CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to U.S. Patent Application Ser. No. 63/174,046, filed on Apr. 13, 2021, and U.S. patent application Ser. No. 18/285,064, filed on Sep. 29, 2023, the disclosure of which are incorporated by reference herein in their entirety.

NOTICE OF COPYRIGHTS AND TRADE DRESS

A portion of the disclosure of this patent document contains material which is subject to copyright protection. This patent document may show and/or describe matter which is or may become trade dress of the owner. The copyright and trade dress owner has no objection to the facsimile reproduction by anyone of the patent disclosure as it appears in the U.S. Patent and Trademark Office files or records, but otherwise reserves all copyright and trade dress rights whatsoever.

FIELD OF INVENTION

Embodiments of the present invention are in the field of electronic and instrumented textiles that monitor areas of electrical, mechanical, chemical, and magnetic perturbations over a wide range of fabrics using a systemic placement of conductive and non-conductive threads and an algorithm for multiplexing an arbitrary number of devices.

BACKGROUND

Force and pressure sensitive (FPS) materials are ubiquitously used to construct sensors that aid devices and machines to interact with external stimuli. Frequently, FPS are embedded into thin or planar surfaces. FPS materials operate by transducing physical forces, such as pressure, bending, and stretching, into an electrical output, such as current and/or voltage, that may be registered by a receiving device, such as an analog-to-digital converter (ADC) or central processing unit (CPU). Other types of FPS transduction phenomena include the transfer of physical forces into other types of energies, such as thermal, resonance, optical, and ionization.

Commercial devices that incorporate FPS materials and knowledge of their transduction characteristics primarily use them to construct strain gauges. Strain gauges take advantage of physical deformation to change the underlying electromechanical properties of the FPS materials, which then produce a corresponding change in electrical output. Many conventional strain gauges incorporate a specific FPS material, known as a force-sensitive resistor (FSR). FSRs can be piezo-resistive materials and/or piezo-electric materials that undergo physical deformations that match the force applied in order to change their resistivity (or inversely, their conductivity), and therefore transduce changes in current and voltage outputs. The physical deformation is proportional to changes in the height, width, and length of the FSR material, which normally abides a Poisson Ratio. Examples of types of conventional strain gauges can include linear strain gauges, membrane strain gauges, rosette strain gauges, double linear strain gauges, quarter-bridge strain gauges, half-bridge strain gauges, full-bridge strain gauges (also known as load cells or Wheatstone bridge), shear strain gauges, column strain gauges, displacement, and beam load.

Strain gauges are known to be used in applications pertaining to civil, mechanical, industrial, and robotic fields. In the civil, mechanical, industrial, and robotic fields, strain gauges are primarily used for testing and quality control, which provide information to the researcher on the material integrity and robustness when used or abused in real-world settings. In addition, strain gauges can be used as feedback mechanisms to inform machines of how far they have traveled, moved, or been loaded with material. Examples are strain gauges on robotic joints that send feedback signals to the CPU on how the limb has moved, and if required, repositioned if the signal is above or below a desired threshold.

Placement of sensors and electromechanical components onto flexible substrates, such as textiles, however, is known to be exceedingly limited. Among the reasons for difficulty in integrating sensors and electromechanical components onto flexible substrates are: 1) the flexible and bending nature of textiles do not conform to the flat and rigid structures of conventional electromechanical sensors and/or devices; 2) routing electrical connections between electromechanical devices requires planar or non-flexible surfaces; 3) electrical connections typically need to consolidate to a central processing unit (CPU) with a rigid interface, such as an assembly of integrated circuits (ICs) or a transmitting device (e.g. WiFi, Bluetooth); and 4) the overall assembly of devices, connections, and ICs cannot tolerate stretch, bend, and other mechanical deformations in the X, Y, or Z planes without damaging the assembly, inducing noise, or otherwise detrimentally altering the signals between the components.

The core challenge of items 1-4 relate to the lack of flexibility in today's electronic devices. Research directed towards addressing this issue has focused primarily on the use of flexible printed circuit boards (PCBs) as a possible solution that would allow for the placement of devices (e.g., ICs) onto a flexible substrate with flexible copper traces. A flexible PCB typically includes a metallic layer of electrically conductive traces, usually copper, which is bonded to a dielectric layer, usually made of a polyimide material. The thickness of the metal layer can be made thin (<0.0001″) or thick (>0.010″), typically by increasing the thickness of the dielectric layer, which can vary from 0.0005″ to 0.010″. However, flexible PCBs are known to be more expensive to produce than rigid PCBs, which are made of glass fiber reinforced epoxy resin, also known as FR4. In addition, flexible PCBs still rely on the placement of solid components, such as resistors, capacitors, inductors, jacks, ICs, etc. onto the flexible PCB. Thus, while the PCB may be flexible, the attachment of rigid structures onto a flexible PCB hinders (e.g., reduces) flexibility and bending, especially in locations on the flexible PCB where such rigid components are more densely positioned. Therefore, an extremely high degree of engineering insight is required to place, incorporate, and assemble rigid components onto a flexible PCB to gain a desired flexibility, which leads to further increases in costs associated with the use of such flexible PCBs, as well as limiting the use of such flexible PCBs to very specific applications.

Another field of research has focused on the use of conductive inks for connecting electrical devices together. Conductive inks are typically made of emulsions of a dissolved metal immersed in organic to inorganic liquid. Conductive inks are chemically or thermally pressed onto a flexible substrate, typically a thin sheet of plastic or fabric. The conductive inks act as a coating layer on the flexible substrate, which are deposited according to a prescribed pattern that define (e.g., at the endpoints thereof) conductive connections for electronic devices. Once the ink is deposited, the electronic components are then attached on the prescribed positions. One improvement of flexible substrates over flexible PCBs is that the flexible substrate can be formed from a multitude of materials other than a polyimide or epoxy resin material. However, conductive inks are only able to interact with the top surface of a material; thus, flexible substrates lack many of the functional benefits associated with PCBs, whether rigid or flexible, in which electrical connections can be made in multiple layers and interconnected through vias to allow for more complex electrical circuit designs and connections. Conductive inks are similarly limited, like flexible PCBs, in that the electrical connections made by the conductive ink are still limited by the rigid electrical components placed on top. Therefore, just as with flexible PCBs, the attachment of rigid structures onto a flexible substrate, which has conductive ink deposited thereon, necessarily hinders (e.g., reduces) flexibility and bending of the flexible substrate. Furthermore, it is known that conductive inks wear (e.g., erode, or otherwise degrade) over time. When applied on fabrics, conductive inks exhibit similar characteristics to that of paint or heat press vinyl or dies, such that the conductive ink deposited into conductive patterns will flake, crack, and/or peel over time and with repeated use. Thus, the electrical connections provided by the use of such conductive inks will also fade, tear, or otherwise fail both due to the passage of time and/or use. As such, the useful life of conductive inks is dramatically shorter than for PCBs, whether rigid or flexible.

SUMMARY

The presently disclosed subject matter now will be described more fully hereinafter, in which some, but not all embodiments of the presently disclosed subject matter are described. Indeed, the presently disclosed subject matter can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will satisfy applicable legal requirements.

In one or more embodiments described herein are systems, methods, and devices that describe various aspects of textile-based force sensors in 2D and 3D electromechanical surfaces.

According to an example embodiment, a device (e.g., a sensing device) is disclosed herein, the device comprising: a passive element formed of a plurality of individual layers stacked sequentially on top of each other and comprising: a plurality of insulating layers, each of which comprise an insulating material; at least one sensing layer, each of which comprise a conductive or a semi-conductive material; a plurality of conductive layers, each of which comprises an electrically conductive material; and at least one semi-porous layer, each of which comprises a semi-porous material; wherein all of the plurality of conductive layers are separated from each other by one or more of the plurality of insulating layers, one or more of the at least one sensing layer, and/or one or more of the at least one semi-porous layer; optionally, wherein at least some or all of the plurality of conductive layers are spaced apart from the at least one sensing layer by the at least one semi-porous layer; and wherein the passive element comprises one or more of resistive, capacitive, and inductive characteristics; the device further comprising: a first insulating layer disposed over a top surface of the passive element; a second insulating layer disposed over a bottom surface of the passive element; and one or more electrically conductive threads, each of which is electromechanically attached to one of the plurality of conductive layers of the passive element and also exposed on and/or embedded within the first insulating layer or the second insulating layer.

In some embodiments of the device, the plurality of individual layers of the passive element are cut and/or folded for stacking on top of each other and are secured together by one or more of sewing, embroidery, heat-pressing, adhesives, ultrasonic welding, folding, crimping, and/or casting.

In some embodiments, the device is configured for cutting and/or folding to conform to irregular surface geometries, optionally, wherein the irregular surface geometries comprise on one or more of cloths, body parts, vehicles, appliances, and/or furniture.

In some embodiments of the device, the plurality of insulating layers and the plurality of conductive layers are on a same side as the at least one sensing layer.

In some embodiments of the device, first and second conductive layers of the plurality of conductive layers each comprise a pattern of the electrically conductive material to control the resistive, capacitive, and/or inductive characteristics of the passive element.

In some embodiments of the device, for the at least one sensing layer and/or at least some of the plurality of conductive layers, a thickness of material, a chemical composition, a porosity, an area of intersecting region of the top and bottom conductive layers, a thickness of traces, a number of turns in a pattern, a separation between intertwined conductive traces, and/or a distance from a sensitive material is selected to control a response time, an input dynamic range, an output dynamic range, a bandwidth, a signal-to-noise ratio, a common-noise rejection ratio, a signal gain, a sensitivity, and/or an insensitivity of the device.

In some embodiments of the device, the first and second conductive layers are positioned on opposite sides of the sensing layer from each other; the at least one semi-porous layer comprises first and second semi-porous layers; the first semi-porous layer is disposed between the first conductive layer and the sensing layer; the second semi-porous layer is disposed between the second conductive layer and the sensing layer; and the semi-porous material of each of the first and second semi-porous layers is selected to control a response time, an input dynamic range, an output dynamic range, a bandwidth, a signal-to-noise ratio, a common-noise rejection ratio, a signal gain, a sensitivity, and/or an insensitivity of the device.

In some embodiments, the device comprises one or more additional layer bonded to the first and/or second insulating layers, the one or more additional layers comprising one or more of fabric, glass, wood, gravel, synthetic, leather, organic-like material, and a metal-like material.

In some embodiments of the device, each of the plurality of insulating layers, the at least one sensing layer, the plurality of conductive layers, and the at least one semi-porous layer are bonded together using one or more of sewing, embroidery, heat-pressing, adhesives, ultrasonic welding, folding, crimping, and casting.

In some embodiments of the device, an edge of the device is finished via one or more of sewing, embroidery, heat-pressing, adhesives, ultrasonic welding, folding, crimping, and casting.

In some embodiments of the device, the one or more electrically conductive threads comprise a plurality of electrically conductive threads that are configured to be disposed at any location on and/or within the device.

In some embodiments of the device, the plurality of electrically conductive threads is disposed via one or more of sewing, weaving, knitting, lacing, depositing, and embroidery.

In some embodiments of the device, the plurality of electrically conductive threads is padded with porous materials or semi-conductive materials within the device.

In some embodiments of the device, the plurality of electrically conductive threads is attached to passive or active filtering components configured to perform one or more operations comprising low-pass, high-pass, band-pass, and/or notch filtering.

In some embodiments of the device, the plurality of electrically conductive threads is terminated onto a connector attached to a controller, which is configured to assemble incoming data, thereby creating assembled data, and transmit the assembled data to a receiving device.

In some embodiments of the device, an area between points where the sensing layer is contacted by the plurality of electrically conductive threads determines an area over which the passive element is sensitive.

In some embodiments of the device, the at least one sensing layer comprises a plurality of sensing layers, which are configured to differentially determine a direction of a stimulus applied to the device in any of an X-, Y-, and Z-plane.

In some embodiments, the device comprises switches configured to toggle measurement of one of the plurality of sensing layers.

In some embodiments, the device is configured to use logic gates, clocks, and/or CPUs to time and deconvolve output signals from the plurality of sensing layers.

In some embodiments of the device, the one or more electrically conductive threads comprise a plurality of electrically conductive threads, which are folded into separate layers within the device.

In some embodiments, the device is configured such that, by altering an input signal on at least one of the conductive materials of the one or more conductive layers, a signal from the passive element is differentially turned on or off, or enters a high-Z state via the at least one semi-porous layer.

In some embodiments, the device is configured to enter an on state, an off state, or a high-Z state based on a direction of a stimulus applied to the device, when the direction of the stimulus is in a same direction in which the at least one semi-porous layer is positioned between one of the plurality of conductive layers and the at least one sensing layer.

In some embodiments of the device, the passive element is configured for cutting and/or folding in any of X-, Y-, and Z-directions to differentially measure a stimulus applied to the device in any of an X-, Y-, and Z-plane, respectively.

In some embodiments, the device is configured for interaction with a user for motion acquisition purposes.

In some embodiments, the device is foldable, bendable, and/or rollable by the user.

In some embodiments, the device is configured to be stored, carried, and/or transported by the user.

In some embodiments, the device is configured for installation onto one or more of wood, metal, ceramic, glass, plastic, foam, turf, gravel, carpet, synthetic, organic, and metamaterials.

In some embodiments, the device is configured to connect to a receiving device for use online, offline, cloud-based, and external storage applications.

In some embodiments, the device is configured to generate data for use by the user for algorithmic and/or computerized activities.

In some embodiments, the device is configured to generate data for use for machine-learning activities.

According to another example embodiment, a device (e.g., a sensing device) is disclosed herein, the device comprising: first and second passive elements that are formed, respectively, of a plurality of individual layers stacked sequentially on top of each other and comprising: a plurality of insulating layers, each of which comprise an insulating material; at least one sensing layer, each of which comprise a conductive or a semi-conductive material; a plurality of conductive layers, each of which comprises an electrically conductive material; and at least one semi-porous layer, each of which comprises a semi-porous material; wherein all of the plurality of conductive layers are separated from each other by one or more of the plurality of insulating layers, one or more of the at least one sensing layer, and/or one or more of the at least one semi-porous layer; optionally, wherein at least some or all of the plurality of conductive layers are spaced apart from the at least one sensing layer by the at least one semi-porous layer; and wherein each of the first and second passive element comprises one or more of resistive, capacitive, and inductive characteristics; the device further comprising: a first insulating layer disposed over a top surface of the first and second passive elements; a second insulating layer disposed over a bottom surface of the first and second passive elements; and a plurality of electrically conductive threads, each of which is electromechanically attached to, exposed on, and/or embedded in the first passive element and second passive element and/or the first and second insulating layers; optionally, wherein the first and second passive elements are arranged to form a laterally-extending array of passive elements.

In some embodiments of the device, the plurality of individual layers of the first and/or second passive elements can be cut and/or folded for embedding within layers of a fabric material by one or more of sewing, embroidery, heat-pressing, adhesives, ultrasonic welding, folding, crimping, and/or casting.

In some embodiments, the device is configured for cutting and/or folding to conform to irregular surface geometries, optionally, wherein the irregular surface geometries comprise on one or more of cloths, body parts, vehicles, appliances, and/or furniture.

In some embodiments of the device, the first passive element and the second passive element are combined in a configuration on a same surface of the fabric, on opposing surfaces of the fabric, on separate surfaces of the fabric, cut and stacked on top of each other, or folded together.

In some embodiments of the device, the first passive element and the second passive element share at least one of the plurality of electrically conductive threads.

In some embodiments of the device, an angular position the first passive element relative to the and second passive element is selected to control a directional sensitivity of the device and/or an average sensitivity of the device.

In some embodiments of the device, a surface area of the first passive element and/or of the second passive element is selected to control a response time, an input dynamic range, an output dynamic range, a signal-to-noise ratio, a common-noise rejection ratio, a signal gain, a sensitivity, and/or an insensitivity of the device.

In some embodiments of the device, a thickness of the first passive element and/or of the second passive element is selected to control a response time, an input dynamic range, an output dynamic range, a signal-to-noise ratio, a common-noise rejection ratio, a signal gain, a sensitivity, and/or an insensitivity of the device.

In some embodiments of the device, a spacing between the first passive element and/or of the second passive element is selected to control a response time, an input dynamic range, an output dynamic range, a signal-to-noise ratio, a common-noise rejection ratio, a signal gain, sensitivity, and/or an insensitivity of the device.

In some embodiments of the device, the device is configured to interpolate a signal from the first passive element and a signal from the second passive element to form a secondary signal that is located within the first passive element and the second passive element.

In some embodiments of the device, the device is configured to differentially read a signal from the first passive element and/or the second passive element via a serial communication protocol comprising one or more of single-wire, two-wire, MOSI-MISO, PCI, bus, and serial peripheral interfaces.

In some embodiments of the device, the device is configured such that, by altering an input signal on at least one of the conductive materials of the plurality of conductive layers of the first and/or second passive elements, a signal from the first passive element and/or the second passive element is differentially turned on or off, or enters a high-Z state via the at least one semi-porous layer of the first and/or second passive element, respectively.

In some embodiments of the device, the plurality of electrically conductive threads are shared between the first and second passive elements.

In some embodiments of the device, in the first and/or second passive elements, the plurality of insulating layers and the plurality of conductive layers are on a same side as the at least one sensing layer.

In some embodiments of the device, in the first and/or second passive elements, first and second conductive layers of the plurality of conductive layers each comprise a pattern of the electrically conductive material to control the resistive, capacitive, and/or inductive characteristics of the passive element.

In some embodiments of the device, in the first and/or second passive elements, for the at least one sensing layer and/or at least some of the plurality of conductive layers, a thickness of material, a chemical composition, a porosity, an area of intersecting region of the top and bottom conductive layers, a thickness of traces, a number of turns in a pattern, a separation between intertwined conductive traces, and/or a distance from a sensitive material is selected to control a response time, an input dynamic range, an output dynamic range, a bandwidth, a signal-to-noise ratio, a common-noise rejection ratio, a signal gain, a sensitivity, and/or an insensitivity of the device.

In some embodiments of the device, the first and second conductive layers are positioned on opposite sides of the sensing layer from each other; the at least one semi-porous layer comprises first and second semi-porous layers; the first semi-porous layer is disposed between the first conductive layer and the sensing layer; the second semi-porous layer is disposed between the second conductive layer and the sensing layer; and the semi-porous material of each of the first and second semi-porous layers is selected to control a response time, an input dynamic range, an output dynamic range, a bandwidth, a signal-to-noise ratio, a common-noise rejection ratio, a signal gain, a sensitivity, and/or an insensitivity of the device.

In some embodiments, the device comprises one or more additional layer bonded to the first and/or second insulating layers, the one or more additional layers comprising one or more of fabric, glass, wood, gravel, synthetic, leather, organic-like material, and a metal-like material.

In some embodiments of the device, each of the plurality of insulating layers, the at least one sensing layer, the plurality of conductive layers, and the at least one semi-porous layer are bonded together using one or more of sewing, embroidery, heat-pressing, adhesives, ultrasonic welding, folding, crimping, and casting.

In some embodiments of the device, an edge of the device is finished via one or more of sewing, embroidery, heat-pressing, adhesives, ultrasonic welding, folding, crimping, and casting.

In some embodiments of the device, the plurality of electrically conductive threads is configured to be disposed at any location on and/or within the device.

In some embodiments of the device, the plurality of electrically conductive threads is folded into separate layers within the device.

In some embodiments of the device, the plurality of electrically conductive threads is disposed via one or more of sewing, weaving, knitting, lacing, depositing, and embroidery; and/or the plurality of electrically conductive threads is padded with porous materials or semi-conductive materials within the device.