FIELD OF THE INVENTION

The present invention relates to transfer of heat. The transfer of heat may be by thermosiphon blocks, thermosiphons or thermosiphon systems configured to be used or assembled to transfer heat. The thermosiphon blocks are configured for a refrigerant to circulate between a first header and a second header interconnected with a fluid communicator arrangement comprising multiple MPE-tubes with fins in-between. The first header may have a receiving volume adapted to receive liquid refrigerant and to distribute the liquid refrigerant to the second header via a liquid communicator. The block may be sealed.

The invention also relates to a thermosiphon system comprising at least a first thermosiphon block. The first thermosiphon block may be configured as an evaporator with the receiving volume in the first header connected to a condenser. The thermodynamic system may have a piping between the first thermosiphon block and the condenser. The first thermosiphon block may be configured to be placed inside of a building, housing or a cabinet.

BACKGROUND OF THE INVENTION

Thermosiphons are known to be efficient heat exchangers including cooling. Generally a thermosiphon has a condenser and an evaporator that are interconnected by separate pipes for transferring a refrigerant between the evaporator and the condenser. There may be a valve in the pipes to control the flow of the refrigerant. In a configuration the evaporator is inside a cabinet to be cooled, and the condenser outside a cabinet and the thermosiphon are configured so that when the temperature in the cabinet reaches approaches a set point the valve closes, and the liquid from the condenser cannot enter the evaporator. All refrigerant will then evaporate from the evaporator into the condenser and condense inside the condenser. As a consequence the thermosiphon stops.

When the temperature in the cabinet rises, the valve will open again and the refrigerant can again enter the evaporator and the thermosiphon operates again.

It is known that the valve can be placed in the pipes. To operate as intendedâ€”or nearly as intendedâ€”very complicated valves have to be designed, precisely manufactured, and tested. To overcome observed problems and to refine the valves persons skilled in the art have to focus on designing very refined valves. Design of such valves may attend details about valve parts such as housing and a valve lid. Such valves may also include a bellow that operates in the housing and attention is to a bellow guide, a bellow washer, a bellow stop, and a bellow filling tube.

Besides being complicated structures, the valves constructed from such valve parts have been shown to be expensive.

Patent application EP 2031332 by ABB Research Ltd describes a heat exchanger formed as a thermosiphon block. The thermosiphon block has â€œhalf-finsâ€ between the MPE-tubes and with half-fins towards one side at one header and with half-fins towards the opposite site at the opposite header to define a circulation of refrigerant in each MPE having evaporator channels towards the one side and condenser channels at the other side.

Patent application US 2012267088 by BJERRISGAARD describes a heat exchanger formed by a thermosiphon block, which block has a flat pipe bend as a serpentine configuration with a first header in one end of the pipe and with a second header in the other end of the pipe. Each MPE is only connected to an adjacent MPE. If heat is applied unevenly to a evaporator area (e.g. covering say three out of five MPEs), then the refrigerant may â€œboil outâ€ in an area and â€œblockâ€ in another area and thus bring the working of the thermosiphon to an halt.

OBJECT OF THE INVENTION

It is an objective of this invention to overcome one or more of these problems.

DESCRIPTION OF THE INVENTION

An objective may be achieved by a thermosiphon block configured for a refrigerant to circulate between a first header and a second header interconnected with a fluid communicator arrangement comprising multiple MPE-tubes with fins in-between and where the first header has a receiving volume adapted to receive liquid refrigerant and to distribute the liquid refrigerant to the second header via a liquid communicator.

Thereby is achieved a block that can be used to assemble a thermosiphon system. The block may be an essential part of a thermosiphon system that can be installed and operated at low cost since it is simple and the block may be produced at large scale and as a standard element. Such standard blocks will greatly reduce and eliminate faults.

The liquid communicator may be a pipe that allows for the liquid refrigerant to easily flow from the first header to the second header. The receiving volume or a part of the volume may he configured to collect and to funnel liquid to the liquid communicator.

An objective may be achieved by a thermosiphon system comprising at least a first thermosiphon block as disclosed. The first thermosiphon block may be configured as an evaporator with the receiving volume in the first header connected to a condenser. The thermodynamic system may have a piping between the first thermosiphon block and the condenser. The first thermosiphon block may be configured to be placed inside of a building, housing or a cabinet. The condenser may be configured to be placed outside. In between there may be a pipe that can penetrate a wall separating the outside form the inside. The thermosiphon system may be arranged or with means for arranging the system so that liquid from the condenser by gravity easily enters the receiving volume and the thus the liquid communication.

Such arrangement allows establishment of a heat transfer based on identical and passive elements or blocks. One block can be on a warm side of a wall and another block can be on a cold side of a wall with only a narrow piping to penetrate the wall.

In an embodiment of the thermosiphon system the condenser may be a second thermosiphon block. The second thermosiphon block may have the liquid communicator installed or de-mounted.

In an embodiment of the thermosiphon system, the condenser is a second thermosiphon block. The receiving volume of the first block may be connected to the receiving volume of the second block via a piping.

In an embodiment of the thermosiphon system, the first thermosiphon block is configured to be installed inside a wall, the second thermosiphon block is configured to be installed outside the wall and the piping configured to penetrate the wall.

In an embodiment, the thermosiphon block may further comprise a valve in the receiving volume and configured to control the flow of refrigerant to or from the first header through a separator, which valve has a close feature at a closing set-point and an open feature at an opening set point as a function of a pressure in the receiving volume.

The valve operation will be disclosed in details alone and in connection with a particular embodiment. The valve disclosed can be integrated or implemented in the thermosiphon block in a similar vein and the thermosiphon system may be built by a block so that it may be operated more precisely and with a designed mode of operation according to the set-points.

In an embodiment, the receiving volume may be formed as a bellow housing and with a first header tube part formed as a bellow washer.

In an embodiment, a bellow is affixed to the first header part and is expandable towards the separator as a function of the pressure in the receiving volume.

In an embodiment, the valve is integrated in the receiving volume.

In an embodiment, the thermosiphon block may further comprise a partition plate to install the thermosiphon block as a vertical thermosiphon with the first header as a liquid header and the second header as a vapour header, which partition plate partitions the vertical thermosiphon in an evaporator and a condenser.

In an embodiment, the thermosiphon block may further comprise a partition plate to install the thermosiphon block as a horizontal thermosiphon with the first header as a liquid header and the second header as a vapour header, which partition plate partitions the horizontal thermosiphon in an evaporator with the first header having an evaporation section and the second header having an evaporation section and a condenser with the first header having a condenser section and the second header having a condenser section.

In an embodiment at least some fins have a width that is substantially half the width of the width of the MPE-tubes.

In an embodiment, the half-width fins can be freely installed or adjustable in-between MPE-tubes at different depths along the width of the MPE-Tubes according to the section of the MPE-tubes being an evaporator or a condenser.

In an embodiment, the liquid communicator is demountable and the receiving volume re-sealable.

An objective is achieved by a thermosiphon block. The thermosiphon block is configused for a refrigerant to circulate between a first header and a second header interconnected with a fluid communicator arrangement comprising multiple MPE-tubes. In-between the tubes there may be fins. A first header has a receiving volume adapted to receive liquid refrigerant and to distribute the liquid refrigerant to the second header via a liquid communicator. The liquid communicator may be a pipe and arranged in the header so that the liquid refrigerant by gravity will enter the liquid communication.

Thereby is provided an essential part of a thermosiphon system that can be installed and operated at low cost since it is simple and the block may be produced in large quantities.

In an embodiment, the thermosiphon block may comprise a valve in the receiving volume. The valve may be configured to control the flow of refrigerant to or from the first header through a separator, which valve is configured to close at a closing set-point and to open at an opening set point as a function of a pressure in the receiving volume. This may be achieved by a bellow type of valve.

Thereby the thermosiphon may be operated more precisely and with a designed mode of operation according to the set-points. The valve may be a bellow type of valve. The valve may be integrated into the receiving volume. In an embodiment the valve housing is integrated into the receiving volume and the bellow itself may be installed optionally.

In an embodiment of the thermosiphon block, the liquid communicator is demountable and the receiving volume re-sealable. Thereby the same thermosiphon block may be used to assemble a thermosiphon system based on two identical thermosiphon blocks and the liquid communicator installed only where necessary.

In an embodiment of the thermosiphon system the condenser may be a second thermosiphon block. The second thermosiphon block may have the liquid communicator installed or de-mounted.

In an embodiment, the thermosiphon system may further comprise a valve between the first and second thermosiphon blocks.

An objective may be achieved by a thermosiphon block configured for a refrigerant to circulate between a first header and a second header interconnected with a fluid communicator arrangement comprising multiple MPE-tubes with fins in-between, wherein the thermosiphon block is sealed and contains a refrigerant

Such thermosiphon block can be mass produced and is easily modified according to installation. The thermosiphon block requires no external power source.

It is noticed that the block is sealed and prefilled with a refrigerant. The seal may be permanent and as such the thermosiphon block has an internal volume with a refrigerant that enables it to transport heat within the thermosiphon block.

In an embodiment there is a partition plate. The partition plate is configured to install the thermosiphon block as a vertical thermosiphon system with the first header as a liquid header and the second header as a vapour header, which partition plate partitions the horizontal thermosiphon system in an evaporator and a condenser. Thereby the transfer of heat is essentially in the vertical direction.

In an embodiment of the thermosiphon block, the partition plate is configured to install the thermosiphon block as a horizontal thermosiphon system with the first header as a liquid header and the second header as a vapour header, which partition plate partitions the horizontal thermosiphon system in an evaporator with the first header having an evaporation section and the second header having an evaporation section and a condenser with the first header having a condenser section and the second header having a condenser section. Thereby the transfer of heat is essentially in the horizontal direction.

An object of the invention may be achieved by a thermosiphon configured for a refrigerant to interact with a condenser and an evaporator that are interconnected with means for guiding a flow of gaseous refrigerant from the evaporator to the condenser. Such means may be a vapour header. At a lower gravitational level there may be means for guiding a flow of liquid refrigerant to the evaporator when the thermosiphon operates as intended. The thermosiphon may comprise a valve configured to control the flow of the refrigerant from the condenser to the evaporator and to close at a closing set point and to open at an opening set point as a function of the pressure in the thermosiphon. The valve may comprise a bellow configured to act control a flow of refrigerant and or to open and close the flow through a separator separating the condenser and the evaporator. The bellow may be located in a receiving volume of the means for guiding a flow of liquid refrigerant which receives the refrigerant from the condenser. Such means may be a liquid header.

By the provision of a receiving volume adapted to house a bellow an integral valve arrangement is provided. Such integrated valve comprises fewer valve parts than a valve unit installed separately.

Although adjustment or customisation is still needed to make the valve open at an opening set point and to close at a closing set point, the disclosed construction involves fewer parts that can be adjusted and fewer parts that will change with pressure and temperature variations.

Furthermore, the integrated valve assembly will be easier to construct since fewer elements have to be attached or affixed to each other.

Although the means for guiding a flow of gaseous refrigerant from the evaporator to the condenser, which may be a vapour header, and the means for guiding a flow of liquid refrigerant to the evaporator, which may be a liquid header, are described to placed relatively to each in relation to gravitational level this is understood to be when placed for operation and when the operates as intended. However for the structural elements and such reference may not be required.

A person skilled in the art will appreciate that the thermosiphon disclosed has elements such as the condenser, the evaporator and the refrigerant that are described with reference to the intended operation of the thermosiphon. As such the evaporator and the condenser may be similar structural elements but, they will have clear and distinctive functions when the thermosiphon is assembled for operation.

In an embodiment the thermosiphon may be configured for a refrigerant to interact with a condenser and an evaporator. The interaction may be provided by the condenser and evaporator being interconnected with gas pipe. One pipe may be configured to guide a flow of gaseous refrigerant from the evaporator to the condenser. One pipe may be configured as a liquid pipe configured to guide liquid refrigerant from the condenser to the evaporator. This is understood to be when the thermosiphon is operating as intended. Normally a condenser will be placed at a gravitational level that is higher than that of the evaporator so that the refrigerant by gravity will be directed from the condenser towards the evaporator in the liquid pipe. The thermosiphon may comprise a valve configured to control the flow of the refrigerant and to close at a closing set point and to open at an opening set point. The valve may comprise a bellow acting to open and close the valve and which bellow is located in a receiving volume of a header receiving the refrigerant from the liquid pipe and which receiving volume is separated by a valve seat from a distribution volume for distributing the refrigerant for evaporation.

In an embodiment the means for guiding a flow of liquid refrigerant is formed as a liquid header with Micro Channel Heat Exchangers entering the liquid header as multi-port extrusions (MPEs).

The MPEs may in an embodiment not be established from entering the receiving volume thus further ensure more controlled environment in the receiving volume and thus more stable and precise expansion or contraction of the bellow and thus the opening and closing of the valve.

In an embodiment the receiving volume is formed as a bellow-housing and a header part which may be the end of the header is formed as a bellow washer and the bellow is affixed to the header part and is expandable towards the separator as a function of the pressure in the thermosiphon.

Hence structural elements of the header are used to form the housing and thus by forming the valve of integral parts of the thermosiphon, the thermodynamic conditions of refrigerant and or the majority of the thermosiphon is in closer contact with the bellow and thus ensures consistent operation as intended.

In an embodiment the valve is integrated in the header of the evaporator. The integration may be of different levels of integration. In an embodiment integration is an encapsulation or embedding of the valve. In an embodiment integration of the valve is in the same material and the valve and header is a monolith structure.

In an embodiment the valve parts including at least the bellow, the separator, and the header part each are affixable to each other. The parts may be made by brazable, solderable, weldable, and/or glueable materials. Thus, providing for an easy assembly of the parts and ensuring properties that allow for effective heat transfer and expansion or contraction that is similar.

Thereby, allowing the parts to be connected or assembled in an easy fashion. Also by using parts that are brazable results in a structure that, besides being easier to manufacture also, allows the valve to reflect and act on the thermodynamic conditions of the thermosiphon and thus to operate consistently as intended.

In an embodiment the bellow comprises a non-condensable gas. The non-condensable gas may be designed so that it is non-condensable in the operation temperature level for which the thermosiphon is intended to operate. The bellow with a non-condensable gas may be used and the bellow will provide a highly efficient component that will also respond to changing temperatures. The non-condensable gas may have a pressure near the boiling temperature/pressure of the operating refrigerant in the thermosiphon.

Thus, it is only a matter of selecting the pressure to define the operating temperature of the valve that is to be used inside the bellow. Alternatively refrigerants or a mixture of several refrigerants could be used instead of a gas or a non-condensable gas. By using a gas mixture is should be possible to adjust the boiling point rather precisely in a way so that boiling will occur over a temperature range. The internal pressure and bellow may make it possible also to use springs, maybe a spring that operates against the opening direction of the bellow, so that as soon as the pressure in the thermosiphon is reduced the spring contributes to opening the valve and vice versa.

The operating refrigerant is outside the bellow and the pressure of this is acting on the bellow. When the temperature/pressure of the saturated operating refrigerant is higher than the non-condensable gas inside the bellow the valve is open. When the saturation temperature/pressure inside the thermosiphon falls below the non-condensable pressure inside the bellow plus the force from the bellow spring times the area, the bellow begins to close.

The operational band of the bellow may be defined by the pressure differentials of the bellow and/or the spring characteristics.

The bellow may have spring characteristics. It should also be possible to use a bimetal spring which bimetal spring automatically changes its length independently of the temperature. The valve piston could be fixed through one end of the bimetal spring, and the other end could be fixed in relation to the tubing.

In an embodiment the condenser and the evaporator are interconnected with a gas pipe configured to guide a flow of gaseous refrigerant from the evaporator to the condenser and a liquid pipe configured to guide liquid refrigerant from the condenser to the evaporator and into the receiving volume.

In an embodiment the thermosiphon is configured so that during intended operating the condenser is placed at a gravitational level that is higher than that of the evaporator, so that the refrigerant by gravity will be directed from the condenser towards the evaporator in the liquid pipe and onto the bellow.

In an embodiment the evaporator and condenser have a common means for guiding a flow of gaseous refrigerant for guiding a flow of gaseous refrigerant from the evaporator to the condenser and a common means for guiding a flow of liquid refrigerant denser to the evaporator.

The common vapour header may constitute a substantial part of the common means for guiding a flow of gaseous refrigerant for guiding a flow of gaseous refrigerant from the evaporator to the condenser.

In an embodiment the valve is located in a receiving volume of the common means for guiding a flow of liquid refrigerant which may be a common liquid header, and wherein the separator separates the common means for guiding a flow of liquid refrigerant, which may be a common liquid header, in an evaporator section and a condenser section.

An object of the invention is achieved by a method of producing a thermosiphon. The thermosiphon may be configured for a refrigerant to interact with a condenser and an evaporator that are interconnected with means for guiding a flow of gaseous refrigerant, which may be a vapour header, from the evaporator to the condenser, and at lower gravitational level means for guiding a flow of liquid refrigerant to the evaporator when the thermosiphon operates as intended, which thermosiphon comprises a valve configured to control the flow of the refrigerant from the condenser to the evaporator and to close at a closing set point and to open at an opening set point as a function of the pressure in the thermosiphon. The method may comprise actions of:

Providing valve parts comprising a bellow, which valve parts are configured to be affixed to the means for guiding a liquid refrigerant to the evaporator, which may be a liquid header.

Providing condenser parts configured to be assembled to be interconnected with an evaporator.

Providing evaporator parts configured to be assembled to be interconnected with the condenser and to have the valve parts affixed in a in a receiving volume of the assembled evaporator.

Affixing the valve parts to at least some evaporator parts or to the condenser to form an evaporator with an integrated valve inside the evaporator when assembled.

Assembling the thermosiphon of the evaporator parts and condenser parts interconnected with means for guiding gaseous refrigerant to the condenser, which may be a vapour header, and means for guiding a liquid refrigerant to the evaporator, which may be a liquid header.

Thereby, the actions form a thermosiphon with the bellow enabled to act to open and close the valve and which bellow is located in a receiving volume of a liquid header configured to receive the refrigerant when operating the thermosiphon as intended.

In an embodiment the action of affixing the valve parts is performed by brazing the valve parts to the evaporator parts to form an evaporator with an integrated valve.

A person skilled in the art will appreciate that brazing may be part of a process of melting, heating or alike may be used interchangeably. And in an embodiment the action of affixing comprises an act of baking or heating the evaporator parts with the valve part parts affixed.

In an embodiment the actions of providing condenser parts and providing evaporator parts involves providing parts to form a evaporator and condenser that have a common means for guiding a flow of gaseous refrigerant, which may be common vapour header for guiding a flow of gaseous refrigerant from the evaporator to the condenser and a common means for guiding a flow of liquid refrigerant, which may be a common liquid header for guiding a flow of liquid refrigerant from the condenser to the evaporator.

In either embodiments of the header the single or the common, the valve parts may be integrated into the header as part of the process or actions of establishing the header. As such the actions of establishing the evaporator and/or the condenser may include sub actions of establishing the header with the valve.

Thus, an even simpler process of making a thermosiphon is accounted for.

In an embodiment the act of affixing involves actions of affixing the valve parts in the receiving volume of the common means for guiding a flow of liquid refrigerant, which may be common liquid header that separates the common means for guiding a flow of liquid refrigerant, which may be a common liquid header in a evaporator section and a condenser section.

On objective of the invention may be achieved by a thermosiphon including an evaporator section and a condenser section, the sections containing a fluid occurring in gas form as well as in liquid form, the evaporator section including MPE tubes for conducting the fluid in its gas form in the micro-channels of the MPE tube, and also including Zipper fins projecting from at least one surface of the MPE tubes, the condenser section including MPE tubes for conducting the fluid in its liquid form in the micro-channels of the MPE tube and also including Zipper fins projecting from at least one surface of the MPE tubes of the condenser section.

The invention also concerns a method for temperature regulation of an ambient medium by a thermosiphon according to the invention, wherein hot air is supplied to the evaporator section and cold air is supplied to the condenser section. The invention further concerns use of the thermosiphon and the method.

The principle of a thermosiphon comprises evacuation of a hermetically sealed enclosure and then filling it with a suitable fluid supplied with heat in an evaporator section of the thermosiphon and evaporates, and then condenses in a condenser section of the thermosiphon, thereby giving off heat. The condensed liquid is returned to the evaporator section. The thermal conduction by this evaporation and condensation process is significantly greater than the thermal conductivity of e.g. metals, and the thermosiphon principle is therefore suited for heat exchange and cooling purposes.

The fluid in the thermosiphon may consist of a single chemical species or it may consist of a mixture of several chemical species, e.g. in the form of an azeotropic or near azeotropic mixture.

The thermosiphon has an internal geometry including an internal closed circuit enabling performing the mentioned two-phase cycle. Since a thermosiphon is a hermetically closed, two-phase system, and only pure liquid and gas are present in the internal hermetically sealed enclosure, the fluid will remain saturated as long as the operational conditions for the thermosiphon is between the triple point of the fluid and its critical point.

Originally developed for the automobile industry, conventional heat exchangers based on the thermosiphon principle have achieved wide commercial distribution for cooling of electronics. The principle has the unquestionable advantage that the cycle can be run without need of movable parts.

This type of heat exchangers are constructed with exchanger sections of a number of flat tubes arranged in parallel, with ducts in which the fluid flows, and equipped with corrugated fins (Zipper fins) of the Louver type for heat exchange with the ambient surroundings. The flat tubes are all connected to several so-called headers which are hollow pipes. The entire construction is typically made of aluminium and can be soldered in a conveyor oven in a single process. Conventional heat exchangers typically consist of two (or more) such exchanger sections of which at least one section operates as evaporator section and at least one section operates as condenser section, and where the two or more sections are connected by means of at least one gas-conducting pipe and at least one liquid-conducting pipe and the mentioned headers.

The prior art has several disadvantages: Thermodynamically, the design with a separate evaporator section and a condenser section connected to each other by various pipe connections entail that parts of the heat exchanger cannot be utilised sufficiently effectively in connection with heat absorption as well as heat emission. In particular by cooling of hotspots there is thus a considerable risk that the sectionalised structure of the heat exchanger implies an inexpedient and inefficient cooling, e.g. because the parts of the heat exchanger receiving the greatest heat flux, and therefore with the greatest need for cooling, are poorly cooled.

With regard to construction or design, the prior art has furthermore the drawback that a plurality of headers are to be interconnected by means of connecting pipes in order to enable the liquid and gas flow in the heat exchanger. These connecting pipes, which typically can be both long and tortuous, reduce the cooling capacity in at least two areas: The connecting pipes increase the volume of the heat exchanger without contributing to the cooling capacity, and this capacity is further reduced by limiting the airflow around the heat exchanger.

Besides, the increased internal volume increases the demand for the amount of fluid in the heat exchanger, resulting in cost-related as well as environmental disadvantages.

It is thus the purpose of the present invention to provide a system which does not have the mentioned drawbacks, or which at least will provide a useful alternative to the prior art.

This is achieved by a thermosiphon of the kind indicated in the introduction, wherein the thermosiphon also includes a first header and a second header, and where the MPE tubes of the evaporator section are connected to the first header such that the first header and the micro-channels are in liquid communication with each other, and where the MPE tubes of the condenser section are connected to the second header such that the second header and the micro-channels in the MPE tubes belonging to the condenser section are in gaseous communication with each other, the first header and the second header communicating fluidly directly with each other by the micro-channels from the MPE tubes of the evaporator section as well as the MPE tubes of the condenser section.

Hereby is provided a closed circuit without use of connecting pipes and where the number of headers is further reduced as only two headers are needed. The header is a conventional header, i.e. a pipe with a fluid conducting internal volume. Liquid as well as gas are conducted in part in the same pipeâ€”MPE tube and/or headerâ€”in a cycle as the two media relate to each other such that the liquid will place itself at one end of the tube and the gas at the other end, whereby any exchange will not occur between the two media.

The thermosiphon can hereby be designed such that it comprises a single surface as opposed to the prior art thermosiphons that include at least two separate sections connected by various connecting pipes to header of the other part. By the invention is therefore achieved a compact thermosiphon that takes up very little space compared with the prior art. The two sections can be freely chosen to be placed side by side, i.e. as a flat component, or disposed above each other and thus also here constituting a flat component. In this connection, by flat component is meant that the thermosiphon is an assembled, compact construction where the two sections are not separated from each other but appear as a rectangular surface without air gap between the two sections, and thus without connecting pipes.

By its design, the heat exchanger/thermosiphon according to the invention thus allows that the need for the above mentioned system of connecting pipes is eliminated with consequently reduced volume and reduced demand for fluid. A higher specific cooling capacity and a reduced environmental load are hereby achieved. The heat exchanger/thermosiphon can be designed with optional height and width, and with an inner geometry allowing for the circulation.

The geometry thus includes an evaporator section where the fluid is evaporated while absorbing heat. The fluid is conducted from the first header, where the fluid is in liquid form, up into the micro-channels of the MPE tubes where it changes into gas, and further on to the condenser section where the gas is condensed. The gas is conducted via the second header to the MPE tubes where it is condensed and where the MPE tube micro-channels belonging to the condenser section act as a drop channel. The fluid is returned under action of gravity to the first header of the lower evaporator section. By a direct fluid connection between the two headers via the micro-channels from evaporator section as well as condenser section is meant that no connecting pipes are interposed in order to ensure the closed circuit.

The heat conduction occurs by metallic thermal conduction. The heat exchange with the ambient surroundings can thus occur by conduction, convection, radiation, or a combination thereof.

The fluid in the heat exchanger/thermosiphon according to the invention is preferably hydrocarbons, fluorinated hydrocarbons, water, ammonium, alcohols or acetone, or azeotropic or near-azeotropic mixtures thereof.

The thermosiphon can be made of an aluminium-based material which is cheap and easy to work. The thermosiphon can advantageously be made of an Al-Si-cladding material which is cheap and easy to work, or be made by means of silflux or composite alloy flux technology.

In a further suitable embodiment according to claim 2, between the Zipper fins located in the condenser section and the Zipper fins located in the evaporator section there is provided an area without any Zipper fins and only comprising MPE tubes. It is hereby possible to place a partition plate in the area concerned without interfering with the fins.

In a further suitable embodiment according to claim 3, the MPE tubes of the evaporator section are in direct fluid communication with the MPE tubes of the condenser section whereby the condenser section of the thermosiphon is disposed above the evaporator section. Hereby is achieved a simple construction where the MPE tubes lie uninterrupted between the two sections. This makes it simple to produce a thermosiphon.

In a further suitable embodiment according to claim 4, the Zipper fins of the evaporator section and the Zipper fins of the condenser section have substantially the same width as that of the MPE tubes. It this connection, by width is meant the width of the outer surface of the MPE tubes measured perpendicularly to the micro-channels of the MPE tubes. There is achieved a thermosiphon by which it is possible to place a possible ventilator optionally at one of the sides of the thermosiphon in the evaporator section. A possible ventilator in the condenser section is then disposed at the opposite side of the thermosiphon.

In a further suitable embodiment according to claim 5, the Zipper fins of the evaporator section and the Zipper fins of the condenser section have a width that is substantially half of the width of the MPE tubes, and the Zipper fins of the condenser section are offset in relation to the Zipper fins of the evaporator section in direction perpendicularly to the micro-channels of the MPE tubes. Hereby is achieved a design where there is direct communication from the Zipper fins in the evaporator section to the part of the MPE tubes where the liquid evaporates and rises up towards the condenser section, whereas there is no direct communication between the Zipper fins of the evaporator section and the part of the MPE tubes where the condensed liquid runs down. Correspondingly is achieved a direct communication from the Zipper fins in the condenser section to the part of the MPE tubes where the condensing liquid runs down, whereas there is no direct communication between the Zipper fins of the condenser section and the part of the MPE tubes where the gas is rising.

In a further suitable embodiment according to claim 6, the circumscribed circumference of the thermosiphon is a box-shaped body with a width substantially corresponding to the length of the first or the second header, and a height substantially corresponding to a distance measured between the outer sides of the first header and the second header, and a thickness substantially corresponding to the diameter of the first header or the second header. By the design is achieved a compact unit. By outer sides of the first header and the second header is meant the surfaces on respective headers being farthest away from the opposing header.

In a further suitable embodiment according to claim 7, the thermosiphon comprises several MPE tubes in the condenser section as well as in the evaporator section, and the thermosiphon is terminated in width at each side by a plate piece ending against the most laterally positioned Zipper fins. The Zipper fins are provided between the MPE tubes and soldered/welded or in other heat-conducting ways fastened to the outer sides of the MPE tubes. However, the outermost Zipper fins will, as indicated, be fastened to the end plates by one long side thereof such that the thermosiphon appear compact. The number of MPE tubes in the two sections can be the same or be different depending on the application of the thermosiphon. When the condenser section and the evaporator section are disposed above each other, the number of MPE tubes is the same.

In a further suitable embodiment according to claim 8, the thermosiphon comprises an IP-plate, which IP-plate is located in the area between Zipper fins of the condenser section and Zipper fins of the evaporator section. The plate can be mounted such that the surface distribution of the plate is perpendicular to the longitudinal direction of the micro-channels of the MPE tubes, which will be the case when the evaporator section is located immediately under the condenser section. In case where the condenser section is disposed at the side of the evaporator section, the distributor plate will also be disposed between the two sections but with a surface distribution parallel with the longitudinal direction of the micro-channels of the MPE tubes.

The invention also concerns a method as indicated in the introduction, wherein the liquid from the first header is heated in the evaporator section, rises in the MPE tube belonging to the evaporator section, and reaches the second header in gas form, and wherein the gas is condensed into liquid in the condenser section of the thermosiphon, preferably from the side from where air is entering, and thus drops from an(?) area exiting the second header down into the first header via the MPE tubes belonging to the condenser section.

The invention also concerns use of a thermosiphon as indicated above and a method as indicated above for heat recycling in housing and for cooling, preferably for cooling electronic components.

In a further suitable embodiment, all the MPE tubes conduct the fluid in gas form as well as in liquid form.

In a further suitable embodiment, the thermosiphon is made of a heat-conducting metal, preferably of an aluminium alloy.

In a further suitable embodiment, Zipper fins in the evaporator section as well as in the condenser section are designed with Louver fins.

In a further suitable embodiment, the MPE tubes in the condenser section function as drop channel for the condensed/condensing fluid.

A person skilled in the art will appreciate the equivalences of the systems and methods disclosed herein.

DESCRIPTION OF THE DRAWING

Embodiments of the invention will be described in the figures, whereon:

The invention is described by example only and with reference to the drawings, whereon:

FIG. 1 illustrates a thermosiphon with a condenser at a gravitational level higher than the evaporator;

FIG. 2 illustrates a thermosiphon with a valve placed in an interconnecting pipe between the condenser and the evaporator;

FIG. 3 illustrates a thermosiphon where the valve is located in a receiving volume in a liquid header and a close-up of the receiving volume;

FIG. 4 illustrates A) a valve that is closed and B) a valve that is open;

FIG. 5 illustrates a thermosiphon with a common means for guiding a flow of liquid refrigerant here a common liquid header, for guiding a flow of liquid refrigerant from the condenser to the evaporator and an evaporator and condenser have a common means for guiding a flow of gaseous refrigerant here common vapour header;

FIG. 6 illustrates a thermosiphon with a common liquid header with a valve a in a receiving volume;

FIG. 7 illustrates actions of producing a thermosiphon with an integrated valve;

FIG. 8 shows a first embodiment of a thermosiphon according to the invention;

FIG. 9 shows a second embodiment of a thermosiphon according to the invention;

FIG. 10 shows the thermosiphon of FIG. 1 or 2 placed in a shelter;

FIG. 11 shows Zipper fins including Louver fins for use in a thermosiphon according to the invention;

FIG. 12 shows a third embodiment of a thermosiphon according to the invention;

FIG. 13 shows in continuation of FIG. 12 an embodiment with a valve;

FIG. 14 illustrates a thermosiphon block and vertical and horizontal installations;

FIG. 15 illustrates a thermosiphon block;

FIG. 16 illustrates a split thermosiphon system comprising a thermosiphon block as an evaporator and a thermosiphon block as a condenser;

FIG. 17 illustrates an alternative split thermosiphon system configuration;

FIG. 18 illustrates a split thermosiphon system with a valve;

FIG. 19 illustrates a split thermosiphon system with a valve in a piping between a thermosiphon block as an evaporator and a thermosiphon block as a condenser; and

Detailed Description of the InventionItem noItem1Thermosiphon block3Header - Fist (3I) and Second (3II)4Fluid communicator arrangement5Liquid communicator8Partition plate9Piping10Thermosiphon/Thermosiphon system12Refrigerant14MPE16Fins20Condenser21Condenser parts22Means for guiding gaseous refrigerant to the condenser24Vapor header30Evaporator31Evaporator parts32Means for guiding a liquid refrigerant to the evaporator34Liquid Header40Receiving volume50Valve51Valve parts52Closed53Closing set-point54Open55Open set-point60Bellow62Separator65Bellow housing66Bellow washer/header part67Affixed70Gas pipe72Liquid pipe80Evaporator section of liquid header82Condenser section of liquid header84Evaporator section of vapour header86Condenser section of vapour header100Method of producing110Providing valve parts120Providing condenser parts130Providing evaporator parts140Affixing the valve parts to the evaporator parts150Assembling the thermosiphon

FIG. 1 illustrates a thermosiphon 10 configured to circulate a refrigerant 12 between a condenser 20 and an evaporator 30. As the refrigerant 12 is circulated and distributed in MPEs 14 with fins 16 to cover a large area as possible to efficiently convert heat between the refrigerant 12 and the surroundings.

The condenser 20 is made of condenser parts 21. There are means for guiding gaseous refrigerant to the condenser 20. Those means 22 may include a vapour header 24. The evaporator 30 is made of evaporator parts 31. There are means for guiding a liquid refrigerant to the evaporator 32. Those means 32 may include a liquid header 34.

In the shown embodiment of the thermosiphon 10, the condenser 20 is placed at a gravitational level above the evaporator 30 and the means for guiding gaseous refrigerant to the condenser 22 with the vapour header 24 fed with a gaseous refrigerant 12 via a gas pipe 70 from the evaporator 30. On the return side the evaporator 30 is placed at a gravitational level below the condenser 20 and the means for guiding a liquid refrigerant to the evaporator 32 with the liquid header 34 fed with a liquid refrigerant 12 via a liquid pipe 72 from the condenser 20.

In continuation of FIG. 1 FIG. 2 illustrates a similar configuration of a thermosiphon 10 in which there is a valve 50 inserted in the liquid pipe 72.

The valve 50 comprises valve parts 51 and is configured to close 52 at a closing set point 53 and to open 54 at an open set point 55.

The opening 54 and closing 52 of the valve 50 may be as a function of the pressure in the thermosiphon 10. A person skilled in the art will be able to work between temperature and pressure for different refrigerants 12.

FIG. 3 illustrates a thermosiphon 10 with a condenser 20 and an evaporator 30 and configured with a liquid pipe 72 connecting the condenser 20 and the evaporator 30. The means for guiding a liquid refrigerant to the evaporator 32 includes the liquid header 34 that is configured with a receiving volume 40 receiving the liquid refrigerant 12 from the liquid pipe 72.

The receiving volume 40 includes a separator 63 that separates the condenser 20 and at least a substantial part of the evaporator 30.

The receiving volume 40 is configured with or as a valve 50. In this embodiment the valve 50 function is an integral part of the receiving volume 40 with the separator 62 configured with a hole or a passage from the receiving volume 40 to liquid header 34 or generally the means for guiding a liquid refrigerant to the evaporator 32.

The valve 50 is configured with a bellow 60 and the receiving volume 40 is configured as a bellow housing 65 enclosing the bellow 60. Opposite to the separator 62 there is valve part 51 with the function of a bellow washer in a standard bellow valve. In this embodiment the bellow washer 66 is a header. The bellow 60 is affixed 67 to the bellow washer 66.

Further illustrated is the MPE 14 entering the liquid header 34 of the evaporator 30, extending to the condenser 20 as well as the fins 16.

FIG. 4 illustrates a valve 50 configured to A) close 52 the opening in the separator 62 and to B) open 54 the opening in the separator as the bellow 60 expands or contracts as a function of the pressure in the thermosiphon 10 or the receiving volume 40.

The bellow 60 may comprise or contain a non-condensable gas designed to contribute to open 54 and close 52 at given closing 53 and opening 55 set points.

FIG. 5 illustrates an alternative configuration of a thermosiphon 10 according the invention. There is a condenser 20 and an evaporator 30 configured to circulate a refrigerant 12 by means for guiding gaseous refrigerant to the condenser 22 here configured as a vapour header 24 and by means for guiding a liquid refrigerant to the evaporator 32 here configured as a liquid header 34. Some elements will be recognisable from previous figures.

The evaporator 20 and the condenser 30 share a common liquid header 34 having an evaporator section of the liquid header 80 and a condenser section of the liquid header 82.

In this embodiment the evaporator 20 and the condenser 30 share a common vapour header 24 having an evaporator section of the vapour header 84 and a condenser section of the vapour header 86.

There is a receiving volume 40 with a valve 50 in the evaporator section 80 of the liquid header 34.

FIG. 6 illustrates a cross sectional view of a thermosiphon 10 from FIG. 5 where FIG. 6A illustrates the valve 50 closed 52 and FIG. 6B illustrates the valve 50 open 54.

The receiving volume 40 is adapted as a bellow housing 65 where the bellow 60 is affixed 67 to a bellow washer 66 and configured to expand towards a separator 62 formed to separate the liquid header 34 in a evaporator section 80 and a condenser section 82.

The bellow 60 with a non-condensable gas will expand and contract as a function of the pressure in the liquid header and expand towards the separator 62 to close the connection between the evaporator section 80 and the condenser section 82.

In this configuration there is a gas filling pipe extending from the exterior of the thermosiphon 10 along the liquid header and into the bellow 60.

This gas filling pipe may be configured to adjust the design or composition of the gas inside the bellow to alter or tune the opening and closing of the valve 50. The gas filling pipe may also be configured to adjust the pressure inside the valve thereby allowing for adjusting or tuning of the opening and closing of the valve. The adjustment may be mechanically by a screw.

FIG. 7 illustrates a method 100 of producing a thermosiphon as disclosed in the previous FIGS. 1 to 6.

The method 100 comprises of actions that will be disclosed in the following and which action a person skilled in the art will know can be performed in different sequences.

One action is providing 110 valve parts. The valve parts 51 may comprise or include a bellow 60 and the valve parts 51 are configured to be affixed to the means for guiding a liquid refrigerant to the evaporator 34 that may be the liquid header 34.

One action is providing 120 the condenser parts 21 that are configured to be assembled to be interconnected with an evaporator 30.

One action is providing 130 the evaporator parts 31 that are configured to be assembled to be interconnected with the condenser 20 and to have the valve parts 51 affixed in a receiving volume 40 of the assembled evaporator 20.

One action is affixing 140 the valve parts 50 to at least some evaporator parts 31 or the condenser to form an evaporator with an integrated valve 50 inside the evaporator 50 when assembled.

One action is assembling 150 the thermosiphon of the evaporator parts 31 and condenser parts 21 interconnected with means for guiding gaseous refrigerant to the condenser 22, which may be the vapour header 24, and means for guiding a liquid refrigerant to the evaporator 32, which may be the liquid header 34.

Such actions will form a thermosiphon 10 with the bellow 60 enabled to act to open 54 and close 52 the valve 50. The bellow 60 will be located in a receiving volume 40 of a liquid header 34 configured to receive the refrigerant 12 when operating the thermosiphon 10 as intended.

FIGS. 8 to 13 represent embodiment with features listed in the previous table and features that are equivalents or identical to the previous figures, but are described with equivalent or identical terms, but different numerals. To maintain the same numerals, but to distinguish the numbers, the terms in FIGS. 8 to 13 starts with an X.

noX no FIGS.Hemno1X1thermosiphon102X2evaporator section303X3condenser section204X4fluid125X5evaporator section MPE tubes316X6evaporator section micro-channels of theMPE tube7X7evaporator section Zipper fins168X8filling opening9X9condenser section MPE tubes2110X10condenser section micro-channels of theMPE tube11X11condenser section Zipper fins1612X12first headerâ€ƒ3I13X13second headerâ€ƒâ€‚3II14X14area without Zipper fins15X15IP plateâ€‚816X16Louver fins 1617X17end plates18X18one end edge of MPE tubes19X19other end edge of MPE tubes20X20hot air arrow21X21cold air arrow22X22shelter23X23fluid movement24X24first position25X25second position

FIGS. 8 and 9 show a first and a second example embodiment, respectively, of a thermosiphon 1 according to the invention which will be explained with reference to these two figures.

The thermosiphon X1 comprises an upper part which is a condenser section X3, and a lower part which is an evaporator section X2. The evaporator section X2 includes a first header X12 being a hollow tube in which is provided a filling opening X8 for supplying fluid X4 to the thermosiphon. The filling opening X8 may well be provided at other points, such as in a second header X13 belonging to the condenser section X3. From the first header X12 is provided communication/fluid connection with MPE tubes X5 that extend perpendicularly from the first header X12 and perpendicularly to the longitudinal axis of the latter. The MPE tubes X5 is an abbreviation of Multi-Port Extrusion (MPE) tubes, also termed â€œmicro-channel tubesâ€ . With their large internal surface area they provide efficient heat transmission and are therefore ideal for a thermosiphon.

Zipper fins X7 are fastened between the MPE tubes to the adjacent outer walls of the MPE tubes X5.

FIG. 11 shows a perspective view of Zipper fins X7, X11 that are metal lamellae laid in a corrugated pattern, being a commonly known term within the technical field. Each lamella is equipped with Louver fins X16 which in principle are lamellae projecting from the surface of one of the lamellae of a Zipper fin and with an opening in the Zipper fin where the Louver fin directs the airflow down through the opening. Louver fin is also a well-known technical term within the technical area.

Referring again to FIGS. 8 and 9, the laterally outermost positioned Zipper fins X7, X11 are covered on their lateral side with a plate X17 which is removed at one side for showing the geometry of the Zipper fins X7, X11.

The condenser section X3 is constructed in the same way as the evaporator section, thus including MPE tubes X9 that are a continuation of the MPE tubes X5 provided in the evaporator section X2. The MPE tubes open op in the second header X13.

The difference between FIGS. 8 and 9 is the dimension of the Zipper fins. In FIG. 8, the width of the Zipper fins X7, X11 is substantially identical to the width of the MPE tubes X9, and the Zipper fins X7, X11 in the condenser section X3 and the evaporator section X2 are geometrically identical and disposed in the same way in relation to the MPE tubes X5, X9. In order that the thermosiphon X1 can operate, the hot air supplied to the evaporator section X2 can optionally be supplied to one side of the Zipper fins, and the cold air be supplied to the condenser section X3 opposite the side from where the hot air comes.

In FIG. 9, the Zipper fins X7, X11 in both sections have substantially half the width of the MPE tubes X5, X9, and they are disposed mutually offset such that Zipper fins X7 in the evaporator section X2 can be placed so that their outer end edge is flush with one end edge X18 of the MPE tubes. Zipper fins X11 in the condenser section X3 are then placed with their outer end edge flush with the other end edge X19 of the MPE tubes. In this case, the hot airâ€”shown by arrow X20â€”is to be fed to evaporator section X2 to the surface where Zipper fins are flush with the end edge X18 of the MPE tubes, and the cold airâ€”shown by arrow X21â€”is fed in the condenser section 3 to the opposite surface of the thermosiphon X1. The movement of the fluid inside the thermosiphon is shown by arrow X23. There is an area X14 without any Zipper fins between Zipper fins in the condenser section X3 and evaporator section X2. An IP plate X15 can be inserted here, as shown on FIG. 10. This is a partition plate separating the two sections.

The thermosiphon X1 therefore operates by hot air being supplied to the evaporator section X2. The liquid in the evaporator section X2 will hereby be heated and transformed into gas, rising from the lower part of the evaporator section 2 of the thermosiphon and up into the MPE tubes X5 in the part of the micro-channels lying against the heated outer surface. For this reason it is important that the hot air is supplied to the proper side in the embodiment shown in FIG. 9. The gas reaches the second header X13, is cooled in the MPE tubes X9 and transformed into liquid. The liquid will by the action of gravity drop down through the MPE tubes X5, X9 at the side opposite the part of the micro-channels at which the gas rose up. The liquid is collected in the first header X12, and a new cycle can be initiated.

As mentioned, FIG. 10 shows a thermosiphon XI as shown in FIG. 8 or 9 provided in a shelter X22. It may suitably be supplemented with ventilators that are provided at position X24 in the evaporator section X2 and at position X25 in the condenser section X3, and therefore at each their side of the thermosiphon.

FIG. 12 shows a third embodiment of a thermosiphon X1 according to the invention where the two sections, condenser section X3 and evaporator section X2, are disposed side by side. The first header X12 thus communicates with the MPE tubes X5, X9 in the condenser section X3 as well as in the evaporator section X2, and the second header X13 is communicating with the MPE tubes X5, X9 in the condenser section X3 as well as in the evaporator section X2. This is in contrast to the two previous examples where the first header X12 is in fluid communication with the MPE tubes X5 belonging to the evaporator section X2, and the second header X13 is communicating with the MPE tubes X9 belonging to the condenser section X3. The principle in the operation is the same for the thermosiphon X1 shown in FIG. X5 as for the previously described examples as heat is supplied to the evaporator section X2 and cold is supplied to the condenser section X3. The liquid rises up in the MPE tubes in the evaporator section from the first header X12 to the second header X13 and is transformed into gas under way to the second header X13, and from here the gas seeks towards the cold area in the second header X13. The gas condenses in the condenser section X3 and drops by the action of gravity down through the MPE tubes belonging to the condenser section X3 and down into the first header X12.

The remaining reference numbers indicated on the figure represent the same technical components as indicated above.

FIG. 13 shows in continuation of FIG. 12 an alternative embodiment with a filling opening X8 at the end of the first header X12 and a valve 50. The valve is shown as closed 52 and as open 54. The valve 50 is a bellow 60 type of valve with the bellow 60 mounted on a bellow washer 66 and operating against a separator 62. The bellow washer 66 may be an integrated part of the header and the separator may be an integrated part of the header.

FIG. 14A shows a thermosiphon block 1 configured for a refrigerant 12 to circulate between a first header 3I and a second header 3II interconnected with a fluid communicator arrangement 4 comprising multiple MPE-tubes 14 with fins 16 in-between where the thermosiphon block 1 is sealed and contains a refrigerant 12.

FIG. 14B shows a thermosiphon block 1 with a partition plate 8 installed between the first and second headers 3I,3II and essentially parallel. The shown embodiment is a vertical thermosiphon system 10A where the transfer of heat is essentially in the vertical direction.

FIG. 14C shows a thermosiphon block 1 with a partition plate 8 installed to divide the headers 3I,3II and essentially being parallel with the MPE-tubes in the communicator arrangement 4. The shown embodiment is a horizontal thermosiphon system 10B where the transfer of heat is essentially in the horizontal direction.

FIG. 15A shows a thermosiphon block 1 configured for a refrigerant 12 to circulate between a first header 3I and a second header 3II interconnected with a fluid communicator arrangement 4 comprising multiple MPE-tubes 14 with fins 16 in-between. The thermosiphon block 1 has a receiving volume 40 in the first header 3I and a communicator 5 between the receiving volume 40 and the second header 3II.

FIG. 15B shows cross section of a thermosiphon block I with only the MPE-tubes 14 shown. The receiving volume 40 is part of an extension of the first header 3I. The liquid communicator 5 is seen to enter the first header 3I in the receiving volume 40 so that refrigerant in the liquid phase can run through the communicator 5 or pipe directly into the second header 3II.

FIG. 16 illustrates a split thermosiphon system 10 comprising thermosiphon block 1 as an evaporator 30 and a condenser 20. The condenser 20 may be thermosiphon block 20 which in this embodiment is shown without the liquid communicator 5.

FIG. 16 also illustrates the thermosiphon system 10 installed in a housing with a first thermosiphon block 1I as an evaporator 30 and a second thermosiphon block 1II as a condenser 20. This system only requires a relatively small hole in the wall.

FIG. 17 illustrates an alternative configuration of a split thermosiphon system 10 with additional piping 9. The piping 9 may be bent as shown to allow for the first and second thermosiphon 1I, 1II facing the wall taking up less space away from the wall. In his embodiment the evaporator 30 is a first thermosiphon block 1I with the first header 3I via the piping 9 connected to the second header 3II of a second thermosiphon 1II forming the condenser 20.

FIG. 18 illustrates a split thermosiphon system 10 in continuation of FIG. 3 and with a valve. The valve 50 may be installed in the receiving volume 40 of the first thermosiphon block as the evaporator. The valve 50 may be a bellow type of valve 50 configured to operate as a function of the temperature/pressure in the receiving volume 40.

FIG. 19 illustrates a split thermosiphon system 10 in continuation of FIGS. 3 and 4 with a valve 50 in a piping 9 between a first thermosiphon block 1I as an evaporator 30 and a second thermosiphon block 1II as a condenser 20. Here the valve 50 is configured to operate as a function of the pressure/temperature in the pipe 9. The pipe 9 with the valve 50 may be a common volume with the receiving volume 40.

Certain specific aspects of the invention may be expressed in terms of the following ITEMS.

Item 1: A thermosiphon X1 including an evaporator section X2 and a condenser section X3, the sections X2, X3 containing a fluid X4 occurring in gas form as well as in liquid form, the evaporator section X2 including MPE tubes X5 for conducting the fluid X4 in its gas form in the micro-channels of the MPE tube X5, and also including Zipper fins X7 projecting from at least one surface of the MPE tubes X5, the condenser section X3 including MPE tubes X9 for conducting the fluid X4 in its liquid form in the micro-channels of the MPE tube X9 and also including Zipper fins X11 projecting from at least one surface of the MPE tubes X9 of the condenser section X3, characterised in that the thermosiphon XI includes a first header X12 and a second header X13, and that the MPE tubes X5 of the evaporator section X2 are connected to the first header X12 such that the first header X12 and the micro-channels are in liquid communication with each other, and that the MPE tubes X9 of the condenser section X3 are connected to the second header X13 such that the second header X13 and the micro-channels in the MPE tubes X9 belonging to the condenser section X3 are in gaseous communication with each other, the first header X12 and the second header X13 communicating fluidly directly with each other by the micro-channels from the MPE tubes X5 of the evaporator section X2 as well as the MPE tubes X9 of the condenser section X3.

Item 2: A thermosiphon X1 according to item 1, characterised in that between the Zipper fins X11 located in the condenser section X3 and the Zipper fins X7 located in the evaporator section 2X there is provided an area X14 without any Zipper fins X7, 11X and only comprising MPE tubes X5, X9.

Item 3: A thermosiphon X1 according to item 1 or item 2, characterised in that the MPE tubes X5 of the evaporator section X2 are in direct fluid communication with the MPE tubes X9 of the condenser section X3, by which the condenser section 3 of the thermosiphon is disposed above the evaporator section X2.

Item 4: A thermosiphon X1 according to any preceding items, characterised in that the Zipper fins X7 of the evaporator section X2 and the Zipper fins X11 of the condenser section X3 have substantially the same width as the width of the MPE tubes X5, X9.

Item 5: A thermosiphon X1 according to item 1, item 2 or item 3, characterised in that the Zipper fins X7 of the evaporator section X2 and the Zipper fins X11 of the condenser section X3 have a width that is substantially half of the width of the MPE tubes X5, X9, and that the Zipper fins X11 of the condenser section X3 are offset in relation to the Zipper fins X7 of the evaporator section X2 in direction perpendicularly to the micro-channels of the MPE tubes X5, X9.

Item 6: A thermosiphon X1 according to any preceding item, characterised in that the circumscribed circumference of the thermosiphon X1 is a box-shaped body with a width substantially corresponding to the length of the first X12 or the second X13 header, and a height substantially corresponding to a distance measured between the outer sides of the first header X12 and the second header X13, and a thickness substantially corresponding to the diameter of the first header X12 or the second header X13.

Item 7: A thermosiphon X1 according to any preceding item, characterised by comprising several MPE tubes X5, X9 in the condenser section X3 as well as in the evaporator section X2, and that the thermosiphon X1 is terminated in width at each side by a plate piece X17 ending against the most laterally positioned Zipper fins X7, X11.

Item 8: A thermosiphon X1 according to any preceding item, characterised in that it comprises an IP-plate X15, which IP-plate X15 is located in the area between Zipper fins X7, X11 of the condenser section X3 and Zipper fins of the evaporator section X2.

Item 9: A method for temperature regulation of an ambient medium by a thermosiphon XI according to any preceding items, wherein hot air is supplied to the evaporator section X2 and cold air is supplied to the condenser section X3, characterised in that the liquid from the first header X12 is heated in the evaporator section X2, rises in the MPE tube X5 belonging to the evaporator section X2, and reaches the second header X13 in gas form, and that the gas is condensed into liquid in the condenser section X3 of the thermosiphon, preferably from the side from where air is entering, and thus drops from an area exiting the second header X13 down into the first header X12 via the MPE tubes X9 belonging to the condenser section X3.

Item 10: Use of a thermosiphon X1 according to any of item 1 to 8 and the method according to item 9 for recycling heat in housing and for cooling, preferably cooling of electronic components.

Item 11: Thermosiphon or system 10 configured for a refrigerant 12 to interact with a condenser 20 and an evaporator 30 that are interconnected with means for guiding a flow of gaseous refrigerant from the evaporator 22 to the condenser 20, and at lower gravitational level, means for guiding a flow of liquid refrigerant to the evaporator 32, such as a liquid header 34, when the thermosiphon 10 operates as intended, which thermosiphon 10 comprises a valve 50 configured to control the flow of the refrigerant from the condenser 20 to the evaporator 30 and to close 52 at a closing set-point 53 and to open 54 at an opening set point 55 as a function of the pressure in the thermosiphon 10 wherein the valve 55 comprises a bellow 60 configured to act to open 54 and close 52 a separator 62 separating the condenser 20 and the evaporator 30 and which bellow 60 is located in a receiving volume 40 of the means for guiding a flow of liquid refrigerant 32, such as the liquid header 34, configured to receive the refrigerant 12 from the condenser 20.

Item 12: Thermosiphon 10 according to item 11, wherein the means for guiding a flow of liquid refrigerant 12 is formed as a liquid header 34 with Micro Channel Heat Ex-changers entering the liquid header 34 as multi-port extrusions (MPEs).

Item 13: Thermosiphon 10 according to item 11 or 12 wherein the receiving volume 40 is formed as a bellow housing 65, a header part 66 is formed as a bellow washer and the bellow 60 is affixed to the header part 66 and is expandable towards the separator 62 as a function of the pressure in the thermosiphon 10.

Item 14: Thermosiphon 10 according to item 11 or 12 wherein the valve 50 is integrated in the header 34 of the evaporator 30.

Item 15: Thermosiphon 10 according to any of item 11 to 15 wherein the valve parts including at least the bellow 60, the separator 62, and the header part 66 each are affixable to each other, and made as brazable, solderable, weldable, and/or glueable materials.

Item 16: Thermosiphon 10 according to any of item 11 to 16 wherein the bellow 60 comprises a non-condensable gas.

Item 17: Thermosiphon 10 according to any of item 11 to 16, wherein the condenser 20 and the evaporator 30 are interconnected with a gas pipe 70 configured to guide a flow of gaseous refrigerant from the evaporator 30 to the condenser 20 and a liquid pipe 72 configured to guide liquid refrigerant from the condenser 20 to the evaporator 30 and into the receiving volume 40.

Item 18: Thermosiphon 10 according to item 17 and configured so that, during intended operating, the condenser 20 is placed at a gravitational level that is higher than that of the evaporator 30 so that the refrigerant by gravity will be directed from the condenser 20 towards the evaporator 30 in the liquid pipe 72 and onto the bellow 60.

Item 19: Thermosiphon 10 according to any of item 11 to 16, wherein the evaporator and condenser have a common means for guiding a flow of liquid refrigerant 32 for guiding a flow of liquid refrigerant from the condenser 20 to the evaporator 30 or/and a common means for guiding a flow of gaseous refrigerant 22 for guiding a flow of gaseous refrigerant from the evaporator 30 to the condenser 20.

Item 20: Thermosiphon 10 according to item 19, wherein the valve 50 is located in a receiving volume 40 of the common means for guiding a flow of liquid refrigerant 32 and wherein the separator 62 separates the common means for guiding a flow of liquid refrigerant 32 in a evaporator section 80 and a condenser section 82.

Item 21: Method 100 of producing a thermosiphon 10 configured for a refrigerant 12 to interact with a condenser 20 and an evaporator 30 that are interconnected with means for guiding a flow of gaseous refrigerant from the evaporator 22 to the condenser 20, and at lower gravitational level means for guiding a flow of liquid refrigerant to the evaporator 32 when the thermosiphon 10 operates as intended, which thermosiphon 10 comprises a valve 50 configured to control the flow of the refrigerant from the condenser 20 to the evaporator 30 and to close 52 at a closing set-point 53 and to open 54 at an opening set point 55 as a function of the pressure in the thermosiphon 10; which method 100 comprises actions of:

- providing 110 valve parts 51 comprising a bellow 60, which valve parts 51 are configured to be affixed to the means for guiding a liquid refrigerant to the evaporator 32, such as liquid header 34;
- providing 120 condenser parts 21 configured to be assembled to be interconnected with an evaporator 30;
- providing 130 evaporator parts 31 configured to be assembled to be interconnected with the condenser 20 and to have the valve parts 51 affixed in a in a receiving volume 40 of the assembled evaporator 20;
- affixing 140 the valve parts 50 to at least some evaporator parts 31 to form an evaporator with an integrated valve 50 inside the evaporator 50 when assembled, and
- assembling 150 the thermosiphon of the evaporator parts 31 and condenser parts 21 interconnected with means for guiding gaseous refrigerant to the condenser 22 , such as a vapour header 24, and means for guiding a liquid refrigerant to the evaporator 32, such as a liquid header 34;

to form a thermosiphon 10 with the bellow 60 enabled to act to open 54 and close 52 the valve 50 and which bellow 60 is located in a receiving volume 40 of a liquid header 34 configured to receive the refrigerant 12 when operating the thermosiphon 10 as intended.

Item 22: Method according to item 21 wherein the action of affixing 140 the valve parts 51 is performed by brazing the valve parts 51 to the evaporator parts 31 to form an evaporator 30 with an integrated valve 50.

Item 23: Method 100 according to item 21 or 22 wherein the action of affixing 140 comprises an act of baking or heating 150 the evaporator parts 31 with the valve part parts affixed.

Item 24: Method according to any of item 21 to 23, wherein the actions of providing condenser parts 120 and providing evaporator parts 130 involves providing parts 21, 31 to form a evaporator and condenser that have a common means for guiding a flow of gaseous refrigerant 22 for guiding a flow of gaseous refrigerant from the evaporator 30 to the condenser 20 and a common means for guiding a flow of liquid refrigerant 32 for guiding a flow of liquid refrigerant from the condenser 20 to the evaporator 30.

Item 25: Method according to item 24 wherein the act of affixing 140 involves actions of affixing the valve parts 51 in the receiving volume 40 of the common means for guiding a flow of liquid refrigerant 32 that separates the common means for guiding a flow of liquid refrigerant 32 in a evaporator section 80 and a condenser section 82.