Methods and apparatus for evaluating mechanical and thermal strains in electronic materials, semiconductor materials, and other structures | Patent Number 07079257

US 07079257 B1
Application Number10414707
Publication Number-
Pendency3 years, 3 months, 5 days
Filled DateApr 15, 2003
Priority DateApr 8, 2002
Publication Date-
Expiration DateJul 18, 2014
Inventor/ApplicantsSean J. Kirkpatrick
Donald D. Duncan
ExaminesLYONS, MICHAEL A
Art Unit2877
Technology Center2800
Assignments
Providence Health & Services Washington
Current
Providence Health & Services Washington
Original
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