141a and 142a.

In an exemplary embodiment, the extension portions 141 and 142 are arranged on the third and fourth surfaces 3 and 4 of the body 110 opposing in the second direction, and the plurality of lead electrodes 141a and 142a may be in contact with the internal electrodes 121 and 122 on the third and fourth surfaces 3 and 4 of the body 110. Accordingly, the internal electrodes 121 and 122 may not be in direct contact with the external electrodes 131 and 132 to be described below and may be in direct contact with the plurality of lead electrodes 141a and 142a.

The plurality of lead electrodes 141a and 142a may be in direct contact with the internal electrodes to play a role of securing electrical connectivity.

The plurality of lead electrodes 141a and 142a may include a conductive metal. The type of the conductive metal included in the plurality of lead electrodes 141a and 142a is not particularly limited, but in an exemplary embodiment, the plurality of lead electrodes 141a and 142a may include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

The plurality of via electrodes 141b and 142b may connect the plurality of lead electrodes 141a and 142a, and specifically, the plurality of via electrodes 141b and 142b may be arranged between a pair of lead electrodes adjacent to each other among the plurality of lead electrodes 141a and 142a.

The plurality of via electrodes 141b and 142b may include a conductive metal. The type of the conductive metal included in the plurality of via electrodes 141b and 142b is not particularly limited, but in an exemplary embodiment, the plurality of via electrodes 141b and 142b may include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

The insulating portions 141c and 142c may cover the plurality of lead electrodes 141a and 142a. Specifically, the insulating portions 141c and 142c may be arranged to fill a region between the plurality of lead electrodes 141a and 142a in which the plurality of via electrodes 141b and 142b are not formed and to cover the surfaces of the plurality of lead electrodes 141a and 142a. Accordingly, the moisture resistance reliability of the multilayer electronic component 100 may be secured.

The insulating portions 141c and 142c may include the same dielectric material as the dielectric layer 111, but are not limited thereto, and may include a material having excellent insulation or rigidity.

As an example of a method for forming the extension portions 141 and 142 on the body 110, a sheet for forming the extension portion formed by printing a plurality of lead electrode patterns on a ceramic sheet with another ceramic sheet interposed therebetween may be formed by compressing and sealing the sheet on the body 110 and then sintering the same. At this time, a formation region of the plurality of lead electrodes 141a and 142a may be adjusted by adjusting a printing region of the lead electrode patterns, and a separate ceramic sheet may be printed on the ceramic sheet on which the plurality of lead electrodes 141a and 142a are not formed. Meanwhile, the via electrodes 141b and 142b may be formed by forming a via hole through a laser drill or a perforator every time the lead electrode pattern is printed in two layers and applying a conductive paste to the via hole or filling the via hole with a conductive material using a method, such as plating. Meanwhile, the via electrodes 141b and 142b may also be formed by forming a via hole to penetrate through all of the plurality of lead electrode patterns after all of the plurality of lead electrode patterns are printed and then filling the via hole with a conductive material. In the related art, in order to minimize the proportion of the external electrodes in the entire multilayer ceramic capacitor and to minimize the region in which the external electrodes are exposed to the outside of the multilayer ceramic capacitor, there has been an attempt to introduce a structure in which a separate lead electrode is formed on the cross-section of the body in which one end of the internal electrode is exposed, the lead electrode is covered with a ceramic layer, and the lead electrode is exposed only on one surface in the thickness direction. In the case of having such a structure, the proportion of the external electrodes in the multilayer ceramic capacitor may be minimized and the moisture resistance reliability may be improved, but it may be difficult to sufficiently secure the electrical connectivity between the internal electrode and the lead electrode and the electrical connectivity between the lead electrode and the external electrode, which may result in a reduction in the ESR of the multilayer ceramic capacitor.

According to an exemplary embodiment in the present disclosure, since a plurality of lead electrodes are formed to be spaced apart from each other in the second direction, a contact area between the external electrodes 131 and 132 and the plurality of lead electrodes 141a and 142a may increase. Accordingly, the ESR of the multilayer electronic component 100 may be reduced.

According to an exemplary embodiment in the present disclosure, since the plurality of lead electrodes 141a and 142a are connected through the plurality of via electrodes 141b and 142b, the connectivity between the plurality of lead electrodes 141a and 142a may be secured and the total area of the plurality of lead electrodes 141a and 142a may increase. Accordingly, the ESR of the multilayer electronic component 100 may be reduced.

That is, according to an exemplary embodiment in the present disclosure, when the extension portions 141 and 142 include a plurality of lead electrodes 141a and 142a spaced apart from each other in the second direction and a plurality of via electrodes 141b and 142b connecting the plurality of lead electrodes 141a and 142a, the contact area between the external electrodes 131 and 132 and the plurality of lead electrodes 141a and 142a may increase, connectivity between the plurality of lead electrodes 141a and 142a may be secured, and the total area of the plurality of lead electrodes 141a and 142a may increase, so that the effect of reducing the ESR of the multilayer electronic component 100 may be remarkable.

In an exemplary embodiment, the plurality of lead electrodes 141a and 142a may be in contact with the external electrodes 131 and 132 on one surface of the extension portions 141 and 142 in the first direction. Through this, the proportion of the external electrodes 131 and 132 in the entire multilayer electronic component 100 may be minimized. At this time, the external electrodes 131 and 132 may be arranged only on one surface of the extension portions 141 and 142 in the first direction and may not be arranged on both surfaces of the extension portions 141 and 142 in the second direction and on both surfaces of the extension portions 141 and 142 in the third direction.

In an exemplary embodiment, one end of the plurality of lead electrodes 141aand 142a in the first direction may be exposed to one surface of the extension portions 141 and 142 in the first direction, and the other end of the plurality of lead electrodes 141a and 142a in the first direction may not be exposed to the other surface of the extension portions 141 and 142 in the first direction. Accordingly, the thickness of the multilayer electronic component 100 in the first direction may be minimized. Meanwhile, when the other end of the plurality of lead electrodes 141a and 142a in the first direction is not exposed to the other surface of the extension portions 141 and 142 in the first direction, the plurality of lead electrodes 141a and 142a may cover only a portion of each of the one surface and the other surface of the body 110 in the second direction. At this time, it is preferable that the plurality of lead electrodes 141a and 142a are arranged to cover the ends of the internal electrodes in the second direction, and portions not covered with the plurality of lead electrodes 141a and 142a may be covered with the insulating portions 141c and 142c.

In an exemplary embodiment, the plurality of via electrodes 141b and 142b may be arranged between a pair of lead electrodes adjacent to each other among the plurality of lead electrodes 141a and 142a, and diameters of the plurality of via electrodes 141b and 142b may have a maximum value on a surface in which the plurality of via electrodes 141b and 142b are in contact with the lead electrode disposed to be closer to the body 110 among the pair of lead electrodes adjacent to each other.

Referring to FIG. 6, a plurality of via electrodes 141b and 142b may be arranged between a pair of adjacent lead electrodes among the plurality of lead electrodes 141a and 142a. Specifically, a plurality of via electrodes 141b-1 may be arranged between a pair of adjacent lead electrodes 141a-1 and 141a-2, and a plurality of via electrodes 141b-2 may be arranged between a pair of adjacent lead electrodes 141a-2 and 141a-3. At this time, a diameter of the plurality of via electrodes 141b and 142b may have a maximum value on a surface in contact with an lead electrode disposed to be closer to the body 110 among the pair of adjacent lead electrodes. For example, the diameter of the plurality of via electrodes 141b-1 may be larger on a surface in which the plurality of via electrodes 141b-1 and the lead electrode 141a-1 contact each other than on a surface in which the plurality of via electrodes 141b-1 and the lead electrode 141a-2 contact each other, and the diameter of the plurality of via electrodes 141b-1 may have a maximum value on a surface in which the plurality of via electrodes 141b-1 and the lead electrode 141a-1 contact each other.

In an exemplary embodiment, in the cross-sections of the multilayer electronic component 100 in the first and second directions, the plurality of via electrodes 141b and 142b may have a trapezoidal shape. At this time, the two bottom sides of the trapezoid may be formed at the boundaries between the plurality of via electrodes 141b and 142b and the lead electrode 141a and 142a.

Meanwhile, referring to FIG. 6, the plurality of lead electrodes 141a may

include a first lead electrode 141a-1 in contact with the internal electrode 121, a second lead electrode 141a-2 spaced apart from the first lead electrode 141a-1 in the second direction, and a third lead electrode 141a-3 spaced apart from the second lead electrode 141a-2 in the second direction.

In FIG. 6, the plurality of lead electrodes 141a of the present disclosure are represented as three layers, but the number of lead electrodes 141a in the present disclosure is not limited to three.

At this time, the plurality of via electrodes 141b may include a first via electrode 141b-1 connecting the first lead electrode 141a-1 and the second lead electrode 141a-2 and a second via electrode 141b-2 connecting the second lead electrode 141a-2 and the third lead electrode 141a-3.

In an exemplary embodiment, at least a portion of the first via electrode 141b-1 and at least a portion of the second via electrode 141b-2 may overlap in position in the second direction. Accordingly, the connectivity between the plurality of lead electrodes 141a and 142a may be improved.

In an exemplary embodiment, the plurality of lead electrodes 141a and 142a may be arranged to pass both ends of the internal electrodes 121 and 122 in the first direction. Specifically, the plurality of lead electrodes 141a and 142a may be arranged to pass the end portion of the internal electrode exposed at an outermost portion in the first direction among the end portions of the internal electrodes exposed in the second direction. Accordingly, a sufficient contact area may be secured between the plurality of lead electrodes 141a and 142a and the internal electrodes 121 and 122.

Referring to FIG. 6, the maximum length of the extension portions 141 and 142 in the second direction is represented as LM, the maximum length of the plurality of lead electrodes 141a and 142a in the second direction is represented as LC, the maximum thickness of the extension portions 141 and 142 in the first direction is represented as TM, and the maximum thickness of the plurality of lead electrodes 141a and 142a in the first direction is represented as TC.

At this time, in an exemplary embodiment, LM and LC may satisfy 0.01<LC/LM<0.9.

If LC/LM is less than 0.01, the connectivity between the internal electrodes 121 and 122 and the plurality of lead electrodes 141