RELATED APPLICATION

This application claims priority to U.S. provisional patent application No. 62/234,410 filed on Sep. 29, 2015, entitled â€œFlat Panel Diaphragm Loudspeakerâ€ , which is incorporated herein by reference, in its entirety.

TECHNICAL FIELD

The present invention relates generally to electromechanical acoustic devices and more specifically, to loudspeaker drivers.

DESCRIPTION OF RELATED ART

Various diaphragm loudspeakers have been disclosed previously. As an example, a balanced modal radiator (BMR) loudspeaker is disclosed in U.S. Pat. No. 7,916,878. However, some of these loudspeakers do not exhibit a satisfactory sound pressure level power sensitivity, sometimes called power efficiency, which is the sound pressure level in decibels measured at 1 meter distance for an input power of 1 Watt.

It may be beneficial to provide a loudspeaker with satisfactory sound pressure level sensitivity, among other things desirable in a loudspeaker.

With these needs in mind, the current disclosure arises. This brief summary has been provided so that the nature of the disclosure may be understood quickly. A more complete understanding of the disclosure can be obtained by reference to the following detailed description of the various embodiments thereof in connection with the attached drawings.

SUMMARY OF THE INVENTION

In one embodiment a loudspeaker is disclosed. The loudspeaker includes a diaphragm with a fixed portion and a movable portion. The fixed portion is attached to the movable portion by a plurality of leaf springs. A coil is disposed over the diaphragm in the movable portion of the diaphragm. A magnet assembly is operatively disposed relative to the coil, wherein upon flow of current through the coil, the movable portion of the diaphragm moves relative to the fixed portion.

This brief summary is provided so that the nature of the disclosure may be understood quickly. A more complete understanding of the disclosure can be obtained by reference to the following detailed description of the preferred embodiments thereof in connection with the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other features of several embodiments are described with reference to the drawings. In the drawings, the same components have the same reference numerals. The illustrated embodiments are intended to illustrate but not limit the invention. The drawings include the following figures:

FIG. 1 shows an example loudspeaker, according to one aspect of the present disclosure;

FIG. 2 shows top view of an example diaphragm of the loudspeaker of FIG. 1, according an aspect of the present disclosure;

FIG. 2A shows bottom view of the example diaphragm of the loudspeaker of FIG. 1, according to an aspect of the present disclosure;

FIG. 3 shows bottom view of the top magnet assembly, according to an aspect of the present disclosure;

FIG. 3A shows top view of the top magnet assembly, according to an aspect of the present disclosure;

FIG. 3B shows a cross-section of a portion of the top magnet assembly, according to an aspect of the present disclosure;

FIG. 3C shows a partial cross-section of the top magnet assembly and the bottom magnet assembly, according to an aspect of the present disclosure;

FIG. 4A shows another partial cross-sectional view of the loudspeaker of FIG. 1, according to an aspect of the present disclosure;

FIG. 4B shows another partial cross-sectional view of the loudspeaker of FIG. 1, showing magnetic field generated by the top magnet assembly and the bottom magnet assembly, according to an aspect of the present disclosure;

FIG. 4C shows a graph showing magnetic field strength generated by the top magnet assembly and the bottom magnet assembly, according to an aspect of the present disclosure;

FIG. 5A shows an alternate example of the diaphragm, according to an aspect of the present disclosure;

FIG. 5B shows yet another alternate example of the diaphragm, according to an aspect of the present disclosure;

FIG. 5C shows yet another alternate example of the diaphragm, according to an aspect of the present disclosure;

FIG. 5D shows yet another alternate example of the diaphragm, according to an aspect of the present disclosure;

FIG. 5E shows yet another alternate example of the diaphragm, according to an aspect of the present disclosure; and

FIG. 5F shows yet another alternate example of the diaphragm, according to an aspect of the present disclosure.

DETAILED DESCRIPTION

To facilitate an understanding of the adaptive aspects of the present disclosure, an example loudspeaker will be described. The specific construction and operation of the adaptive aspects of various elements of the example loudspeaker are described with reference to the example loudspeaker.

FIG. 1 shows an exploded view of an example loudspeaker 100. The loudspeaker 100 includes a diaphragm 102, a top magnet assembly 104 and a bottom magnet assembly 106 operatively disposed relative to the diaphragm 102. The diaphragm 102 includes a connector block 103. Functions and features of the diaphragm 102 will be later described in detail with reference to FIGS. 2 and 2A. Functions and features of the top magnet assembly 104 and the bottom magnet assembly 106 will also be later described in detail with reference to FIGS. 3, 3A, 3B and 3C. A top receiver cover 108 with a plurality of holes 110 is disposed over the top magnet assembly 102. In one example, the plurality of holes 110 are disposed surrounding the top magnet assembly 104. The top magnet assembly 104 is attached to the top receiver cover 108.

A bottom receiver cover 112 with a plurality of holes 110 is disposed over the bottom magnet assembly 106. In one example, the plurality of holes 110 are disposed surrounding the bottom magnet assembly 106. The bottom magnet assembly 106 is attached to the bottom receiver cover 112. A grill plate 114 with a plurality of grills 116 is disposed between the top receiver cover 108 and a top cover 118.

A plurality of fasteners (not shown) may be used to fasten together the top cover 118, top receiver cover 108, diaphragm 102 and the bottom receiver cover 112. For example, a fastener (not shown) may be passed through a plurality of aligned holes 120a-120d disposed in the top cover 118, top receiver cover 108, diaphragm 102 and the bottom receiver cover 112 respectively. In some examples, a cushion ring may be disposed over the exterior of the bottom receiver cover, when the loudspeaker is used as a head phone, to provide a soft surface to rest over an ear.

Now, referring to FIG. 2, a top view of an example diaphragm 102 is shown. In one example, the diaphragm 102 is a planar substrate. The diaphragm 102 has a fixed portion 202 and a movable portion 204. The fixed portion 202 is attached to the movable portion 204 by a plurality of leaf springs 206. A coil 208 is disposed over the movable portion 204 of the diaphragm 102.

The leaf spring 206 includes a first end portion 210, a second end portion 212 and a body portion 214. The first end portion 210 is connected to the movable portion 204 of the diaphragm 102. The second end portion 212 is connected to the fixed portion 202 of the diaphragm 102. A gap between the body portion 214 of the leaf spring 206 and the movable portion 204 of the diaphragm 102 define a portion of a first slot 216. A gap between the body portion 214 of the leaf spring 206 and the fixed portion 202 of the diaphragm 102 define a portion of a second slot 218. The first slot 216 extends to an adjacent leaf spring 206 to define a gap between the body portion of the adjacent leaf spring and the movable portion 204 of the diaphragm 102. The second slot 218 extends to another adjacent leaf spring to define a gap between the body portion of the another adjacent leaf spring and the fixed portion 202 of the diaphragm 102.

In one example, the first slot 216 and the second slot 218 are filled with a material to substantially maintain a pressure differential between a top portion of the diaphragm 102 and a bottom portion of the diaphragm 102. In one example, the pressure differential is created by the movement of the movable portion of the diaphragm 102, for example, upon flow of a current in the coil 208.

In one example, the dimension and material properties of the leaf spring 206 between the first end portion 210 and the second end portion 212 define various characteristics of the leaf spring 206. For example, the spring stiffness or spring compliance may be selectively chosen to optimize frequency response of the loudspeaker, within a certain range of frequencies.

Now, referring to FIG. 2A, a bottom view of the diaphragm 102 is shown. Now, referring to both FIGS. 2 and 2A, various functions and features of the coil 208 will now be described. The coil 208 includes a plurality of sub coils 220. In one example, the coil 208 includes a plurality of sub coils 220 disposed both on the top portion 222 of the diaphragm 102 and the bottom portion 224 of the diaphragm 102. For example, sub coils 220a, 220b and 220c (shown in FIG. 2) are disposed on the top portion of the diaphragm 102. And, sub coils 220d, 220e and 220f (shown in FIG. 2A) are disposed on the bottom portion 224 of the diaphragm 102. A plurality of connector pads 226 are disposed on the top portion 222 of the diaphragm 102.

In this example, the plurality of sub coils 220a-220f are connected in series. Ends of the coil 208 are connected to one of the connector pads 226. Terminals of the connector block 102 (as shown in FIG. 1) is coupled to the plurality of connector pads 226, to electrically couple the connectors of the connector block 102 to the coil 208. For example, a portion of the conductor of the coil 208 enters and exits the movable portion 204 of the diaphragm 102 over the body portion 214 of one of the leaf spring 206. A plurality of dummy conductors 228 are disposed in the body portion of the other leaf springs 206 so as to maintain a substantially similar compliance between the one of the leaf springs over which portion of the conductor of the coil 208 enters and exits and other leaf springs.

In one example, the sub coils 220 disposed on the top portion 222 are each substantially physically aligned with a corresponding sub coils 220 disposed on the bottom portion 224 of the diaphragm 102, to form a sub coil pair. For example, the sub coil 220a is physically aligned with sub coil 220f to form a sub coil pair 220a-220f. Similarly, the sub coil 220b is physically aligned with sub coil 220e to form another sub coil pair 220b-200e. And, the sub coil 220c is physically aligned with sub coil 220d to form yet another sub coil pair 220c-220d.

In one example, the direction of winding of the conductors of the sub coil pairs are such that a current flowing in the sub coil pair will flow in the same direction. For example, the direction of the current flowing through the sub coil pair 220a-200f will be the same. Similarly, the direction of the current flowing through the sub coil pair 220b-200e will be the same. And, the direction of the current flowing through the sub coil pair 220c-200d will be the same.

In one example, the length of the sub coil conductors are selectively chosen to generate a substantially uniform force across the sub coils. For example, the length of the conductors in each of the sub coil pairs may be different so as to generate a substantially uniform force across the sub coils.

In one example, a copper clad flexible printed circuit may be used to fabricate the coil. For example, by selectively etching the copper layer on the flexible printed circuit, various sub coils of disclosure may be fabricated. In one example, selectively etched copper clad flexible printed circuit may be used as a combination of the diaphragm and the coils.

In some examples, a stiffener 230 may be selectively disposed in an inner portion of the movable portion 204 so as to maintain a substantially constant mechanical impedance for the movable portion 204 of the diaphragm 102.

In one example, a copper clad flexible printed circuit may be used to fabricate the coil. For example, by selectively etching the copper layer on the flexible printed circuit, various sub coils of disclosure may be fabricated. Additionally, the stiffener may also be formed by selectively etching the copper layer on the flexible printed circuit. Additionally, dummy conductors may also be formed by selectively etching the copper layer on the flexible printed circuit. In one example, selectively etched copper clad flexible printed circuit may be used as a combination of the diaphragm and the coils. Further, the flexible printed circuit may be selectively laser cut to form the first slot and the second slot.

In another example, conductive ink may be selectively printed on a substrate to form the coil on the substrate. In one example, the substrate along with the selectively printed coil copper clad flexible printed circuit may be used as a combination of the diaphragm and the coils. Further, the substrate may be selectively laser cut to form the first slot and the second slot.

In yet another example, Electroless Nickel Immersion Gold (ENIG) may be selectively deposited on a substrate to form a profile of the coil on the substrate, which acts as a seed layer. Over the ENIG seed layer, the coil may be electroplated in aqueous electrolyte with copper to get a coil of required thickness. In this example, selectively deposited coil along with the substrate may be used as a combination of the diaphragm and the coils. Further, the substrate may be selectively laser cut to form the first slot and the second slot.

Now, referring to FIGS. 3, 3A, 3B and 3C, various functions and features of the top magnet assembly 104 and bottom magnet assembly 106 will now be described. Referring to FIG. 3, a bottom view of the top magnet assembly 104 is shown. The top magnet assembly 104 includes an outer ring magnet 302 and an inner ring magnet 304. The outer ring magnet 302 and inner ring magnet 304 are spaced apart and held in a holder 306. The outer ring magnet 302 and inner ring magnet 304 may be compression bonded Neodymium ring magnets of substantially same width, with isosceles trapezoid cross-section at about 45 degrees.

Now, referring to FIG. 3A, a top view of the top magnet assembly 104 is shown. For example, the holder 306 is shown in the top view of the top magnet assembly 104. The holder 306 may be made of a soft steel material.

Now, referring to FIG. 3B, a cross-section of a portion of the top magnet assembly 104 is shown, with the holder 306, outer ring magnet 302 and inner ring magnet 304, with side surface 308 of the outer ring magnet 302 and inner ring magnet 304 that form the inclined surfaces of the trapezoidal cross-section.

Now, referring to FIG. 3C, a partial cross-sectional view of the top magnet assembly 104 and the bottom magnet assembly 106 operatively disposed with reference to the diaphragm 102 is shown. As one skilled in the art appreciates, the bottom magnet assembly 106 is constructed similar to the top magnet assembly 104, as previously described with reference to FIGS. 3, 3A and 3B. For example, the bottom magnet assembly 106 includes a holder 306, outer ring magnet 302 and inner ring magnet 304, with side surface 308 of the outer ring magnet 302 and inner ring magnet 304 that form the inclined surfaces of the trapezoidal cross-section.

FIG. 4A shows yet another partial cross-sectional view of the loudspeaker 100 as previously described with reference to FIG. 1. The top magnet assembly 102 is disposed in a recess 402 of the top receiver cover 108. The bottom magnet assembly 104 is disposed in a recess 404 of the bottom receiver cover 108. In one example, the top magnet assembly 102 is glued to the top receiver cover 108. In one example, the bottom magnet assembly 104 is glued to the bottom receiver cover 112. The diaphragm 102 is disposed between the top magnet assembly 104 and the bottom magnet assembly 106 so as to operatively dispose the sub coils relative to the top magnet assembly 104 and the bottom magnet assembly 106. This will be further described with reference to FIG. 4B.

Now, referring to FIG. 4B, another partial cross-sectional view of the loudspeaker 100 is shown, to describe the electro-magnetic interaction between the top magnet assembly 104, bottom magnet assembly 106 and the sub coil pairs of the coil 208 disposed on the diaphragm 102. In this example, the outer ring magnet 302 of the top magnet assembly 104 and the outer ring magnet 302 of the bottom magnet assembly 106 are magnetized so as to oppose each other, as shown by arrows 406 and 408. And, the inner ring magnet 304 of the top magnet assembly 104 and the inner ring magnet 304 of the bottom magnet assembly 106 are magnetized so as to attract each other, as shown by arrows 410 and 412. The gap between the top magnet assembly 104 and the bottom magnet assembly 106 defines an air gap 414. The sub coil pairs of the coil 208 is disposed in the air gap 414 and subjected to the magnetic field generated by the outer ring magnets 302 and inner ring magnets 304 of the top magnet assembly 104 and the bottom magnet assembly 106.

The direction of the magnetic flux fields generated by the outer ring magnets 302 and the inner ring magnets 304 in the air gap 414 are shown by arrows 416, 418 and 420. In other words, the top magnet assembly 104 and the bottom magnet assembly 106 create a magnetic field substantially in the plane of the diaphragm 102 and perpendicular to the flow of current through the sub coil pairs of the coil 208. More specifically, the sub coil pairs 208c-208d are subjected to magnetic field in a direction shown by arrow 416. The sub coil pairs 208b-208e are subjected to magnetic field in a direction shown by arrow 418. And, the sub coil pairs 208a-208f are subjected to magnetic field in a direction shown by arrow 420.

Now, referring to FIG. 4C, an example selective placement of the sub coils relative to the center of the diaphragm 102 based on the magnetic field strength will now be described. Referring to FIG. 4C, graph 430 shows an example magnetic field strength generated by the top magnet assembly and the bottom magnet assembly, from a center of the diaphragm. For example, the X axis shows the distance from the center of the diaphragm and Y axis shows the magnetic field strength at various locations of the diaphragm, along a radius.

For example, the portion 432 of the graph 430 (below the X axis) shows the magnetic field strength imparted in the vicinity of the sub coil pairs 208c-208d. The portion 434 of the graph 430 (above the X axis) shows the magnetic field strength imparted in the vicinity of sub coils 208b-208e. And the portion 436 of the graph 430 (below the X axis) shows the magnetic field strength imparted in the vicinity of the sub coils 208a-208f.

In one example, the sub coils are selectively placed on the diaphragm, so that the magnetic field strength imparted on the sub coil is above a threshold value. For example, if the threshold value for the magnetic field strength is chosen to be above + or âˆ’0.2 Tesla, the sub coils 208c-208d are placed between a distance of D1 and D2 from the center of the diaphragm. The sub coils 208b-208e are placed between a distance of D3 and D4 from the center of the diaphragm. And, the sub coils 208a-208f are placed between a distance of D5 and D6.

As one skilled in the art appreciates, when a current flows through the sub coil pairs of the coil 208, the amount of force generated due to the interaction of the current flowing through the sub coils is dependent on the length of the sub coil and the magnetic field strength the sub coil is subjected to. In this example, the sub coil pairs 208b-208e are subjected to a higher magnetic field strength than the sub coil pairs 208c-208e and 208a-208f. In one example, the sub coil winding length is selectively chosen to generate a substantially uniform force across all the sub coils.

In one example, the direction of current flowing through the sub coil pairs are chosen such that the movable portion of the diaphragm 102 is moved in the same direction. In this example, the sub coil pair 208b-208e is subjected to a magnetic field in the direction as shown by arrow 418. However, the sub coil pairs 208a-208f and 208c-208f are subjected to a magnetic field in the direction as shown by arrow 416 and 420, which are opposite to the direction as shown by arrow 418. In order to move the movable portion of the diaphragm 102 in the same direction, the direction of flow of current in sub coil pair 208b-208e will be opposite to the direction of flow of current in sub coil pairs 208a-208f and 208c-208d.

In the foregoing example, the shape of the diaphragm described with reference to loudspeaker 100 was substantially circular. However, the shape of the diaphragm may be different than a circular shape. For example, other shapes with a high axial symmetry may be used. For example, FIG. 5A shows an example diaphragm 102 in a hexagonal shape, with a plurality of leaf springs 206 separating the fixed portion 202 and the movable portion 204. FIG. 5B shows an example diaphragm 102 in a oval shape, with a plurality of leaf springs 206 separating the fixed portion 202 and the movable portion 204. FIG. 5C shows an example diaphragm 102 in a square shape, with a plurality of leaf springs 206 separating the fixed portion 202 and the movable portion 204. FIG. 5D shows an example diaphragm 102 in a pentagon shape, with a plurality of leaf springs 206 separating the fixed portion 202 and the movable portion 204. FIG. 5E shows an example diaphragm 102 in a rectangle shape, with a plurality of leaf springs 206 separating the fixed portion 202 and the movable portion 204. FIG. 5F shows an example diaphragm 102 in a triangle shape, with a plurality of leaf springs 206 separating the fixed portion 202 and the movable portion 204.

Design Considerations and Example Calculations:

Following design considerations and calculations are provided as example only and are not intended to limit the scope of the disclosure herein.

The voice-coil in the moving coil loudspeaker drivers considered here are suspended in a magnetic field, the air-gap, of the magnet assembly such that current flow thorough the voice-coil gives rise to a Lorentz force acting on the voice-coil normal to the plane of the diaphragm causing it to respond with vibrational motion and hence emit sound, when an AC signal voltage in the audio band is applied to the voice-coil.

The following, which is taken from A Parametric Study of Magnet System Topologies for Micro-speakers by Hiebel (130 AES Convention 13-16 May 2011), gives the equations and methodology for calculating a loudspeaker driver's power sensitivity E_p, the Sound Pressure Level, SPL measured in decibels (dB) at 1 m for 1 W power input:

E_p=SPL=20.log₁₀((S_d.Î´_a.BL)/(2Ï€.M_msâˆšR_e.20e^âˆ’6)) dB 1 W/1 m

- where,
- S_dEffective area of loudspeaker diaphragm, (m²)
- Î´_aDensity of air at standard temperature and pressure (1.225 kgm^âˆ’2)
- BL B.L motor force product, (Tm)
- B is the average magnetic flux density in the voice-coil air-gap, (T)
- L is the length of voice-coil conductor in the air-gap, (m)
- M_msTotal moving mass of diaphragm+voice-coil (+suspension) (kg)
- R_eVoice-coil DC resistance, or more typically impedance at 1 kHz (Î©)
- 20e-⁶SPL scaling relative to threshold of hearing 20 Î¼Pa
- SPL Sound Pressure in decibels measured at 1 meter/1 Watt (dB 1 W/1 m)
- E_pSPL power sensitivity (dB 1 W/1 m)

In the expression, the voice-coil resistance R_e, and conductor length in the air-gap L, are interdependent and the expression can be rewritten using the following identities for the voice-coil conductor material:

R_e=Ï _r.L/A

m_vc=Î´_m.L.A

- where,
- Ï _rResistivity of voice-coil conductor material (Cu 1.68E-08 Î©m, Al 2.82E-08 Î©m)
- Î´_mDensity of voice-coil material (Cu 8.96 E+03 kgm^âˆ’3, Al 2.70 E+03 kgm^âˆ’3)
- m_vcMass of the voice-coil (kg)
- L L is the length of voice-coil conductor in the air-gap, (m)
- A Cross-sectional area of conductor, (m²)
- m_sMass (effective) of the diaphragm (kg)
- which in turn gives the following expression for âˆšR_eallowing the elimination of L,

âˆšR_e=(âˆšÏ _r.âˆšÎ´_m.L)/âˆšm_vc

M_ms=(m_vc+m_s)

- to give:

E_p=SPL=20.log₁₀((S_d.Î´_a.B.âˆšm_vc)/(2Ï€.(m_vc+m_s).âˆšÏ _r.âˆšÎ´_m.20e^âˆ’6)) dB 1 W/1 m

A given diaphragm area and magnet geometry effectively sets S_dand B as constant making m_vcand m_sthe only variables allowing the expression to take the following form:

E_p=const.+20.log₁₀(âˆšm_vc/(m_vc+m_s))

which has a unique maximum value when m_vc=m_s, giving a final form of the expression as follows:

(E_p)_max=(SPL)_max=20.log₁₀((S_d.Î´_a.B)/(4Ï€âˆšm_sâˆšÏ _r.âˆšÎ´_m.20e^âˆ’6)) dB 1 W/1 m

A desirable configuration for a loudspeaker driver for a given magnet geometry and voice-coil conductor material, typically Copper or Aluminum, depends therefore primarily on the effective area, S_dand mass, m_sof the diaphragm. And once the diaphragm is chosen, generally to be as light and stiff (to bending) as possible based on acoustic and modal (vibration) considerations, then that optimal maximum SPL power efficiency is known immediately. The design process for a loudspeaker driver should be an attempt to achieve that optimal design within the physical constraints of the available voice-coil conductor materials, fabrication methods, and last but not least, budget.

The specific geometry and conductor material of the voice-coil will determine the voice-coil resistance R_e(Î©) and hence the SPL voltage sensitivity S_v(dB 1V_rms/1 m) which is the sound pressure level measured at 1 m for 1.0 V_rmsinput. There is also the practical consideration that audio amplifiers are designed and built to drive specific impedances with well-defined output power and RMS voltage ratings, which means that the power rating of the voice-coil is an important design consideration. Typical voice-coil impedances are 4Î©, 8Î© or 16Î© for general purpose loudspeaker drivers with power ratings in 10s to 100s of Watts, while for microspeakers used in mobile devices the impedances are in the same range but the power ratings are in the range of 1 to 3 Watts. For headphones, earbuds and in-ear monitors the impedances are typically 24 Î©, 32Î© and up to as much as 300Î© while the power ratings are significantly relaxed to typically 10s to 100s of mW.

Here is a summary of these expressions in forms useful for loudspeaker driver optimization:

E_p=SPL=20.log₁₀((S_d.Î´_a.BL)/(2Ï€.M_ms.âˆšR_e.20e^âˆ’6)) dB 1 W/1 m

E_p=SPL=20.log₁₀((S_d.Î´_a.B.âˆšm_vc)/(2Ï€.(m_vc+m_s).âˆšÏ _r.âˆšÎ´_m.20e^âˆ’6)) dB 1 W/1 m

(E_p)_max=(SPL)_max=20.log₁₀((S_d.Î´_a.B)/(4Ï€.âˆšm_sâˆšÏ _r.âˆšÎ´_m0.20e^âˆ’6)) dB 1 W/1 m

- where

M_ms=m_vc+m_sand at (E_p)_max,m_vc=m_s,==>M_ms=2.m_s=2.m_vc

SPL==>Power Efficiency or Power Sensitivity E_p(dB 1 W/1 m)

==>Voltage Sensitivity S_v(dB 1V_rms/1 m)

To convert from one to the other, following expressions are used.

S_v=E_pâˆ’10.log₁₀(R_e) dB 1V_rms/1 m

E_p=S_v+10.log₁₀(R_e) dB 1 W/1 m

These expressions are generally the same for the dynamic loudspeaker drivers used for headphones, in-ear monitors and earbuds. However, the headphone power sensitivity is normally related to the SPL at the ear for 1 mW input power. As a useful guide for comparing headphone drivers with conventional loudspeaker drivers, the following expression converts SPL at 1 m to SPL at 1 cm:

E_pdB(1 mW/1 cm)=10 dB+E_pdB(1 W/1 m)

And again for headphones, to convert from E_p, the power sensitivity SPL at 1 mW to S_v, the voltage sensitivity for 1V_rmsat the ear, the following expressions apply:

S_v=E_p+(30âˆ’10.log₁₀(R_e)) dB/V at the ear

E_p=S_vâˆ’(30âˆ’10.log₁₀(R_e)) dB/mW at the ear

With these expressions in hand we can set about an example implementation of an improved loudspeaker driver which can generally be used at all sizes but for which we give an exemplary design methodology for large diaphragm high performance headphone drivers.

Voice-Coil and Suspension for a Near â€˜Ideal Forceâ€™

A planar voice-coil over the entire area of the diaphragm would satisfy the requirement for an isotropic diaphragm structure. This can be achieved with the planar voice-coil loudspeakers, which date back more than fifty years, (U.S. Pat. No. 3,013,905A, U.S. Pat. No. 3,674,946, U.S. Pat. No. 3,829,623) and have planar voice-coils with 70%-90% the diaphragm area, S_d. But they have two failings, 1) The isodynamic drive of the tensioned film diaphragms leads to a substantially planar sound wave-front which gives rise to unacceptably narrow directivity for general use other than headphones and 2) the planar magnet structure extends over the entire diaphragm area, is heavy and needs to be perforated, all adding expense.

These failings are overcome in this disclosure by using a composite sandwich panel to fabricate the diaphragm where the planar voice-coil material is part of the sandwich panel skins and is mechanically isotropic over the entire area of the diaphragm.

The term mechanically isotropic means that the mechanical impedance of the diaphragm remains constant over some minimum scale. The mechanical impedance Z_m, is a panel material property given by Z_m=8âˆš(B.Î¼) where B is the bending stiffness (Nm) and Î¼ is the aerial density (kgm^âˆ’2) of the diaphragm. (For a monolith panel, B=E.t³/(12.(1âˆ’v²)) where E is the panel material's tensile modulus, t the panel thickness, Î½ its Poisson ratio and Î¼=Ï .t where Ï is the volume density.) So provided this product (B.Î¼) is kept constant on the chosen scale then the panel will be mechanically isotropic. The ability to fabricate any 2D structure including the voice-coil in the Copper (or Aluminum) metal cladding of the FPC (flex printed circuit) composite panel skins, facilitates the process of ensuring that Z_mcan be kept constant on a suitable scale of less than 10% of the diaphragm diameter D (=68.4 mm) which is 3.5 mm to 7 mm for our exemplary circular diaphragm. In particular, features of increased or lowered stiffness and mass, relative to the voice-coil area, can be etched in the Copper (or Aluminum) foil in the surface regions outside the magnet assembly without adding cost. And the thicknesses of Copper (or Aluminum) foil and polyimide (or PET/polyester) substrate used can be chosen to facilitate that objective of isotropic Z_mon the chosen scale of less than 10% D.

For example, consider a sandwich panel comprising thin skins, 12.5 Î¼m, high tensile modulus (7.1 GPa) polyimide film substrate, 8.7 Î¼m copper foil clad and bonded on both sides to a light density (32.0 kgm^âˆ’3) core, typical thickness 1.0 mm ROHACELLÂ®-IG31. This gives an exemplary composite sandwich panel with a suitable high bending stiffness diaphragm with diameter D=68.2 mm, surface area S_d=3563 mm²and mass m_s=0.29 g (excluding mass m_vcof voice-coil). The other mechanical properties of this exemplary panel diaphragm relevant to bending wave loudspeakers are: B, bending stiffness=0.0568 Nm, f_o, fundamental mode frequency=724.3 Hz and f_c, coincidence frequency=21.8 kHz, Z_mmechanical impedance=0.539 Nsm^âˆ’1.

Compared to the planar voice-coil loudspeakers previously known, the magnet surface area and active planar voice-coil area of this example disclosure is substantially reduced from 70%-90% S_dto about 30%-45% S_dwhich means that the planar magnet assembly does not need to be perforated as there is a wide open sound radiation area (70%-60%) on both sides of the diaphragm. The active planar voice-coils in the example are made axisymmetric and centered on the fundamental mode (f_o) nodal radius r_o, at 0.68a=23.1 mm (where a=34.1 mm is the diaphragm radius) so that the resolved force on the diaphragm in effect, acts at the center point in such a way as to preserve the isotropic modal structure resulting in a near â€˜ideal loudspeakerâ€™ save for the effective mass of the diaphragm suspension.

In order to achieve a near â€˜ideal loudspeakerâ€™ concept with a near â€˜ideal forceâ€™, an isotropic diaphragm with a suspension with zero effective mass is desirable. In one example, an integral multi-leaf cantilevered suspension system is constructed by cutting into the diaphragm structure several narrow slots, for example, slots 8 to 16 in number, 0.10 mm to 0.5 mm in width, 10 mm to 30 mm in length, in a spiral format, at an acute angle less than 15Â°, on the periphery of the exemplary diaphragm diameter D=68.2 mm, radius a=34.1 mm, S_d=3563 mm². To isolate front from rear sound pressure radiation, the slots are filled with a viscous material such as high vacuum silicone grease or ultralow Durometer rubber, for example silicone Room Temperature Vulcanized (RTV) hardness Shore00 11 to 30 allowing for sufficient diaphragm displacement together with viscoelastic damping at the diaphragm edge.

The sandwich panel skins can be made with standard flex printed circuit (FPC) fabrication techniques using commercially available high performance copper clad polyimide such as PANASONICÂ® FELIOSÂ® R-F775 (8.7 Î¼m to 17.4 Î¼m Cu foil on 12.7 Î¼m to 25.4 Î¼m polyimide substrate) material on the one hand or on the other hand, made with standard RFID antenna fabrication techniques using Aluminum (5 Î¼m to 10 Î¼m) clad PET/polyester films (5 Î¼m to 25 Î¼m). Aluminum clad PET film fabrication is an order of magnitude inferior to modern copper clad FPC fabrication. So although a 3 dB SPL improvementâˆ’((E_p)_maxAl-(E_p)_maxCu)=âˆ’20 log₁₀((âˆšÏ _a1.âˆšÎ´_al)/(âˆšÏ _cu.âˆšÎ´_cu)) dB(1 W/1 m)â€”is available from a fully optimized Aluminum clad PET film solution compared to the equivalent Copper clad polyimide film FPC solution, practical considerations dictate a copper clad FPC solution as the most viable and cost effective at present.

Photo chemical etching fabrication process used to make FPC and RFID antenna type coils which are technologies that can be utilized to make the structural diaphragms of this disclosure. Printed Electronics technology and Laser cutting/etching are also viable technologies available today to create the coils and the slots respectively. In some examples, isotropic graphene skin based composite sandwich panel diaphragms can be fabricated using laser cutting to provide structured electromechanical sandwich panels with increased stiffness for the skins and reduced areal density for the mechanical properties of the panel, as well as increased conductivity for the laser cut planar voice-coils, leading to even higher maximum SPL from this disclosure. This is evidenced by the parametric expression for maximum SPL power sensitivity:

(E_p)_max=(SPL)_max=20.log₁₀((S_d.Î´_a.B)/(4Ï€.âˆšm_sâˆšÏ _r.âˆš_m.20e^âˆ’6)) dB 1 W/1 m

where the key material parameters are the (m_s.Ï _r.Î´_m) product. Graphene, with its high stiffness to weight ratio and high electrical conductivity drives all three of these parameters in the direction of increased max SPL compared to polyimide or PET as a substrates and Copper or Aluminum as conductors.

Integrating both the planar voice-coil and the multi-leaf cantilevered suspension system into the sandwich panel diaphragm thus gives rise to a mechanically isotropic electromechanical structure resulting in a Flat Panel Diaphragm Loudspeaker driver which has a substantially flat on-axis pressure response, wide directivity, as well as a smooth and extended power response over the entire audio bandâ€”a near â€˜ideal loudspeakerâ€™.

An example large diaphragm headphone driver

Large diaphragm, (typically diameter 40 mm to 70 mm) dynamic headphone drivers are considered for the very best headphones which tend to be circumaural or over the ear headphones. The design target objective was to use this disclosure to provide markedly improved cost performance at this high end of the headphone market. The headphone drivers made using this disclosure are very light and compact and the same size chosen could also be used for smaller supraaural or on the ear headphones. The Diaphragm diameter D=68.2 mm considered here by example can be scaled down and optimized for a smaller diaphragm for use with supraaural headphones.

The diameter D=68.2 mm, radius a=34.1 mm, chosen has a mean fundamental mode (f_o) nodal radius at 0.68a=23.1 mm. This radius, r_o=23.1 mm, determines the central radius of the planar magnet structure. PANASONICÂ® FELIOSÂ® F-R775 was chosen for the sandwich panel skins because it is one of the most advanced FPC fabrication materials on the market. It is a copper clad polyimide which has a high tensile modulus of 7.1 GPa and a density of 1.46 kgm^âˆ’3. It is available in a range of sizes and specifications as shown in Table 1 below. In Table 1, an â€œoâ€ indicates â€œavailableâ€ and a â€œ-â€ indicates â€œnot availableâ€ .

TABLE 1CopperRA Copper Foil - PANASONICâ€‰Â® FELIOSâ€‰Â® R-F775FoilFilm ThicknessThickness0.5 mil0.59 mil0.8 mil1 mil2 mils3 mils4 mils5 mils6 milsOzÎ¼m.013 mm.015 mm.02 mm.025 mm.05 mm.075 mm.1 mm.125 mm.15 mmÂ¼9âˆ˜âˆ˜âˆ˜â—¯âˆ˜â€”â€”â€”â€”â…“12âˆ˜âˆ˜âˆ˜â—¯âˆ˜â€”â€”â€”â€”Â½18âˆ˜âˆ˜âˆ˜â—¯âˆ˜âˆ˜âˆ˜âˆ˜âˆ˜135âˆ˜âˆ˜âˆ˜â—¯âˆ˜âˆ˜âˆ˜âˆ˜âˆ˜270âˆ˜âˆ˜âˆ˜â—¯âˆ˜âˆ˜âˆ˜âˆ˜âˆ˜3105â€”â€”â€”â€”âˆ˜â€”â€”â€”â€”4150â€”â€”â€”â€”âˆ˜â€”â€”â€”â€”

ROHACELLÂ® which is a Polymethacrylimide (PMI) based, rigid, closed-cell polymeric foam used extensively in the aerospace industry, was chosen as the core material for the sandwich panels made with the FELIOSÂ® F-R775 FPC skins. Due to its exceptional mechanical properties of being very light and stiff with good internal damping, ROHACELLÂ® makes for excellent bending wave loudspeaker panels. Table 2 below shows various properties of ROHACELLÂ® polymeric foam.

TABLE 2ROHACELLâ€‰Â®ROHACELLâ€‰Â®ROHACELLâ€‰Â®ROHACELLâ€‰Â®PropertiesUnit31 IG/IG-F51 IG/IG-F71 IG/IG-F110 IG/IG-FDensitykg/m3325275110CompressiveMPa0.40.91.53strengthTensileMPa11.92.83.5strengthShearMPa0.40.81.32.4strengthElasticMPa367092160modulusShearMPa13192950modulusElongation at%3333break

The mechanical properties of the sandwich panels were derived from the following calculation table, Table 3:

TABLE 3t_c, thickness (PMI/ROHACELLâ€‰Â®) 31 IG500Î¼m750Î¼m1000Î¼mcoret_s, thickness (FELIOSâ€‰Â® R-F775) skin12.7Î¼m12.7Î¼m12.7Î¼mt_g, thickness (3M 82600 PSA) glue5Î¼m5Î¼m5Î¼mt_p, total panel thickness535Î¼m785Î¼m1035Î¼mE_s, tensile elastic modulus skin7.1GPa7.1GPa7.1GPaE_g, tensile elastic modulus glue100MPa100MPa100MPaE_c, tensile elastic modulus core36MPa36MPa36MPaB, bending stiffness, = B_s+ B_g+ B_c0.0144Nm0.0319Nm0.0568NmÏ _c, density core32Kgm^âˆ’332Kgm^âˆ’332Kgm^âˆ’3Ï _s, density skin1460Kgm^âˆ’31460Kgm^âˆ’31460Kgm^âˆ’3Ï _g, density glue1200Kgm^âˆ’31200Kgm^âˆ’31200Kgm^âˆ’3Î¼, panel aerial density0.064Kgm^âˆ’20.072Kgm^âˆ’20.080Kgm^âˆ’2S_d, panel area3653mm²3653mm²3653mm²c, velocity sound in air340ms^âˆ’1340ms^âˆ’1340ms^âˆ’1Z_m, mechanical impedance = 8âˆš(B Â· Î¼)0.243Nsm^âˆ’10.384Nsm^âˆ’10.539Nsm^âˆ’1f_c, coincidence frequency, = (c²/2Ï€)âˆš(Î¼/B)38.8kHz27.6kHz21.8kHzf_o, fundamental mode, = (Ï€/S_d)âˆš(B/Î¼)407.7Hz572.5Hz724.3Hzm_s, panel mass0.23g0.26g0.29g

The following Table 4 shows a list of thin FELIOSÂ® R-F775 polyimide panels which were used as single layer thin diaphragms with copper, on one or both sides of the diaphragm, chosen to optimize mass distribution.

TABLE 4MaterialR-F775R-F775 4 milR-F775 2 milR-F775 1 mil0.5 milt_p, panel thickness101.60Î¼m50.80Î¼m25.40Î¼m12.70Î¼mm_spanel mass0.542g0.271g0.135g0.068gB, bending stiffness0.00473Nm0.00118Nm0.000296Nm0.000074Nm

Example Magnet Structure

The magnet assembly consists of two identical magnet sub-assemblies opposing each other. The magnet-sub assembly comprises two compression bonded (BNP-10) Neodymium ring magnets of the same width and with isosceles trapezoid (isosceles trapezium in UK English) cross-section at 45Â° within a magnet cup or a holder of low carbon steel. The planar structural voice-coil diaphragm is suspended symmetrically in the air-gap between the magnet sub-assemblies.

The central radius of the ring magnet sub-assembly is determined by the mean drive-point at the fundamental mode (f_o) node radius r_oat 0.68a=23.1 mm (where a=34.1 mm is the diaphragm radius) of the circular panel of diameter D=68.2 mm. The magnet width w_m=5.25 mm is chosen such that the total active planar magnet area (x %) is between 30%-45% of the diaphragm area S_dgiven by w_m=x % (a²/4.r_o)=x %(0.184D). In this case w_m=5.25 mm is given by a magnet area x %=42% of the Diaphragm area, S_d. The magnet height h_m=1.5 mm and thickness t_cup=0.38 mm of the low carbon steel used to fabricate the magnet cup are optimized by FEA (finite element analysis) magnet simulation to minimize magnet material using a law of diminishing returns to get <B>, the average magnetic flux density within 5% of the maximum <B>_max. Other magnet dimensions were thus chosen as follows: Inner ring magnet, inner diameter=36.0 mm, inner ring, outer diameter=outer ring, inner diameter=46.5 mm, outer ring, outer diameter=57.0 mm, and magnet cross-section is isosceles Trapezoid, 45Â° so that the opposing pole pieces have a width of 2.25 mm.

A two magnet sub-assembly was chosen empirically by FEA magnet computer simulation optimization to minimize the amount of magnet material used. It was observed that 1) two ring magnets give better performance (greater than 500% of motor force product BL) than one magnet with the same amount of material, 2) a material optimized three ring magnet sub-assembly of the same magnet area also has inferior performance to a two ring magnet optimized solution and, 3) the 45Â° isosceles trapezoid magnet structure not only facilitates easy location of the ring magnets within the steel cup but also provides improved linearity in the magnetic field within the air-gap traversed by the voice-coil and diaphragm.

Rectangular cross-section ring magnets with the same amount of material and the same magnet height in the same magnet cup gives similar results but fabricating and the locating the magnets in the cup is more difficult compared to the trapezoid section magnets whose position in the cup is uniquely defined by geometry. The following table, Table 5 shows the dimensions of the magnet sub-assembly for trapezoid and rectangular cross-section ring magnets which use the same cup and same mass of magnet materials.

TABLE 5Trapezoid and Rectangularring magnets with equalaverage diameter andcross-sectional areaTapezoidRectangularcross-sectioncross-sectionmagnet height, h_mâ€‚1.50 mmâ€‚1.50 mmmagnet base width, w_mâ€‚5.25 mmâ€‚3.75 mmmagnet pole piece width, wpâ€‚2.25 mmâ€‚3.75 mmouter ring magnet outer diameter, D457.00 mm55.50 mmouter ring magnet inner diameter, D346.50 mm48.00 mmouter ring magnet average diameter,51.75 mm51.75 mm(D3 + D4)/2inner ring magnet outer diameter, D246.50 mm45.00 mminner ring magnet inner diameter, D136.00 mm37.50 mminner ring magnet average diameter,41.25 mm41.25 mm(D1 + D2)/2steel magnet cup inner diameter, D534.50 mm34.50 mmsteel magnet cup outer diameter, D558.50 mm58.50 mm

Simulations Results

Simulations were carried out on two classes of diaphragm, 1) thin monolith panels using the FPC voice-coil fabricated on thin polyimide panels (see Table 4 for mechanical properties) and 2) ROHACELLÂ® core sandwich panels with the FPC voice-coil fabricated on the polyimide skins of the panels (see Table 3 for mechanical properties). The results are presented in the following table, Table 6 and summarizes a sample of the simulation results obtained for magnet assemblies using compression bonded Neodymium magnets of BNP-10 strength.

TABLE 6Roh1lyx2-Roh2lyx2-GP-PE-2Lyr Â¼ oz Â½ milÂ½ oz Â½ milÂ¼ oz Â½ mil2Lyr Â½ oz 4 mil4Lyr 10u Al 1 milS_d3.65Eâˆ’033.65Eâˆ’033.65Eâˆ’033.65Eâˆ’033.65Eâˆ’03m²Ï _a1.2251.2251.2251.2251.225kgm^âˆ’3Bl0.992.12.11.972.03TmM_ms1.30Eâˆ’045.80Eâˆ’045.80Eâˆ’041.04Eâˆ’032.60Eâˆ’04kgR_e25.125.425.425.126.8Î©SPL94.68 dB88.16 dB88.16 dB82.59 dB94.59 dB1 W/1 m

The power sensitivity results are converted from SPL at 1 W/1 m to SPL 1 mW/1 cm as shown in Table 7 below, in order to estimate the headphone sensitivity levels which correspond to SPL at the ear. These are then converted to voltage sensitivity levels (Voltage Sensitivity_Sv) for comparison with the typical data published on headphone sensitivities.

TABLE 7PowerImpedanceX = 30 âˆ’VoltageSimulation ModelSensitivity_EpRe10 * log10(Re)Sensitivity_Sv1Lyr Â¼ oz Â½ mil-BNP-10104.7 dB/mW25.10 Î©16.0 dB120.7 dB/V1Lyr Â¼ oz Â½ mil-Nd37110.7 dB/mW25.10 Î©16.0 dB126.7 dB/V2Lyr Â¼ oz Â½ mil-BNP-10104.7 dB/mW25.10 Î©16.0 dB120.7 dB/V2Lyr Â¼ oz Â½ mil-Nd37110.7 dB/mW25.10 Î©16.0 dB126.7 dB/VRoh1lyx2-Â½ oz Â½ mil-BNP-10â€‚98.2 dB/mW25.40 Î©16.0 dB114.2 dB/VRoh1lyx2-Â½ oz Â½ mil-Nd37104.2 dB/mW25.40 Î©16.0 dB120.2 dB/VRoh1lyx2-Â¼ oz Â½ mil-BNP-10â€‚98.2 dB/mW25.40 Î©16.0 dB114.2 dB/VRoh1lyx2-Â¼ oz Â½ mil-Nd37104.2 dB/mW25.40 Î©16.0 dB120.2 dB/VGP-2Lyr Â½ oz4mil-BNP-10â€‚92.6 dB/mW25.10 Î©16.0 dB108.6 dB/VGP-2Lyr Â½ oz4mil-ND37â€‚98.6 dB/mW25.10 Î©16.0 dB114.6 dB/V

The results shown here for a 68.2 mm diameter optimized large diaphragm headphone driver is one example, according to this disclosure. One expects that other sizes, both larger and smaller, can be scaled with the same cost performance benefits demonstrated with these results. For example, the data in column â€œVoltage Sensitivity_Svâ€ of Table 7 shows the SPL for various configurations.

The diaphragm disclosed in this disclosure, in some examples may be a planar diaphragm. In some examples, the diaphragm may be a panel form diaphragm. In some examples, the diaphragm may be a conical diaphragm. For example, a portion of the movable portion of the diaphragm may be shaped as a cone. In some examples, the diaphragm may be a dome shaped diaphragm. For example, a portion of the movable portion of the diaphragm may be shaped as a dome. In some examples, the diaphragm may be referred to as a sandwich panel diaphragm, where the diaphragm may have a plurality of layers of materials, to provide a desirable substrate for the diaphragm. In some examples, one or more layers of the substrate for the diaphragm may include a metal surface and the metal surface may be selectively etched or removed to form the coil over the diaphragm.

While embodiments of the present invention are described above with respect to what is currently considered its preferred embodiments, it is to be understood that the invention is not limited to that described above. To the contrary, the invention is intended to cover various modifications and equivalent arrangements within the spirit and scope of the appended claims.