The inclusion of end sections of the second antenna coil being connected with antenna pads of the contactless chip module ensures reliable and secure communication between the inlay element and the chip card and external devices, preventing unauthorized access or tampering.

The presence of the rectifier assembly allows for efficient power management, optimizing energy consumption and extending the time when the inlay element and the chip card emits light after being removed from the influence of an external reader. Although an LED, and especially an OLED, can directly convert alternating current into light energy, the application provides a rectifier assembly because this can enhance the life span of the OLED. In an embodiment, the LED can be included into the rectifier assembly, that can save space and costs.

The inclusion of an ICT element comprising a first connection element and a second connection element enables easy integration with existing electronic systems, such as other inlay element components, facilitating manufacture, compatibility and interoperability.

A smart card according to the application comprises an inlay element with a first plastic cover layer provided on the first overlay layer and/or a second plastic cover layer provided on the second overlay layer. The smart card comprising an inlay element with a first plastic cover layer and/or a second plastic cover layer provides enhanced protection and durability to the underlying layers, ensuring the longevity of the smart card.

The inclusion of a first transparent plastic top layer and/or a second transparent plastic top layer on the first plastic cover layer and/or the second plastic cover layer allows for clear visibility of the underlying layers.

The inclusion of an insulating substrate in the smart card's inlay element provides electrical insulation, preventing any unwanted electrical interference or short circuits. The presence of first and second connection pads on the top surface of the insulating substrate allows for easy and secure connection of wires, ensuring reliable electrical connections within the smart card.

The rectifier assembly, which includes conductive traces on both the upper and lower surfaces of the insulating substrate, ensures efficient and reliable electrical connections between the first connection pad, second connection pad, first connection element, and second connection element.

The use of a smoothing capacitor C2 in the rectifier assembly enhances the stability of the electrical current, reducing any potential fluctuations or noise that may affect the performance of the smart card or the OLED, or both.

In a development, the inlay element and the chip card further comprises a rectifier assembly comprising a smoothing capacitor C2 that connects the first connection pad and the second connection pad.

The inclusion of conductive traces and landing pads in the rectifier assembly allows for easy integration of a conductive element R1 and a rectifier diode D1, ensuring secure and efficient electrical connections within the smart card.

The electrical connection of the first connection pad, second connection pad, first connection element, and second connection element through the conductive element R1 and rectifier diode D1 ensures proper functioning and reliable performance of the smart card.

The inclusion of a rectifier assembly in the smart card's inlay element provides the necessary circuitry to convert alternating current (AC) to direct current (DC) which is required to operate the OLED.

The rectifier diodes D1, D2, D3, and D4 provide efficient rectification of the electrical current, ensuring smooth and reliable operation of the inlay element and the chip card

The method of the application allows for the efficient assembly of an antenna layer plastic sheet with multiple antenna layers and cut-out sections for various modules, such as OLED modules, COB contactless chip modules, and COB capacitor modules.

The use of an adhesive tape layer at the bottom surface of the antenna layer plastic sheet provides secure attachment and protection for the modules placed in the cut-out sections, ensuring their stability during the manufacture of the inlay element.

The connection of COB contactless chip modules and/or COB capacitor modules with the respective first antenna coils, and the connection of OLED modules with the respective second antenna coils, allows later for effective communication and power transfer between the modules and the antenna layer plastic sheet.

The addition of a first compensation layer plastic sheet on the top surface of the antenna layer plastic sheet provides further protection and support for the OLED modules, COB contactless chip modules, and COB capacitor modules, ensuring their proper fit and alignment.

The collating and laminating process, along with the application of heat and/or pressure, ensures a strong and durable bond between the antenna layer plastic sheet, the first compensation layer plastic sheet, the first overlay layer plastic sheet, and the second overlay layer plastic sheet, resulting in a robust and reliable inlay elements sheet.

The replacement of certain steps with the provision of a second compensation overlay layer plastic sheet allows for additional protection and support for the OLED modules, ensuring their proper fit and alignment.

The collating and laminating process, along with the application of heat and/or pressure, ensures a strong and durable bond between all the layers, including the antenna layer plastic sheet, the first compensation layer plastic sheet, the second compensation overlay layer plastic sheet, the first overlay layer plastic sheet, and the second overlay layer plastic sheet, resulting in a robust and reliable inlay elements sheet.

In further embodiments of the application, there is adhesive provided between the upper second overlay layer sheet and the first compensation layer sheet and/or between the upper second overlay layer sheet and between the second compensation layer sheet and/or between the antenna layer sheet and the first compensation layer sheet. This allows for laminating the sheets together at lower temperatures, resulting in a better yield of the inlay elements sheet and a longer life span of the OLED panels which are embedded therein.

A method of manufacturing an inlay elements sheet allows for making a multitude of inlay elements at one time, for later making a multitude of chip cards at one time, wherein the thermal compression between the wire and the OLED ICT only where the wire touches the OLED module, and the thermal compression between the respective end sections of the first antenna coil and a first connection pad and the second connection pad of the OLED module is done without touching an OLED panel of the OLED module.

The thermal compression between the wire and the OLED ICT only where the wire touches the OLED module ensures efficient and precise connection without causing any damage to the OLED panel.

The thermal compression between the respective end sections of the first antenna coil and the first and second connection pads of the OLED module allows for secure and reliable electrical connection, ensuring proper functioning of the OLED module.

The method of manufacturing a chip card sheet allows for the efficient production of smart cards by providing an inlay elements sheet, which simplifies the manufacturing process.

The use of a transparent second plastic top layer sheet on the top surface of the second plastic cover layer enhances the visual appeal of the chip card sheet, making it more attractive to users.

The combination of the inlay elements sheet and the transparent second plastic top layer sheet ensures the durability and longevity of the chip card sheet, simplifies the production process by manufacturing a chip card sheet, eliminating the need for additional steps or materials. The provision of a first plastic top layer sheet on the bottom surface of the first plastic cover layer sheet enhances the structural integrity of the chip card sheet, making it more resistant to wear and tear. Further, the combination of the first plastic top layer sheet and the first plastic cover layer sheet provides a protective barrier for the chip card sheet, preventing damage to the underlying components.

The method of manufacturing a chip card sheet of the application allows for the customization of the sheet by providing at least one first chip module opening in the second plastic cover layer sheet and in the first plastic top layer sheet, enabling the incorporation of specific chip modules.

The provision of the first chip module opening in both the second plastic cover layer sheet and the first plastic top layer sheet ensures a secure fit for the chip module, preventing any movement or displacement during manufacturing. The use of the second plastic cover layer sheet and the first plastic top layer sheet in combination with the first chip module opening provides a protective enclosure for the chip module, safeguarding it from external factors such as moisture or physical damage.

The method of manufacturing a chip card also allows for the efficient production of chip cards by providing a chip card sheet, thereby streamlining the manufacturing process. The placement of a dual-interface chip module into the first chip module opening and/or the second chip module opening ensures the compatibility of the chip card with various contactless card readers and systems. The cutting out of a chip card from the area of the chip card sheet that comprises the dual-interface chip module allows for the precise and accurate production of chip cards, minimizing wastage and maximizing efficiency.

The method of manufacturing a chip card according to the application allows for the efficient production of chip cards by providing a chip card sheet that can be easily cut into individual chip cards. This reduces the time and effort required for manufacturing each chip card individually. The method includes the provision of a first chip module opening in the second plastic cover layer and the first plastic top layer, as well as a second chip module opening in the first compensation layer and the second overlay layer. This allows for the easy placement of a dual-interface chip module into either opening, providing flexibility in the type of chip module used in the chip card. The dual-interface chip module used in the method comprises a chip module antenna, a chip module PCB with ISO contact pads, a dual-interface chip, and a plastic chip cover material. This ensures that the chip card is equipped with a high-quality chip module that can support both contact and contactless communication, enhancing the functionality and versatility of the chip card.

The use of an upper lamination plate and a lower lamination plate in the lamination step allows for a more efficient and effective lamination process. The lamination plates ensure proper adhesion and bonding of the various layers of the chip card, resulting in a strong and durable final product. The upper and lower lamination plates also provide a consistent and uniform pressure during the lamination step, ensuring that the layers of the chip card are evenly compressed and bonded together. This helps to prevent any air bubbles or unevenness in the final chip card, improving its overall quality and appearance. The use of the upper and lower lamination plates also allows for precise control over the lamination process, ensuring that the layers are properly aligned and positioned. This helps to prevent any misalignment or displacement of the layers, which could negatively impact the functionality and reliability of the chip card.

According to the application, a smart card can be a credit card-sized card with embedded integrated circuits that can store, process, and communicate information.

A surface is often but not necessarily always understood as the outer boundary of a material layer constituting or resembling such a boundary.

The first antenna coil and the OLED module are connected in series, wherein a series is connection of components in such a manner that an electrical current flows first through one and then through the other component.

Contact pads are small, conductive surface areas on a printed circuit board or on an integrated circuit. They are often made of gold, copper, or aluminum and measure mere micrometres wide.

An anode or a cathode are electrodes through which electrical current flows into or from a polarized electrical device

Heat is, in the sense of warmth, heat energy, hotness, or high temperature, a form of energy that is transferred by a difference in temperature. It can stand for the presence of heat and for the sensation caused by heat energy. Pressure, in the sense of press, pressure level, force per unit area, or pressing, means and/or designates the force applied to a unit area of surface, a force that compels, or the act of pressing or the exertion of pressure

The application provides a thermal compression between the wire and the OLED ICT only where the wire touches the OLED module, and the thermal compression between the respective end sections of the first antenna coil and a first connection pad and the second connection of the OLED module is done without touching an OLED panel of the OLED module.

Thermal compression bonding is a manufacturing technique to establish a reliable connection between the end of a wire and a metal contact pad. This method involves the simultaneous application of heat and pressure to facilitate the bonding process. The heat softens the wire and the contact pad, enhancing their malleability and enabling atomic diffusion between the two materials. This diffusion process results in a strong metallurgical bond characterized by its high durability and low electrical resistance, which is critical for the performance of electronic devices.

The application of pressure during thermal compression bonding ensures intimate contact between the wire and the contact pad, promoting the intermixing of atoms and the formation of a dense, void-free bond. The duration of heat and pressure application is precisely controlled to optimize the bonding quality while preventing damage to the materials and surrounding components. This precise control over the bonding parameters makes thermal compression bonding particularly suitable for delicate and high-density applications, such as semiconductor chip packaging, where precision and reliability are paramount.

Thermal compression forms bonds at relatively lower temperatures, thus minimizing the risk of thermal damage. The technique's ability to create low-resistance electrical connections makes it possible to provide the subject matter of the application, for the assembly of electronic components where performance and longevity are critical.

Any one of the presently described embodiments can be advantageously combined with any other one.

It is suggested to combine described embodiments, or combinations thereof, with one or more of the following techniques or technologies or concepts or ideas or paradigms or states or the like.

BRIEF DESCRIPTION OF DRAWINGS

The present disclosure is illustrated by way of example and not limited in the accompanying figures in which like reference numerals indicate similar elements. Embodiments of the application will now be described with reference to the attached drawings:

FIG. 1 shows a top view of a dual-interface chipcard according to an embodiment of the application;

FIG. 2 shows a top view of a contactless chipcard according to a second embodiment of the application;

FIG. 3 shows a cross-section through the embodiments shown in FIG. 1 and FIG. 2;

FIG. 4 shows a capacitor module of an inlay element of FIGS. 2 and 3;

FIG. 5 shows a cross-section through the capacitor module of FIG. 4;

FIG. 6 shows a sideview of an arrangement for manufacturing an inlay element according to the application;

FIG. 7 shows a perspective exploded view of a chipcard according to the application;

FIG. 8 shows a cross-section through the chipcard of FIG. 7;

FIG. 9 shows a top view of a further embodiment of an inlay element of the application;

FIG. 10 shows a top view of a further embodiment of an inlay element of the application;

FIG. 11 shows a top view of a further embodiment of an inlay element of the application;

FIG. 12 shows a schematic view of a smart card with an inlay;

FIG. 13 shows a schematic of a rectifier assembly according to the application;

FIG. 14 shows a schematic of half-wave rectifier assembly according to the application;

FIG. 15 shows a schematic of half-wave rectifier assembly according to the application;

FIG. 16 shows a top view of an ICT element according to the application;

FIG. 17 shows a detailed view of the ICT element of FIG. 16;

FIG. 18 shows a cross-sectional view of the ICT element of FIG. 16 and FIG. 17.

DETAILED DESCRIPTION

FIG. 1 shows a top view of a dual-interface chipcard according to an embodiment of the application.

In embodiment 1, an inlay element 60 for a smart card 100 that comprises an antenna layer 54. This antenna layer 54 hosts a first antenna coil 10 and a second antenna coil 12 on its top surface 66, alongside a first compensation layer 53. Within the antenna layer 54 and the first compensation layer 53, an OLED module 20 is embedded. Below the antenna layer 54 bottom surface 65, a first overlay layer 51 is positioned, and a transmissive second overlay layer 50 is located above the top surface 66 of the first compensation layer 53. The term “transmissive” refers to materials that permit light passage, which can be transparent or translucent, allowing for clear or blurred visibility, respectively.

The first antenna coil 10 is galvanically isolated from the second antenna coil 12, indicating no direct electrical connection between them. This setup, including the series connection of the first antenna coil 10 with the OLED module 20 via a rectifier assembly 27 (not shown here), enables the OLED module 20 to receive power through inductive coupling with an external reader. Orientation is specified with respect to the y-axis as illustrated in the figures.

A second compensation layer 52 is inserted between the first compensation layer 53 and the second overlay layer 50 to address potential height differences between the OLED module 20, a capacitor module 30, and/or a contactless chip module 11.

A third antenna coil 40, electrically coupled with the second antenna coil 12 and placed on the top surface 66 of the antenna layer 54, suggests a dual interface card capability.

The structure also includes a capacitor module 30, partially set within the antenna layer 54 and the first compensation layer 53. The contact pads of this capacitor module 30 are connected in series with the end sections 13, 14 of the second antenna coil 12, with a tuning capacitor mentioned as an optional component.

Lastly, an ICT element 22 links the first antenna coil 10 to the OLED panel 21 of the OLED module 20 and encompasses the rectifier assembly 27. This element is designed to supply electrical energy to the OLED module 20, contributing to the smart card 100's operational efficiency.

FIG. 2 shows a top view of a contactless chip card according to a second embodiment of the application

The second embodiment, as shown in FIGS. 2 and 3, comprises an inlay element 60 suitable for use within a smart card 100. This inlay element includes an antenna layer 54, upon which a first antenna coil 10 and a second antenna coil 12 are arranged on the top surface 66. Additionally, a first compensation layer 53 is positioned on the top surface 66 of the antenna layer 54. The OLED module 20 is located at least partially within both the antenna layer 54 and the first compensation layer 53. On the underside of the antenna layer 54, a first overlay layer 51 is placed beneath the bottom surface 65, and a transmissive second overlay layer 50 is situated above the top surface 66 of the first compensation layer 53.

The first antenna coil 10 is electrically isolated or galvanically decoupled from the second antenna coil 12, meaning there is no direct electrical connection between them. The first antenna coil 10 is connected in series with the OLED module 20 via a rectifier assembly 27. This series connection with the first antenna coil 10 allows for the provision of electrical power to the OLED module 20 through inductive coupling with an external reader, with the orientation of “top” and “bottom” being in line with the y-direction in the figures.

The inlay element 60 also comprises a second compensation layer 52, which lies between the first compensation layer 53 and the second overlay layer 50. The purpose of this second compensation layer is to add thickness to balance out the height differences between the OLED module 20 and other components, such as the capacitor module 30 and/or the contactless chip module 11, as can be seen in FIG. 3.

Moreover, the inlay element 60 includes a contactless chip module 11 which is partially embedded within both the antenna layer 54 and the first compensation layer 53, indicative of a contactless chip card configuration.

The end sections 13, 14 of the second antenna coil 12 are linked to antenna pads 17 of the contactless chip module 11. This connection facilitates the transfer of electrical energy to the contactless chip module 11 via inductive coupling from the second antenna coil 12 when interacting with an external reader.

An ICT element 22 is incorporated into the inlay element 60, which establishes a connection between the first antenna coil 10 and an OLED panel 21 of the OLED module 20. The ICT element 22 includes a rectifier assembly 27 and is tasked with supplying electrical power to the OLED module 20.

FIG. 3 shows a cross-section through the embodiments shown in FIG. 1 and FIG. 2

In the description of embodiment 1 and embodiment 2, not all elements mentioned in the associated claims can be explicitly seen in the FIGS. 1 and 2. However, these elements are implicitly present.

The ICT element, as part of this embodiment, includes a first and a second comb-shaped connection element, designed for contacting the anode and cathode of an OLED panel. Although these comb-shaped connection elements are not visibly depicted in the FIGS. 1 and 2, their presence is implied due to their role in distributing shear forces, with each pole of the OLED panel having one connection element to ensure stability and efficient energy transfer.

Further detailing the ICT element, it comprises an insulating substrate that supports a first and a second connection pad on its top surface. These pads are intended to receive first and second end sections of wires, respectively. Additionally, the first and second connection elements, provided on the upper surface of the insulating substrate, are intended for establishing electrical connections with the anode and cathode of the OLED panel. The inclusion of a rectifier assembly, which is electrically connected between these components, facilitates the connection to the cathode of the OLED panel. This assembly, featuring conductive traces on both the upper and possibly the lower surface of the insulating substrate, although not directly observable in the figures, is part of the ICT element's design.

The manufacturing method of the inlay elements sheet incorporates steps that involve the use of thermal compression to connect COB contactless chip modules or COB capacitor modules with the respective first antenna coils, as well as to connect the OLED modules with the respective second antenna coil. This process, particularly for the connection between the wire and the OLED ICT, ensures that thermal compression is applied only at points of contact, avoiding direct contact with the heat-sensitive OLED panel. The precision in applying thermal compression, especially between the end sections of the first antenna coil and the connection pads of the OLED module, preserves the integrity and functionality of the OLED panel.

FIG. 4 and FIG. 5 detail components of the capacitor module 30 within the inlay element 60 for a smart card 100. The capacitor module 30 includes a tuning capacitor C1 31 mounted on a flexible capacitor PCB 32. The module features first and second metal pads 33, 34, which are connected to respective first and second contacts 35, 36 via first and second connective materials 37, 38. The assembly is encapsulated by a plastic cover material 39.

FIG. 4 shows a plan view of the capacitor module 30 where the tuning capacitor C1 31 is central, with the first and second contacts 35, 36 extending outward to the periphery to connect with end sections of the second antenna coil (not shown in this figure). The flexible nature of the capacitor PCB 32 allows for integration within the layered structure of the inlay element 60, conforming to its contours.

FIG. 5 provides a cross-sectional view taken along the line A-A of FIG. 2. It exhibits the capacitor 31 elevated above the surface of the flexible capacitor PCB 32, with the first and second connective materials 37, 38 providing an electrical connection to the first and second metal pads 33, 34. The plastic cover material 39 serves to protect the capacitor 31 and its connections. FIG. 5 serves to demonstrate the layered arrangement and the vertical interconnectivity between the capacitor module components and the surrounding structures of the inlay element 60.

FIG. 6 shows a sideview of an arrangement for manufacturing an inlay element 60 according to the application

FIG. 6 provides a side view of an inlay element 60 during the manufacturing process, illustrating a lamination step in the making of smart cards 100. The method includes the following steps:

- Providing a sheet made of an antenna layer 54 with multiple layers and cut-out sections designed to receive OLED modules 20, contactless chip modules 11, and capacitor modules 30.
- Applying adhesive tape to the bottom surface 65 of the antenna layer sheet, covering the cut-out sections to secure the modules when placed.
- Inserting OLED modules 20, contactless chip modules 11, and capacitor modules 30 into the cut-out sections, affixing them to the adhesive tape.

Adding a multitude of first antenna coils 10 onto the antenna layer sheet and connecting them with the contactless chip modules 11 and capacitor modules 30.

- Placing several second antenna coils 12 on the sheet and connecting them with the OLED modules 20.
- Arranging a first compensation layer sheet 53 with cut-outs for the modules on the top surface 66 of the antenna layer sheet, allowing the modules to fit into the cut-outs of the first compensation layer.
- Optionally, the adhesive tape can be removed from the bottom surface 65 after the modules are secured by their connections.
- Positioning a first overlay layer sheet 51 onto the bottom surface 65 of the antenna layer sheet.
- Laying a second overlay layer sheet 50 on the top surface of the first compensation layer sheet 53.
- Collating and laminating the antenna layer sheet 54, first compensation layer sheet 53, first overlay layer sheet 51, and second overlay layer sheet 50 with the application of heat and/or pressure, using an upper lamination plate 70 and a lower lamination plate 71.

In an embodiment not shown here, there are release liners arranged between the upper lamination plate 70 and second overlay layer sheet 50 and between the lower lamination plate 71 and the first overlay layer sheet 51.

In a further embodiment not shown here, there is adhesive provided between the upper second overlay layer sheet 50 and the first compensation layer sheet 53, and/or between the upper second overlay layer sheet 50 and between the second compensation layer sheet 52 if that optional second compensation layer sheet 52 is provided because of thickness requirements. Such adhesive can also be provided between the antenna layer sheet 54 and the first compensation layer sheet 53.

FIG. 7: FIG. 7 shows a perspective exploded view of a chipcard according to the application

FIG. 7 depicts a perspective exploded view of a further embodiment of a dual-interface smart card 100. The smart card 100 comprises an antenna layer 54. On the antenna layer's top surface, a first antenna coil 10 and a second antenna coil 12 are placed to harness electrical energy through inductive coupling with an external reader.

A first compensation layer 53 is situated atop the the antenna layer 54 to maintain the smart card's structural integrity. Embedded within the antenna layer 54 and the first compensation layer 53 is an OLED module 20. The first antenna coil 10 is connected in series to the OLED module 20 through a rectifier assembly, providing power to the OLED module 20.

Positioned beneath the antenna layer 54 on the bottom surface is a first overlay layer 51, lending structural support and insulation to the smart card 100. Above the the first compensation layer 53, a light-transmissive second overlay layer 50 is placed, which facilitates visibility of the OLED module 20.

Further enhancing the smart card's functionality is a third antenna coil 40, which is galvanically coupled to the second antenna coil 12 and also positioned on the antenna layer 54. This provides the smart card's dual-interface functionality. Integrated within the antenna layer 54 and first compensation layer 53 is a capacitor module 30, which is connected to the second antenna coil 12, serving as a tuning element for the smart card 100.

An ICT element, not shown here, connects the first antenna coil 10 with the OLED panel of the OLED module 20. This ICT element includes a first connection element and a second connection element, both designed to sustain shear forces and ensure stable electrical connectivity with the OLED panel 21.

The assembly is completed with a dual-interface chip, seated on a chip module PCB that matches chip module openings. These openings are designed for the proper placement and integration of the chip module within the card structure. Encasing the chip module and its connections are a plastic cover layer and a transparent plastic top layer, providing protection and ensuring the longevity and functionality of the card.

The manufacturing process of the inlay element 60 for the smart card 100 involves precise placement of components within the antenna layer 54, connection of these components to their respective antenna coils 10, 12, and lamination of the entire assembly with the application of heat and pressure facilitated by lamination plates. Special attention is given to the thermal compression bonding process to avoid damage to heat-sensitive elements such as the OLED module 20.

FIG. 8 provides a cross-sectional view of the smart card 100 as detailed in embodiment 3, which includes the elements seen in FIG. 7, along with additional features.

At the core of the smart card is the antenna layer 54. Affixed to the top surface 66 of the antenna layer 54 are the first antenna coil 10 and the second antenna coil 12, providing the card's contactless functionality through inductive coupling. The third antenna coil 40, which enables dual-interface capabilities, is also positioned on this surface and is coupled to the second antenna coil 12.

Above the antenna layer 54, the first compensation layer 53 and the second compensation layer 52 are layered successively. Within these layers, the OLED module 20 is embedded, drawing power from the first antenna coil 10 through a connection to the rectifier assembly. The OLED module 20 is situated such that it benefits from the light transmission properties of the second overlay layer 50 positioned above the second compensation layer 52.

Below the antenna layer 54 is situated the first overlay layer 51. Within the confines of these layers, the capacitor module 30 is partially housed, with its tuning capacitor 31 visible in the section, connected to the third antenna coil 40 for tuning the frequency response of the card's elements.

Visible within the smart card structure are the chip module PCB 111 and the dual-interface chip 115, which are encapsulated by the second plastic cover layer 55 and the second transparent plastic top layer 56. These protective layers 55 and 56 ensure the dual-interface chip's security and functionality within the smart card 100. Additionally, the chip module PCB 111 matches a chip module opening 112. A plastic chip cover material 114 protects the dual-interface chip 115.

FIGS. 9, 10, and 11 exhibit top views of inlay elements 60 for further embodiments of the application, respectively. Each figure highlights the positioning of an OLED element 20 in relation to a first antenna coil (not shown in these figures) within an inlay element 60. The OLED element 20 is placed within an enclosed area C of the inlay element 60. This area C is defined by specific distances A and B to the edges of the inlay element 60, ensuring precise placement of the OLED element 20 for an improved function and integration within the smart card structure.

In FIG. 9, the inlay element 60 is shown without the OLED element 20, providing a view of the area C where the OLED element 20 is to be situated.

FIG. 10 displays the inlay element 60 with the OLED element 20 placed within the defined area C, demonstrating the alignment and orientation of the OLED element 20 in the context of the inlay element's overall dimensions.

FIG. 11 also presents the inlay element 60 with the OLED element 20 positioned accordingly within area C, emphasizing the the distances A and B in the design and assembly of the smart card's inlay element 60.

These figures collectively illustrate the variations in the placement of the OLED element 20 within the inlay element 60 for different embodiments of the smart card, showcasing the adaptability of the design to accommodate various configurations of the internal components.

FIG. 12 shows a schematic view of a smart card 100 incorporating an inlay element 60 as per the application. The smart card 100 integrates a first plastic cover layer 57 on the bottom side of the first overlay layer 51. Additionally, there may be a second plastic cover layer 55 provided on the top side of the second overlay layer 50. These layers, typically made from PVC, serve as protective coverings for the inlay element 60. They not only protect the card but also offer a surface that can be utilized for adding graphical designs to enhance the card's aesthetic appeal.

Moreover, the smart card 100 can include a first transparent plastic layer 58 on the bottom side of the first plastic cover layer 57, and there may also be a second transparent plastic layer 56 on the top side of the second plastic cover layer 55. Made from transparent PVC, these layers function to safeguard any graphical design that might be present on the first plastic cover layer 57. Furthermore, the second transparent plastic layer 56 ensures that the card's visual elements are visible while also contributing to the card's overall durability.

FIG. 13 displays the schematic of a rectifier assembly 27, as outlined in the application. This assembly is integral to the ICT element 22, which facilitates the electrical connection of an OLED panel with the end sections of a first wire and a second wire.

The ICT element 22 consists of an insulating substrate upon which a first connection pad and a second connection pad are located on the top surface. These pads are designed to receive the end sections of the first and second wires, respectively. Also positioned on the insulating substrate's top surface are a first connection element and a second connection element. The first connection element is intended for electrical connection to the anode of the OLED panel, while the second connection element is for the cathode.

The rectifier assembly 27 is electrically interposed between the first connection pad and the second connection pad, as well as between the first connection element and the second connection element. This assembly includes conductive traces present on both the top and bottom surfaces of the insulating substrate, facilitating the connection to the cathode of the OLED panel.

Further details of the ICT element 22 specify that the rectifier assembly 27 incorporates a smoothing capacitor C2 that interconnects the first connection pad and the second connection pad. Additionally, the assembly comprises conductive traces and landing pads for accommodating a conductive element R1, known as a zero-ohm resistor, and a rectifier diode D1. These components create electrical connections between the connection pads and the connection elements.

The rectifier assembly 27 is also characterized by having conductive traces and landing pads for the inclusion of a set of diodes-D1, D2, D3, and D4. These diodes form a bridge rectifier, which is a circuit that allows for both full-wave and half-wave rectification. In the context of this schematic, the bridge rectifier provides a means to electrically connect the first connection pad, the second connection pad, the first connection element, and the second connection element.

The schematic indicates applicability for both full-wave and half-wave rectification, contingent upon certain conditions: for full-wave rectification, the resistor R1 is not fitted (DNF, do not fit), and for half-wave rectification, the diodes D2, D3, and D4 are not fitted (DNF). This flexible design allows for customization based on the specific requirements of the smart card application.

FIG. 14 illustrates the schematic of a half-wave rectification circuit, part of the rectifier assembly 27 designed for use with an ICT element. This schematic provides the functioning of an OLED panel 21, allowing for the conversion of alternating current (AC) into direct current (DC).

The circuit features a first antenna coil 10, which is the primary inductive component responsible for receiving and inducing electrical current. Connected to this first antenna coil 10 is a smoothing capacitor C2, which serves to reduce voltage fluctuations in the rectification process, stabilizing the DC output.

A single rectifier diode D1 is placed in the path of the current, allowing electricity to flow in only one direction, thereby converting the AC input from the antenna coil 10 into a half-wave rectified DC output. This DC current is then utilized to power the OLED panel 21, denoted in the schematic as OLED1.

The inclusion of a resistor R1, depicted as a zero-ohm resistor, signifies a direct connection in the circuit, often used as a jumper or a place-holder that can be replaced with other components if needed for different circuit configurations.

This schematic is exclusively applicable for half-wave rectification, as indicated, which is a simple form of rectification used where full-wave rectification is not required.

FIG. 15 shows a schematic of a full-wave rectification circuit, which is part of the rectifier assembly 27 as specified in the application. This rectification circuit is designed for use with an ICT element and is crucial for the operation of an OLED panel 21.

In the diagram, a first antenna coil 10 is the primary component for capturing AC electricity through inductive coupling. Attached to it is a smoothing capacitor C2, which serves to minimize voltage ripples in the output, thereby delivering a more consistent DC voltage.

The full-wave rectification is achieved using a bridge rectifier configuration, which consists of four rectifier diodes D1, D2, D3, and D4. These diodes are arranged in such a way that they allow the current to pass through them in one direction during each half cycle of the AC waveform, effectively utilizing both halves of the cycle to produce a full-wave rectified DC output. This DC output powers the OLED panel, marked as OLED1 in the schematic.

This schematic is specifically applicable for full-wave rectification, a more efficient rectification method compared to half-wave rectification, as it utilizes the entire AC waveform, resulting in less ripple and a smoother DC output.

FIG. 16 provides a top view of an ICT element 22 designed for electrical connection within a smart card system. This element includes an insulating substrate 132, upon which a first connection pad 23 and a second connection pad 24 are mounted. These pads 23, 24 receive end sections 15 and 16 of two wires, facilitating the electrical connection to an OLED panel 21.

The ICT element 22 comprises the rectifier assembly 27. This rectifier assembly 27 comprises conductive traces and is placed between the first and second connection pads 23, 24, and the first and second connection elements 25, 26. The rectifier assembly's 27 role is to convert alternating current (AC) harvested by the first antenna coil 10 into direct current (DC), which is suitable for use by the OLED panel 21, represented schematically in this figure.

The rectifier assembly 27 is equipped with components necessary for the rectification process, including diodes and a capacitor, to ensure the OLED panel 21 receives a stable DC power supply. The layout is designed to provide an efficient and reliable power conversion within the compact space of a smart card.

FIGS. 17 and 18 show different views of the ICT element 22 of FIG. 16, providing detailed insight into the component layout and connections as specified in the application.

FIG. 17 presents a detailed top view of the ICT element 22. This ICT element 22 comprises an insulating substrate 132, which supports a first connection pad 23 and a second connection pad 24 on its top surface. These pads 23, 24 connect to the end sections 15 and 16 of the first and second wires, respectively. Additionally, a first connection element 25 and a second connection element 26 are provided on the top surface of the insulating substrate 132 for establishing connections with the anode and cathode of an OLED panel 21, respectively.

This ICT element 22 comprises a rectifier assembly 27, which includes a smoothing capacitor C2 and rectifier diodes D1, D2, D3, and D4. The rectifier assembly 27 is configured to convert AC to DC, supplying power to the OLED panel 21. The assembly is also equipped with conductive traces and landing pads for a zero-ohm resistor R1, further facilitating the electrical connection between the connection pads 23, 24 and connection elements 25, 26.

FIG. 18 provides a cross-sectional view of the ICT element 22, illustrating the vertical integration of the component layers. The insulating substrate 132 serves as the base, with the rectifier assembly 27 positioned above it. Visible in this cross-section are the conductive traces and landing pads on the insulating substrate 132, along with the rectifier diodes D2 and the smoothing capacitor C2, which are critical for the full-wave rectification process. The rectifier diodes form a bridge configuration, allowing for conversion of AC from the first antenna coil (not shown in this figure) to a DC output for the OLED panel 21.

These figures collectively detail the design and functionality of the ICT element 22, showcasing the patent's approach to providing a reliable power management solution for OLED panels within smart card applications.

The application also comprises the subject matter of the combinations and/or permutations that follow from the following itemized lists, that also comprises terms and definitions that are used elsewhere in the application. The following itemized list is not only intended for providing combinations and/or permutations among these items but these items can also be combined with each one of the patent claims that are comprised in the present application:

- 1. Inlay element for a smart card, comprising:
- an antenna layer;
- a first antenna coil being arranged on a top surface the antenna layer;
- a second antenna coil being arranged on the top surface of the antenna layer;
- a first compensation layer being arranged on the top surface of the antenna layer;
- an LED module being arranged at least partially within the antenna layer and within the first compensation layer,
- and/or
- 1.a. The term LED can stand for any illuminating means, including micro-LEDs or OLEDs.
- and/or
- 1b A first overlay layer is arranged below a bottom surface of the antenna layer, wherein a transmissive second overlay layer being arranged above a top surface of the first compensation layer.
- and/or
- 1c. In the context of this application, the properties of light transmission through materials can categorized as follows: Transparent materials are those that allow light to pass through with minimal scattering, rendering objects on the opposite side distinctly visible with clear details and accurate colors, akin to ordinary window glass. Translucent materials, in contrast, permit the passage of light but disperse it in the process, resulting in a scenario where light is transmitted but the clarity of object visibility is significantly reduced, manifesting as a blurred or softened view, similar to frosted glass. The overarching term ‘transmissive’ is employed to refer to both these categories, encompassing any material that allows the passage of light, irrespective of the degree of clarity or distortion introduced during its transmission.
- and/or
- the first antenna coil is galvanically decoupled—which can mean that there is no direct electrical connection between the two coils—from the second antenna coil, and wherein the first antenna coil and the LED module are connected in series with a rectifier assembly. The first antenna coil is configured to provide electrical energy for the LED module via inductive coupling of the first antenna coil with an external reader, and/or

“Top” and “bottom” is meant in the sense of the y-direction in the Figures.

- 2. Inlay element according to item 1, wherein a second compensation layer being arranged between the first compensation layer and the second overlay layer. These compensation layers can provide additional thickness for compensating differences in height between the LED module and the capacitor module and/or the contactless chip module, as one can see in FIG. 3, for example.
- 3. Inlay element according to item 1 or item 2, further comprising a third antenna coil being galvanically coupled with the second antenna coil, the third antenna coil being arranged on the top surface of the antenna layer, which is for a dual interface card.
- 4. Inlay element according to item 3, further comprising a capacitor module being arranged at least partially within the antenna layer and within the first compensation layer, contact pads of the capacitor module being connected—for example in series—with end sections (13, 14) of the second antenna coil, thereby optionally providing a tuning capacitor.
- 5. Inlay element according to item 1 or item 2, further comprising a contactless chip module being arranged at least partially within the antenna layer and within the first compensation layer. This setup is often used for a contactless chip card.
- 6. Inlay element according to item 4, wherein end sections (13, 14) of the second antenna coil are connected with antenna pads of the contactless chip module. These are optionally being connected in series and configured to provide electrical energy for the contactless chip module via inductive coupling of the second antenna coil with the external reader.
- 7. Inlay element according to any of the preceding items, further comprising an ICT element for connecting the first antenna coil with an LED panel of the LED module, the ICT element further comprising the rectifier assembly. In such a setup, the ICT element can be configured to provide electrical energy for the LED module.
- 8. Inlay element according to item 7, wherein the ICT element comprises a first—possibly comb-shaped—connection element 25 and a second—possibly comb-shaped—connection element 26 for contacting the LED panel. Such connection elements can take over shear forces, wherein each pole of the LED panel has one connection element.
- 9. Inlay element according to any of the preceding items, wherein the LED module is arranged within an enclosed area (C) of the first antenna coil, the area (C) having specified distances (A, B) to edges of the inlay element.
- 10. Inlay element according to any of the preceding items, wherein the LED module comprises a LED panel with a specific color and a specific size. [question to inventor: please give colors, dimensions and provide technical effect].
- 11. Smart card comprising an inlay element according to any of the preceding items, wherein there is a first plastic cover layer-possibly made from PVC-provided on [the bottom side of] the first overlay layer and/or there is a second plastic cover layer—e.g. made from PVC-provided on—e.g. the top side of—the second overlay layer. This can be provided as a protective layer which can also be used for providing a graphical design.
- 12. Smart card comprising an inlay element according to any of the preceding items, wherein there is a first transparent plastic top layer-possibly made from transparent PVC-provided on—e.g. the bottom side of—the first plastic cover layer and/or there is a second transparent plastic top layer-possibly made from transparent PVC-provided on the top side of the second plastic cover layer. This can protect the graphical design on the first plastic layer and/or the second transparent plastic layer.
- 13. ICT element for electrically connecting a first end section of a first wire and a second end section of a second wire with an anode and with a cathode of an LED panel, comprising
- an insulating substrate,
- a first connection pad for receiving a first end section of a first wire and a second connection pad for receiving a second end section of a second wire, the first connection pad and the second connection pad being provided on a top surface of the insulating substrate,
- a first connection element for connecting to an anode of an LED panel and a second connection element for connecting to a cathode of an LED panel, the first connection element and the second connection element being provided on an upper surface of the insulating substrate,
- a rectifier assembly, being electrically connected between the first connection pad, the second connection pad, the first connection element and the second connection element, for connecting to a cathode of an LED panel, wherein the rectifier assembly comprising conductive traces both on the upper surface and on a—e.g. opposite—lower surface of the insulating substrate.
- 14. ICT element according to item 13, wherein the rectifier assembly comprises a smoothing capacitor C2 that connects the first connection pad and the second connection pad.
- 15. ICT element according to item 13 or item 14, wherein the rectifier assembly comprises conductive traces and landing pads for taking up a conductive element R1—e.g. a resistor with zero/0 ohms—and for a rectifier diode D1, the conductive element R1 and the rectifier diode D1 electrically connecting the first connection pad, the second connection pad, the first connection element and the and the a second connection element.
- 16. ICT element according to item 13 or item 14, wherein the rectifier assembly comprises conductive traces and landing pads for taking up a rectifier diode D1, a rectifier diode D2, a rectifier Diode D2, a rectifier Diode D3, and a rectifier Diode D4, the rectifier diode D1, the rectifier diode D2, the rectifier Diode D3, and the rectifier Diode D4 forming a bridge rectifier for electrically connecting the first connection pad, the second connection pad, the first connection element and the second connection element.
- 17a. Method of manufacturing an inlay elements sheet for making smart cards, comprising the steps:
- providing an antenna layer plastic sheet with—possibly areas of—a plurality of antenna layers and with a plurality of cut-out sections—e.g. cavities or through-holes—for receiving LED modules, COB contactless chip modules and/or COB capacitor modules;
- applying an adhesive tape layer at a bottom surface of the antenna layer plastic sheet, at least partly covering the plurality of cut-out sections,
- providing the LED modules, the COB contactless chip modules and/or the COB capacitor modules in the cut-out sections in the antenna layer plastic sheet, e.g. such that they stick to the adhesive tape layer,
- providing a plurality of first antenna coils on the antenna layer plastic sheet; and connecting the COB contactless chip modules and/or the COB capacitor modules with the respective first antenna coils-usually but not always it is one COB contactless chip modules that is connected with one first antenna coil or one COB capacitor module with one first antenna coil,
- providing a plurality of second antenna coils on the antenna layer plastic sheet, and connecting the LED modules with the respective second antenna coils,
- providing a first compensation layer plastic sheet with a plurality of cutout sections for the LED modules, for the COB contactless chip modules and/or for the COB capacitor modules and arranging the first compensation layer plastic sheet on the top surface of the antenna layer plastic sheet, such that the LED modules, the COB contactless chip modules and/or the COB capacitor modules fit into the respective cut-out sections in the first compensation layer plastic sheet;
- 17b. Method of item 17, with
- removing the adhesive tape layer from the bottom surface of the antenna layer plastic sheet. The LED modules, the contactless chip modules, and the contactless chip modules and the capacitor modules are now held by the connections with the antenna wires]
- 17c. Method of item 17a or item 17b, with
- providing a first overlay layer plastic sheet on the bottom surface of the antenna layer plastic sheet
- providing a second overlay layer plastic sheet on a top surface of the first compensation layer plastic sheet; and
- collating and laminating of the antenna layer plastic sheet, the first compensation layer plastic sheet, the first overlay layer plastic sheet, and the second overlay layer plastic sheet while applying heat and/or pressure.
- 18. Method of manufacturing an inlay elements sheet according to items 17 and 17b, wherein the steps of
- arranging a second overlay layer plastic sheet on a top surface of the first compensation layer plastic sheet, and
- collating and laminating of the antenna layer plastic sheet, the first compensation layer plastic sheet, the first overlay layer plastic sheet, and the second overlay layer plastic sheet while applying heat and/or pressure, are replaced by the following steps:
- providing a second compensation overlay layer plastic sheet with a plurality of cutout sections for the LED modules on a top surface—wherein the term “top” can mean “higher” in the z-direction of the coordinate system—of the first compensation layer plastic sheet, such that the LED modules fit into the respective cut-out sections in the second compensation layer plastic sheet; and
- collating and laminating of the antenna layer plastic sheet, the first compensation layer plastic sheet, the second compensation overlay layer plastic sheet, the first overlay layer plastic sheet, and the second overlay layer plastic sheet while applying heat and/or pressure.
- 19. Method of manufacturing an inlay elements sheet according to item 17 or item 18, wherein the steps of connecting the COB contactless chip modules and/or the COB capacitor modules with the respective first antenna coils, and/or
- connecting the LED modules with the respective second antenna coils, are provided by thermal compression.
- 20. Method of manufacturing an inlay elements sheet according to item 19, wherein the thermal compression between the wire and the LED ICT only where the wire touches the LED module, because the LED can be heat sensitive, and the thermal compression between the respective end sections (14, 15) of the first antenna coil and a first connection pad and the second connection pad of the LED module is done without touching an LED panel of the LED module.
- 21. Method of manufacturing a chip card sheet for making smart cards, comprising the steps:
- providing an inlay elements sheet according to one of items 17 to 20,
- providing a transmittent second plastic top layer sheet on the top surface of the second plastic cover layer.
- 22. Method of manufacturing a chip card sheet, comprising
- manufacturing a chip card sheet according to one of items 17 to 21,
- providing a first plastic top layer sheet on the bottom surface of the first plastic cover layer sheet.
- 23. Method of manufacturing a chip card sheet, comprising
- manufacturing a chip card sheet according to one of items 17 to 21,
- providing at least one first chip module opening in the second plastic cover layer sheet and in the first plastic top layer sheet.
- 24. Method of manufacturing a chip card sheet according to item 23, comprising
- providing a second chip module opening in the first compensation layer sheet and in the second overlay layer sheet.
- 25. Method of manufacturing a chip card, comprising:
- providing a chip card sheet according to one of items 23 or 24,
- placing a dual-interface chip module into the first chip module opening and/or into the second chip module opening, the dual-interface chip module comprising a chip module antenna 110, a chip module PCB with ISO contact pads, a dual-interface chip and a plastic chip cover material,
- cutting out a chip card from that area of the chip card sheet that comprises the dual-interface chip module.
- 26. Method of manufacturing a chip card, comprising:
- providing a chip card sheet according to item 21 or item 22,
- cutting out a chip card area from the chip card sheet,
- providing a first chip module opening in the second plastic cover layer and in the first plastic top layer.
- 27. Method of manufacturing a chip card according to item 26, comprising:
- providing a second chip module opening in the first compensation layer and in the second overlay layer
- 28. Method of manufacturing a chip card according to item 26 or item 27, comprising:
- placing a dual-interface chip module into the first chip module opening and/or into the second chip module opening, the dual-interface chip module comprising a chip module antenna 110, a chip module PCB with ISO contact pads, a dual-interface chip and a plastic chip cover material.
- 29. Use of an upper lamination plate and a lower lamination plate for carrying out a lamination step according to one of items 17 or 18.
- 30. Item according to the aforementioned items, wherein there is provided an oscillating effect by designing the LED panel into an oscillator circuit, using the inductance of the first antenna coil or another inductance, the rectifying capacitor or another capacitance, and optionally a switching element such as a transistor.

Reference is made to the earlier patent applications U.S. 63/568,973 of 22 Mar. 2024 and U.S. Ser. No. 19/087,189 of 21 Mar. 2025 the contents of which are herein incorporated by reference. Protection may be sought for combinations of features which are disclosed in these reference documents. It is disclosed there how these features combinations contribute to achieving the technical aim of the present application and they are thus comprised in the solution of the technical problem underlying the subject matter of the present application. The features and combinations which are disclosed in the reference documents implicitly belong to the description of the subject matter in the present application and thus to the content of the present application as filed.

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