Method and system for bonding | Patent Number 12165888

US 12165888 B2
Application Number17532104
Publication NumberUS 20220367215 A1
Pendency3 years, 19 days
Filled DateNov 22, 2021
Priority DateMay 12, 2021
Publication DateNov 17, 2022
Expiration DateMay 11, 2041
Inventor/ApplicantsChieh Chang
Jyh-Cherng Sheu
Huicheng Chang
Yee-Chia Yeo
ExaminesABDELAZIEZ, YASSER A
Art Unit2898
Technology Center2800
Assignments
Taiwan Semiconductor Manufacturing Company
Current
Taiwan Semiconductor Manufacturing Company
Original
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