106 with the temperature in the standard range (e.g., the target range; set by API 13B-2). It should be appreciated that the temperature sensor 134 may be located at the second surface 112 or any other suitable surface of the head structure 103. Further, it should be appreciated that one or more additional temperature sensors may be provided on the head structure 103.

In certain embodiments, the electrodes 108 are positioned at a portion (e.g., proximal portion) of the gap 106 that is near (e.g., proximate) the body portion 104. Locating the electrodes 108 close to the body portion 104 in this manner provides ready access for the cleaning tip 120 to reach between the electrodes 108 and to contact both of the electrodes 108 with cleaning force. In certain embodiments, the temperature sensor 134 is spaced apart from the electrodes 108 (e.g., along the axial axis 2) to provide access for the cleaning tip 120 to reach the temperature sensor 134 and to capture the temperature measurements of the material in a vicinity of the electrodes 108, but also to block any effect of the temperature sensor 134 on the electric field formed between the electrodes 108. For example, in FIG. 4, the temperature sensor 134 is located near a middle location of the gap 106 (e.g., approximately midway between the electrodes 108 and a distal end of the gap 106 and/or the head structure 103 along the axial axis 2). Further, such placement of the temperature sensor 134 (e.g., in the middle location of the gap 106; away from the distal end of the gap 106 and/or the head structure 103) may also separate the temperature sensor 134 from a bottom surface of a container that holds the material, which may result in the temperature sensor 134 capturing more accurate temperature measurements for the material in the vicinity of the electrodes 108 (e.g., away from a heater under the container that holds the material, as compared to placement of the temperature sensor 134 at or near the distal end of the gap 106 and/or the head structure 103, which may contact the bottom surface of the container that holds the material). In this case, the temperature sensor 134 is spaced apart from one of the electrodes 108 on the first surface 110 by at least a full dimension of the electrode 108. The temperature sensor 134 and the electrodes 108 are both depicted as circular, disk-like members, but the temperature sensor 134 and the electrodes 108 can have any suitable and/or convenient shape.

Further, the electrodes 108 are generally made of any suitable conductive material, for example gold, copper, or gold plating over a suitable metal material. The temperature sensor 134 may be a thermocouple or a resistive temperature device, which can be made of a suitable material, such as stainless steel or platinum. The temperature sensor 134 and/or the electrodes 108 may be supported within respective recesses (e.g., grooves) defined in the head structure 103 (e.g., the first surface 110 and the second surface 112) so as to be protected within the head structure 103 and/or so as to be flush with the head structure 103 (e.g., the first surface 110 and the second surface 112), which may maintain the gap 106 and/or facilitate cleaning with the cleaner 118. It should be appreciated that one or more additional temperature sensors may be disposed on the electrical stability probe 100. Further, the temperature sensors 134 and/or the one or more additional temperature sensors may be disposed at any suitable position location of the electrical stability probe 100, such as at the first surface 110, the second surface 112, and/or along other surface(s) of the head structure 103, for example. With reference to FIG. 1 and FIG. 4, it should also be appreciated that conductors (e.g., electrical conductors or wires that transmit power and/or signals) may connect to the temperature sensor 134 and the electrodes 108, extend through the head structure 103 of the head portion 102, through the handle 105 of the body portion 104, and into a cable 136.

FIG. 5 is schematic diagram of an electrical stability monitoring system 150 with the electrical stability probe of FIG. 1, according to an embodiment. As shown, the electrical stability monitoring system 150 includes a monitor 152 (e.g., electrical stability monitor; computing system; computing device; controller) with a processor 154, a memory device 156, an output device 158, an input device 160, and/or a power source 162 (e.g., battery). The electrical stability probe 100 is coupled to the monitor 152, such as via the cable 136. However, while a wired connection between the electrical stability probe 100 and the monitor 152 is shown in FIG. 5, it should be appreciated that the electrical stability probe 100 and the monitor 152 may include communication components (e.g., wireless transceivers) that provide a wireless connection between the electrical stability probe 100 and the monitor 152 (e.g., to communicate via radiofrequency waves).

At certain times (e.g., periodically during drilling operations), the operator may use the electrical stability monitoring system 150 to measure the electrical properties of the material. For example, the operator may place a sample of the material in a container 170. Then, the operator may grip the handle 105 of the body portion 104 of the electrical stability probe 100 and insert the head structure 103 of the head portion 102 of the electrical stability probe 100 into the sample of the material in the container 170. In some cases, the operator may move the electrical stability probe 100 to mix (e.g., swirl) the sample of the material in the container 170. It should be appreciated that a geometry of the head structure 103 (e.g., expanded diameter; the opening 117) may facilitate mixing of the sample of the material in the container 170.

The operator may also provide an input via the input device 160 to initiate and/or to carry out an electrical stability test for the material. For example, the operator may actuate a key (e.g., physical or virtual button) on the monitor 152 to initiate the electrical stability test for the material. Then, the monitor 152 may instruct a heater 178 to adjust (e.g., increase) a temperature of the sample of the material, and the monitor 152 may also receive and/or request temperature data (e.g., signals) from the temperature sensor 134 of the electrical stability probe 100. In this way, the monitor 152 may determine and/or monitor the temperature of the sample of the material.

The monitor 152 may compare the temperature of the sample of the material to a standard range (e.g., target range; set by API 13B-2). In response to determining that the temperature of the sample of the material is within the standard range and/or while the temperature of the sample of the material is within the standard range, the monitor 152 obtain a first electrical reading from the electrodes 108 (e.g., the monitor 152 may instruct an increase in a voltage and monitor a current between the electrodes 108, and then the monitor 152 may identify and record a peak voltage when the current between the electrodes 108 corresponds to a target or threshold value, such as 61 μA).

In some embodiments, in response to obtaining the first electrical reading from the electrodes 108, the monitor 152 may provide an output via the output device 158. For example, the monitor 152 may provide a visual notification (e.g., the peak voltage; a text message) via a display and/or an audible notification (e.g., an alarm) via a speaker to notify the operator that the first electrical reading is complete and that the operator should complete a cleaning operation with the cleaner 118.

Then, the operator may apply a force to the slide member 122 to move the slide member 122 toward the head portion 102 until the cleaning tip 120 enters the gap 106 (e.g., brushes past the electrodes 108 and the temperature sensor 134). Then, the operator may apply another force to the slide member 122 to move the slide member 122 away from the head portion 102 and/or the operator may release the slide member 122 to cause the resilient member 130 to retract the cleaner 118, to thereby withdraw the cleaning tip 120 from the gap 106 and into the conduit 124 of the electrical stability probe 100. As described herein, the electrical stability monitoring system 150 may be configured to carry out the cleaning process in the automated manner (e.g., without human manipulation of input devices and/or the electrical stability probe 100 and components thereof). For example, in response to obtaining the first electrical reading from the electrodes 108, the monitor 152 may provide control signals to an actuator of the electrical stability probe 100 to adjust a position of the cleaner 118 (e.g., between the extended position and the retracted position) to carry out the cleaning process in the automated manner. In some such cases, the electrical stability probe 100 may include various structural features, such as a solenoid that is configured to receive the control signals from the monitor 152 and actuate to adjust the position of the cleaner 118, a piston that is configured to receive fluid (e.g., hydraulic fluid) and actuate to adjust the position of the cleaner 118, and/or any other suitable structure capable of moving the cleaner 118 based on the control signals. Further, the electrical stability probe 100 may include one or more sensors (e.g., proximity sensors) to detect movement of the cleaner 118. The one or more sensors may provide signals to the monitor 152 to enable the monitor 152 to determine and/or to confirm appropriate movement of the cleaner 118 for the cleaning process.

Then, immediately or after some amount of time (e.g., set by API 13B-2), the monitor 152 may instruct the heater 178 to operate to adjust (e.g., increase) the temperature of the sample of the material and/or the monitor 152 may receive and/or request the temperature data from the temperature sensor 134 of the electrical stability probe 100. Again, the monitor 152 may compare the temperature of the sample of the material to the standard range. In response to determining that the temperature of the sample of the material is within the standard range and/or while the temperature of the sample of the material is within the standard range, the monitor 152 obtain a second electrical reading from the electrodes 108 (e.g., the monitor 152 may identify and record another peak voltage when the current between the electrodes 108 corresponds to the target or threshold value).

In some embodiments, in response to obtaining the second electrical reading from the electrodes 108, the monitor 152 may provide another output via the output device 158 to notify the operator that the second electrical reading is complete and that the operator should complete another cleaning operation with the cleaner 118. It should be appreciated that the electrical stability probe 100 may be withdrawn or removed from the sample of the material for the cleaning operation(s). Further, between the first electrical reading and the second electrical reading, the electrical stability probe 100 may be held outside of the sample of the material in order for the temperature sensor 134 to equilibrate (e.g., at least until readings from the temperature sensor 134 are stable), and then the electrical stability probe 100 may be handled to insert the head structure 103 of the head portion 102 of the electrical stability probe 100 back into the sample of the material to obtain the second electrical reading.

The monitor 152 may process the first electrical reading and the second electrical reading to yield a final analysis (e.g., average the first electrical reading and the second electrical reading to yield a result). Further, the monitor 152 may output the final analysis via the output device 158 (e.g., via presentation of the result on the display) and/or may communicate the final analysis to a separate computing system or device (e.g., to a mobile device of the operator; to a remote desktop computer or server; to a storage device for recordation in a database, such as in a data repository or log for a wellsite and/or a cloud system). While two electrical readings are described (e.g., for compliance with API 13B-2), it should be appreciated that the electrical stability monitoring system 150 may be configured to obtain any number of electrical readings (e.g., 1, 2, 3, 4, or more) and then evaluate the electrical readings to yield the final analysis (e.g., average the electrical readings to yield the result).

The processor 154 may be processing circuitry that includes one or more processors configured to execute software, such as software for processing signals (e.g., from the temperature sensor 134 and the electrodes 108) and/or controlling components of the electrical stability monitoring system 150 (e.g., the output device 158). The memory device 156 may include one or more memory devices (e.g., a volatile memory, such as random access memory [RAM], and/or a nonvolatile memory, such as read-only memory [ROM]) that may store a variety of information and may be used for various purposes. For example, the memory device 156 may store processor-executable instructions (e.g., firmware or software) for the processor 154 to execute, such as instructions for processing signals (e.g., from the temperature sensor 134 and the electrodes 108) and/or controlling components of the electrical stability monitoring system 150 (e.g., the output device 158). It should be appreciated that the monitor 152 may include various other components, such as a communication device (e.g., wireless transceiver) that is capable of communicating data and/or other information to various other devices (e.g., a remote desktop computer or server, the Internet, a cloud system).

It should be appreciated that the monitor 152 may be a dedicated and/or contained controller with processing circuitry that carries out the various techniques disclosed herein. However, the monitor 152 may be part of and/or include a distributed controller (e.g., remote computing system and/or cloud computing system) with processing circuitry that carries out the various techniques disclosed herein. Thus, while certain operations are described as being performed by the monitor 152 to facilitate discussion, it should be appreciated that the various techniques disclosed herein may be performed by any suitable device and/or distributed between any suitable combination of devices (e.g., the processor