupled to the electronics via one of the flexible cables, such as to a power management sub-system on the main circuit board in the external top housing. In at least one embodiment, the external bottom housing 400 includes a sensor interface board 422. The sensor interface board 422 can include circuitry of the multimodal soil sensors that are connected to the sensor probes 412-418. The sensor interface board 422 can be coupled to the electronics via one of the flexible cables.

In at least one embodiment, the external bottom housing 400 is part of an electronic device. The electronic device can have an external housing with a first portion and a second portion. The first portion is disposed proximate a first end of the electronic device, and the second portion is disposed further from the first end than the first portion. The external bottom housing 400 is the second portion. In at least one embodiment, the battery 420 can be disposed at least partially within the inner carrier 402. Alternatively, the battery 420 can be disposed at least partially within the first portion. In at least one embodiment, the electronic device includes a first antenna and/or a wireless communications component disposed at least partially within the first portion. A second antenna can be disposed at least partially within the external bottom housing 400.

FIG. 4B is a side view of an outer casing 406 of the external bottom housing of FIG. 4A according to at least one embodiment. As illustrated in FIG. 4B, the outer casing 406 can cover the battery 420, the sensor interface board 422 and other circuitry within the inner carrier 402, where openings in the outer casing 406 can expose the probe sensors. The openings can have glass or plastic covering to protect the probe sensors from soil, water, or the like. As illustrated in FIG. 4B, the external bottom housing 400 can have specific dimensions and the one or more probe sensors can be located at specific lengths, corresponding to specific depths in the soil. Although FIG. 4B identifies some example dimensions, the external bottom housing 400 can have varying dimensions. For example, the first sensor probe 412 is located at 6 inches from the collar 408 and the second sensor probe 414 is located at approximately 10 inches from the collar 408. Alternatively, the sensor probes can be located at different distances.

As illustrated in FIG. 4A and FIG. 4B, the inner carrier 402 can include threads to couple the external bottom housing 400 to an external top housing (e.g., first portion 104 of elongated housing 102 or external top housing 202 of FIG. 2A and FIG. 2B).

FIG. 5 is a perspective view of a multimodal soil sensor device 500 according to at least one embodiment. The multimodal soil sensor device 500 is a prototype with a wireless module 502 secured to a top end of a stem 504 with one or more multimodal soil sensors. The wireless module 502 is a portion of the multimodal soil sensor device 500 that is located above soil when the multimodal soil sensor device 500 is placed in the soil. The stem 504 is the portion of the multimodal soil sensor device 500 that is located in the soil when the multimodal soil sensor device 500 is placed in the soil. The stem 504 can include different modality sensors at different depths of the stem 504, which is placed in the ground. In this embodiment, the wireless module 502 has an electronics housing that is secured to the stem 504 using mating threads. The stem 504 can include a collar as a ground level indicator. Also, as illustrated in FIG. 5, the multimodal soil sensor device 500 can include multiple capacitive moisture sensors.

FIG. 6 is a side view of a multimodal soil sensor device 600 with an external antenna coupled by an RF cable 604 according to at least one embodiment. The multimodal soil sensor device 600 is similar to the multimodal soil sensor device 500 as noted by similar reference numbers, except the multimodal soil sensor device 600 includes a wireless module 602. The wireless module 602 includes a wireless communications component contained within a housing and the RF cable 604 connects the wireless communications component to an external antenna (not illustrated in