BACKGROUND OF THE INVENTION 0001 1. Field of the Invention 0002 The present invention relates to heat dissipation devices for removing heat from electronic devices, and more particularly to a heat dissipation device including a plurality of individual fin plates that are interlocked together. 0003 2. Description of Prior Art 0004 Conventional heat dissipation devices used for removing heat from electronic devices are mostly formed by extrusion of metallic material. FIG. 4 shows an example of this kind of heat dissipation device. The heat dissipation device comprises a base, and a plurality of pins integrally extending from the base. The pins are relatively thick in comparison with distances defined between each two adjacent pins, due to inherent limitations in extrusion technology. This restricts the number of the pins that can be formed, and a total heat dissipation area that can be provided by the pins. Furthermore, a height of the pins is limited to about 13 times the distance between each two adjacent pins, also due to inherent limitations in extrusion technology. 0005 With the continuing boom in electronics technology, numerous modern electronic devices such as central processing units (CPUs) of computers can operate at very high speeds and thus generate large amounts of heat. The heat must be efficiently removed from the CPU; otherwise, abnormal operation or damage may result. Conventional extruded heat dissipation devices are increasingly no longer able to adequately remove heat from these contemporary electronic devices. 0006 In order to keep pace with these developments in electronics technology, assembled heat dissipation devices have been gaining in popularity. For example, China Patent No. 2462641Y provides an assembled heat dissipation device having a plurality of uniformly dimensioned individual plate fins evenly stacked together. Each fin forms top and bottom flanges. Each flange defines a pair of indents in communication with a main body of the fin, and forms a pair of tabs extending from outer peripheries of the indents respectively. The tabs of each fin are attached on the corresponding flanges of an adjacent fin in the indents. Thus, all the fins are connected together to form the heat dissipation device. However, the fins are connected together only by the attachment of the tabs of each fin in the indents of the adjacent fin. The fins are prone to be disengaged from each other when the heat dissipation device is subjected to shock or vibration during transportation or in operation. Part of or even the entire the stack of fins may collapse.

SUMMARY OF THE INVENTION 0007 Accordingly, an object of the present invention is to provide a heat dissipation device including a plurality of individual fin plates that yield a relatively large total heat dissipation area. 0008 Another object of the present invention is to provide a heat dissipation device including a plurality of individual fin plates attached together so that the heat dissipation device is stable and sturdy. 0009 In order to achieve the objects set out above, a heat dissipation device in accordance with a preferred embodiment of the present invention comprises a base and a plurality of individual fin plates standing side by side on the base. Each fin plate includes a main body, a flange stamped therefrom and a pair of tabs distal from the flange. Each tab defines a split in a middle thereof where it adjoins the corresponding main body and thereby forms a tongue surrounded on three sides by the split. The tongue is coplanar with the fin plate while the flange and the tabs are perpendicular to the fin plate. A slot is defined in each tab adjacent a distal end thereof and isolated from the split. Each flange has a width substantially same as a distance from the tongue to the slot. The flanges of the fin plates are in alignment with each other and attached on the base. The slots of each fin plate receive the tongues of a corresponding adjoining preceding fin plate. The fin plates are formed by successively stamping a moving metal sheet. 0010 Other objects, advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:

BRIEF DESCRIPTION OF THE DRAWINGS 0011 FIG. 1 is an isometric view of a heat dissipation device in accordance with the preferred embodiment of the present invention; 0012 FIG. 2 is an isometric view of a fin plate of the heat dissipation device of FIG. 1; 0013 FIG. 3 is an isometric view of a fin of a heat dissipation device in accordance with an alternative embodiment of the present invention; and 0014 FIG. 4 is an isometric view of a conventional heat dissipation device.

DETAILED DESCRIPTION OF THE INVENTION 0015 Referring to FIGS. 1-2, a heat dissipation device 30 in accordance with the preferred embodiment of the present invention comprises a base 50, and a plurality of individual fin plates 40. Each fin plate 40 is metallic, and the fin plates 40 are formed by successively stamping a moving metal sheet. Each fin plate 40 has a main body 41. A pair of tabs 45 extends perpendicularly in a same direction from opposite sides of a top edge of the body 41 respectively. A split or opening 46 is defined in a middle of each tab 45 where it adjoins the body 41. A pair of tongues 47 is coplanarly formed on the top edge of the body 41 at the tabs 45 respectively, each tongue 47 being surrounded on three sides by a corresponding split 46. A slot 49 is defined in a distal end of each tab 45. 0016 A flange 43 is perpendicularly bent from a bottom edge portion of the body 41, the flange 43 extending in said same direction and being parallel to the tabs 45. A width of the flange 43 is equal to a distance from each tongue 47 to its corresponding slot 49. 0017 In assembly of the fin plates 40, the flange 43 of a first fin plate 40 is aligned with the flange 43 of an adjacent second fin plate 40. The body 41 of the second fin plate 40 is pressed toward the first fin plate 40, so that the slots 49 of the tabs 45 of the second fin plate 40 receive the tongues 47 of the first fin plate 40. Thus, the second fin plate 40 is attached to the first fin plate 40. In similar fashion, all the fin plates 40 are assembled together, with the flanges 43 thereof being coplanar with each other. Finally, this subassembly of fin plates 40 is mounted on a top surface of the base 50, with the flanges 43 in contact with the top surface. The heat dissipation device 30 is thus formed. 0018 FIG. 3 shows a fin plate 40 in accordance with the alternative embodiment of the present invention. The fin plate 40 is metallic, and a plurality of the fin plates 40 are formed by successively stamping a moving metal sheet. Each fin plate 40 has a main body 41. A pair of tabs 45 extends perpendicularly in a same direction from respective opposite upper side edges of the main body 41. A split 46 is defined in a middle of each tab 45 where it adjoins the body 41. A pair of tongues 47 is coplanarly formed on the side edges of the body 41 at the tabs 45 respectively, each tongue 47 being surrounded on three sides by a corresponding split 46. A slot 49 is defined in a distal end of each tab 45. A flange 43 is perpendicularly bent from a bottom edge portion of the body 41, the flange 43 extending in said same direction and being perpendicular to the tabs 45. Assembly of the fin plates 40 is similar to assembly of the fin plates 40 of the preferred embodiment. 0019 It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.