224. In some implementations, the controller 214 of the ultrasonic sensing system 200 may control the ultrasonic sensor array 212 and the image processing module 218, and the processor 220 of the mobile device 210 may control other components of the mobile device 210. In some implementations, the processor 220 communicates data to the controller 214 including, for example, instructions or commands. In some such implementations, the controller 214 may communicate data to the processor 220 including, for example, raw or processed image data (also referred to as “image information”). It should also be understood that, in some other implementations, the functionality of the controller 214 may be implemented entirely, or at least partially, by the processor 220. In some such implementations, a separate controller 214 for the ultrasonic sensing system 200 may not be required because the functions of the controller 214 may be performed by the processor 220 of the mobile device 210.

Depending on the implementation, one or both of controller 214 and processor 220 may store data in the memory 222. For example, the data stored in the memory 222 may include raw measured image data, filtered or otherwise processed image data, estimated image data, or final refined image data. The memory 222 may store processor-executable code or other executable computer-readable instructions capable of execution by one or both of controller 214 and the processor 220 to perform various operations (or to cause other components such as the ultrasonic sensor array 212, the image processing module 218, or other modules to perform operations), including any of the calculations, computations, estimations or other determinations described herein. It should also be understood that the memory 222 may collectively refer to one or more memory devices (or “components”). For example, depending on the implementation, the controller 214 may have access to and store data in a memory device different from the processor 220. In some implementations, one or more of the memory components may be implemented as a NOR- or NAND-based flash memory array. In some other implementations, one or more of the memory components may be implemented as a different type of non-volatile memory. Additionally, in some implementations, one or more of the memory components may include a volatile memory array such as, for example, a type of RAM.

In some implementations, the controller 214 or the processor 220 may communicate data stored in the memory 222 or data received directly from the image processing module 218 through an interface 216. For example, such communicated data can include image data or data derived or otherwise determined from image data. The interface 216 may collectively refer to one or more interfaces of one or more various types. In some implementations, the interface 216 may include a memory interface for receiving data from or storing data to an external memory such as a removable memory device. Additionally or alternatively, the interface 216 may include one or more wireless network interfaces or one or more wired network interfaces enabling the transfer of raw or processed data to, as well as the reception of data from, an external computing device, system, or server.

A power supply 224 may provide power to some or all of the components in the mobile device 210. The power supply 224 may include one or more of a variety of energy storage devices. For example, the power supply 224 may include a rechargeable battery, such as a nickel-cadmium battery or a lithium-ion battery. Additionally, or alternatively, the power supply 224 may include one or more supercapacitors. In some implementations, the power supply 224 may be chargeable (or “rechargeable”) using power accessed from, for example, a wall socket (or “outlet”) or a photovoltaic device (or “solar cell” or “solar cell array”) integrated with the mobile device 210. Additionally, or alternatively, the power supply 224 may be wirelessly chargeable. The power supply 224 may include a power management integrated circuit and a power management system.

As used hereinafter, the term “processing unit” refers to any combination of one or more of a controller of an ultrasonic system (for example, the controller 214), an image processing module (for example, the image processing module 218), or a separate processor of a device that includes the ultrasonic system (for example, the processor 220). In other words, operations that are described below as being performed by or using a processing unit may be performed by one or more of a controller of the ultrasonic system, an image processing module, or a separate processor of a device that includes the ultrasonic sensing system.

FIG. 3 shows a block diagram of an example system 300 that includes an ultrasonic fingerprint sensor array in communication with a controller and an application processor according to some implementations. In some aspects, the example system 300 may be viewed as an implementation of an ultrasonic sensing system, such as the 200 ultrasonic sensing system of FIG. 2A A system 300 includes an ultrasonic fingerprint sensor 310, a controller 315, and an application processor 320. The controller 315 may correspond to an integrated circuit (e.g., control chip) such as an ASIC. In some implementations, the controller 315 may correspond to components on one or more circuit boards, flexible printed circuits, or substrates. The system 300 may be integrated within an enclosure of an electronic device or mobile device. For example, the ultrasonic fingerprint sensor 310 and the controller 315 may be integrated within or coupled with a visual display of a mobile device. As described in further detail below, the fingerprint sensor 310 and the controller 315 may be implemented in a flexible printed circuit module of a mobile device that is coupled with one or more visual displays (and/or one or more portions of a flexible visible display) of the mobile device during manufacture.

The ultrasonic fingerprint sensor 310 may correspond to ultrasonic fingerprint sensor systems and/or ultrasonic fingerprint sensors discussed elsewhere herein. The ultrasonic fingerprint sensor 310 may include an ultrasonic receiver (Rx) 325 configured to receive reflections of ultrasonic waves and an ultrasonic transmitter (Tx) 330 configured to generate ultrasonic waves, where ultrasonic waves travel through a device display. These components may be incorporated into, implemented by, and/or part of a flexible fingerprint sensor stack, as described above. The ultrasonic receiver 325 may include an array of sensor elements 335, which may also be referred to as “sensor pixels,” “pixel sensor circuits,” “sensor circuits,” and “pixels.” The array of sensor elements 335 may be coupled with a piezoelectric receiver layer, and the piezoelectric receiver layer may be coupled with an electrode receiver layer. Each of the sensor elements 335 may include thin film transistors (TFTs) and other active and passive components. The piezoelectric receiver layer is configured to generate an electric charge from the reflections of ultrasonic waves, and the array of sensor elements 335 converts the electric charge into an electrical signal for generating an image. The ultrasonic transmitter 330 may include an array of electrode segments 340, where the array of electrode segments 340 may be arranged in an M×N array of segments. The array of electrode segments 340 may be coupled to a piezoelectric transmitter layer. Ultrasonic waves are generated by applying a voltage across the piezoelectric transmitter layer by the array of electrode segments 340, thereby causing the piezoelectric transmitter layer to expand or contract in a manner that generates ultrasonic waves. In some implementations, depending on a localized readout from the array of sensor elements 335, a voltage burst or tone burst will be applied to one or more of electrode segments in the array of electrode segments 340 to drive the ultrasonic transmitter 330. The array of electrode segments 340 may be disposed on one side of the piezoelectric transmitter layer to perform a single-ended drive, or the array of electrode segments 340 may be disposed on both sides of the piezoelectric transmitter layer to perform a differential drive. In some implementations, the array of electrode segments 340 may be arranged in a “stripes” design or in an “islands” design.

Though the system 300 shows an ultrasonic fingerprint sensor 310 with separate ultrasonic receiver 325 and ultrasonic transmitter 330, it will be understood that the ultrasonic fingerprint sensor 310 may be implemented with an ultrasonic transceiver with a piezoelectric layer serving as a piezoelectric transmitter and receiver. An array of sensor elements may be coupled to the piezoeletric layer for performing receiving functions, and an array of electrode segments may be coupled to the piezoelectric layer for performing transmitter functions. The array of electrode segments may be coupled to one side of the piezoelectric layer for single-ended driving.

The controller 315 may be electrically coupled to the ultrasonic fingerprint sensor 310, where the controller 315 may be electrically coupled to the ultrasonic receiver 325 and the array of sensor elements 335, and electrically coupled to the ultrasonic transmitter 330 and the array of electrode segments 340. The controller 315 may include a sensor/drive interface 345, core logic 350, and a processor interface 355.

An application processor (AP) 320 may be electrically coupled to the controller 315. The application processor 320 may execute instructions 360 and may store or access data 365. The application processor 320 may execute one or more applications that cause the application processor 320 to communicate with the controller 315. For example, the application processor 320 may execute an application 370.

During operation, the controller 315 may control one or more operations of the ultrasonic fingerprint sensor 310, such as in response to commands received from the application processor 320 via the processor interface 355. In some implementations, the controller 315 is configured to detect a position of an object over the ultrasonic fingerprint sensor 310 using an external touch controller or using piezo-touch capabilities of the ultrasonic transmitter 330 having a piezoelectric transmitter layer.

Where the controller 315 is configured to detect touch using an external touch controller, the external touch controller may be in the form of an external chip or other external circuitry. The external touch controller is separate from the ultrasonic fingerprint sensor 310. The external touch controller may detect touch at a localized area (e.g., x-y coordinates) (e.g., as shown by boxes 140 in FIG. 1A and boxes 180 in FIG. 1B), and the application processor 320 will transmit a signal to the controller 315 to initiate fingerprint sensing on the detected localized area using the ultrasonic fingerprint sensor 310.

Where the controller 315 is configured to detect touch using piezo-touch capabilities of the ultrasonic fingerprint sensor 310, the ultrasonic fingerprint sensor system 310 may detect touch in one of several ways.

In some implementations of piezo-touch, the ultrasonic transmitter 330 having the array of electrode segments 340 may function as an array of passive piezoelectric microphones. Accordingly, low resolution touch location is identified using the array of electrode segments 340. The piezoelectric transmitter layer may receive reflections of ultrasonic waves at a localized area of the ultrasonic transmitter 330, which can be converted to electrical signals to one or more electrode segments 340 indicative of sensing touch at the localized area (e.g., x-y coordinates). The controller 315 may apply a bias voltage to the array of electrode segments 340 to provide desired sampling for detecting ultrasonic waves. This is a passive receiving method without any tone burst event, and the resolution corresponds to the array of electrode segments 340.

In some implementations of piezo-touch, the array of electrode segments 340 and the array of sensor elements 335 may perform an active receiving method for detecting touch in a localized area. First, low resolution touch location is identified using the array of electrode segments 340, where the array of electrode segments 340 function as passive piezoelectric microphones. In response to detecting a position of an object over the ultrasonic fingerprint sensor 310, the controller 315 may apply a voltage burst or tone burst tone or more electrode segments 340 corresponding to the localized area(s) over which touch is detected. The one or more electrode segments 340 may be selected to receive the voltage burst either sequentially or simultaneously via the sensor/drive interface 345 of the controller 315. Application of the voltage burst causes generation of an ultrasonic wave from the piezoelectric transmitter layer of the ultrasonic transmitter 330. The ultrasonic wave or a portion of the ultrasonic wave may be reflected from an object, such as a stylus or finger. The reflected ultrasonic wave may be detected by the piezoelectric receiver 325. An electric charge generated by a piezoelectric receiver layer is converted to an electrical signal by the array of sensor elements 335. The electrical signal includes data output signals that are received by the sensor/drive interface 345 of the controller 315 and processed by the core logic 350 so that a localized readout of the data output signals is generated. The localized readout can provide a digital representation or image of the object to the application processor 320 via the processor interface 355. The localized readout can be based on localized generation of ultrasonic waves from application of the voltage burst to one or more electrode segments 340. This is an active receiving method with a tone burst event, and the resolution is typically greater than the array of electrode segments 340.

In some implementations of piezo-touch, the ultrasonic fingerprint sensor 310 may perform an active receiving method that uses a tone burst for a partial frame readout. Low resolution touch location is identified using the array of electrode segments 340. Detection of touch by the array of electrode segments 340 can trigger a partial frame readout. The controller 315 may apply a voltage burst or tone burst to one or more electrode segments 340, and a partial frame readout is performed by the array of sensor elements 335 to identify whether an object is a finger or not.

In some implementations of piezo-touch, the ultrasonic receiver 325 with the array of sensor elements 335 may perform a passive receiving method for detecting touch in a localized area. Mechanical deformation of a piezoelectric receiver layer by an object such as a stylus can cause localized generation of ultrasonic waves. In other words, detection of an object such as a stylus can occur by passive detection of shock waves. Electric charge generated by the ultrasonic waves is converted to an electrical signal by the array of sensor elements 335. A full frame or a partial frame readout can be performed by the array of sensor elements 335. In some implementations, a partial frame readout can improve frame rate. Application of a tone burst is not necessary for detecting stylus movement. In some implementations, direction of the stylus can be detected from impulse response shape.

As with FIGS. 1A and 1B and other figures discussed herein, FIGS. 2A-3 are provided as non-limiting examples for the purposes of describing how fingerprint sensors, and ultrasonic fingerprint sensors in particular, may be implemented in various embodiments. Alternative embodiments may rearrange, add, and/or omit components, based on desired functionality, manufacturing concerns, and/or other factors.

As previously noted, embodiments herein can provide enhancements to the implementation of traditional fingerprint sensors, including ultrasonic fingerprint sensors, by providing for multiple fingerprint sensors to be controlled by a single controller (e.g., control chip). In addition to providing the cost savings previously noted, this can also enable enhanced security by leveraging the multiple fingerprint sensors. Additional details are described with respect to FIG. 4. That said, embodiments are not limited to ultrasonic fingerprint sensors. Some embodiments may use other types of fingerprint sensors (e.g., capacitive, optical, etc.), non-fingerprint sensors (e.g., a gesture button, for sensor, etc.), or any combination thereof.

FIG. 4 is an illustration of a foldable electronic device 400 for which enhanced security is enabled by leveraging multiple fingerprint sensors. In this example, ultrasonic fingerprint sensors are located at a first location 410, a second location 420, and a third location 430. According to some embodiments, ultrasonic fingerprint sensors at these locations 410, 420, and 430 may be operated to increase security (e.g., beyond fingerprint sensing) based on any combination of an order of a fingerprint match, timing of a match, force of a match, or other data that can be obtained during a fingerprint sensing process. As an example, to enroll in fingerprint sensing and/or pass a security screening (e.g., to unlock a device, open an application, etc.) a user may need to first place a finger at the first location 410, then place a finger (the same finger or a different (e.g., preselected) finger) at the second location 420, then place a finger (again, the same or different finger) at the third location 430. In another example, the user may need to place figures at all three locations 410, 420, and 430 simultaneously. In yet another example, to enroll and/or authenticate using fingerprints, the user may place a first finger on a first location 410, place a second finger on a second location 420, or simultaneously place first and second fingers on the first and second locations 410 and 420, respectively. Additionally or alternatively, a user may be asked to place fingers at second location 420 and third location 430 with regular force, but place a finger at first location 410 with heavy force (e.g., above a certain threshold amount of force, detectable by the fingerprint sensor at first location 410). In some embodiments, fingerprint (or multifunction) sensors at locations 410, 420, and 430 may be controlled by the same controller, or may be controlled by (e.g., two or three) different controllers.

By coupling multiple fingerprint sensors to a single controller in the manner described herein, data from multiple fingerprint sensors can be processed directly on the controller chip, rather than stored in a separate memory of the device. This can reduce latency and also reduce the risk of data leakage, increasing security. Further, because fingerprint information obtained by the multiple fingerprint sensors can be stored by the controller, fingerprint information obtained by one sensor may be subsequently used at other locations. For example, in FIG. 4, a user may scan a thumbprint at location 410 for subsequent authentication, then subsequently perform authentication by scanning the thumbprint at location 420 and/or 430. Again, because this thumbprint data may be stored by the controller, the risk of unauthorized access to the thumbprint data is reduced. Information provided by the controller to the application processor and/or memory of the electronic device 400 may be limited to a confirmation that fingerprint authentication was successful, rather than the transfer of any fingerprint data.

According to embodiments, the manufacturer of electronic devices having multiple fingerprint sensors controlled by a single controller may be enabled in different ways. FIGS. 5 and 6, discussed below, offer examples of how ultrasonic fingerprint sensor systems having multiple fingerprint sensors controlled by a single controller can be implemented in different ways using different flexible printed circuit modules to facilitate the inclusion of multiple ultrasonic fingerprint sensors into various types of electronic devices, including those having flexible displays.

FIG. 5 is an illustration of a flexible printed circuit module 500, according to a first embodiment. In this embodiment, fingerprint sensors 510-1 and 510-2 (collectively and generically referred to herein as fingerprint sensors 510) may correspond with fingerprint sensors described in embodiments above, including ultrasonic FP sensor 310 of FIG. 3, sensor system 202, and/or other fingerprint sensors described herein that may be used in displays as indicated in FIGS. 1A and 1B, for example (e.g., at locations shown by boxes 140 and 180). Thus, fingerprint sensors 510 may comprise a stack of materials as previously described to provide fingerprint sensing. This may include thin-film transistor (TFT) materials that can enable the fingerprint sensors 510 to have some flexibility, allowing them to be used with lightweight, bendable, and even rollable displays, including displays such as those illustrated in FIGS. 1A, 1B, and 4. Additionally or alternatively, embodiments may use silicon (Si) sensors (which may not have the flexibility of TFT materials). Other embodiments may use capacitive sensors, optical sensors, and/or other types of sensors. Additionally or alternatively, fingerprint sensors 510 might be multifunction ultrasonic sensors capable on multiple types of sensing (e.g., fingerprint, stylus input, gesture detection, etc.). Although only two fingerprint sensors are illustrated in FIG. 5, a person of ordinary skill in the art will appreciate that alternative embodiments may have three or more fingerprint sensors, depending on desired functionality.

A flexible printed circuit substrate 520 can be used to electronically connect the fingerprint sensors 510 with a control chip 530. As a person of ordinary skill in the art will appreciate, the flexible printed circuit substrate 520 may comprise a type of circuit board made of a flexible material (e.g., polyimide) with electrical traces (e.g., made from conductors, such as copper) and insulators to allow it to perform as a fully functional printed circuit board that electronically connects various circuits, including integrated circuits, or chips. Its flexibility allows it to be bent or folded, which can be especially beneficial when using the flexible printed circuit module 500 and electronic device with a foldable display. In some embodiments, for example, a portion of the flexible printed circuit substrate 520 may bridge a fold in a foldable device (e.g., folds 170 in electronic device 150 of FIG. 1B), allowing each fingerprint sensor 510 to be on either side of a fold in a display, or on either side of the fold in a device having more than one display. According to some embodiments, any or all of the fingerprint sensors 510 and/or control chip 530 may be mounted onto the flexible printed circuit substrate 520 in the chip-on-flex (COF) configuration.

The control chip 530 may comprise an ASIC, Tx power chip (e.g., amplifier or LC circuit to power fingerprint sensors 510), or other control system as described herein (e.g., control system 204 of FIG. 2A, controller 214 of FIG. 2B, or controller 315 of FIG. 3), configured to control the fingerprint sensors 510. The control chip 530 may not only control the fingerprint sensors 510, but may also communicate with an application processor or other component(s) of an electronic device in order to perform the various functions of fingerprint sensing described herein. The communication between the control chip 530 and the application processor (and/or other component(s)) may be achieved via a connector 540 on the flexible printed circuit module 500. In some embodiments, connector 540 may be electronically connected with a data bus to allow communications between the control chip 530 and one or more other components (e.g., an application processor) located elsewhere on the electronic device into which the flexible printed circuit module 500 is integrated.

During manufacture, each of the fingerprint sensors 510 may be laminated to a respective display (or respective portion of a single display). Testing may then be performed to ensure that the fingerprint sensors 510 work properly. This may include “tuning” the fingerprint sensors 510 to their respective display(s). Tuning parameters may include, for example, timing and frequency parameters for each fingerprint sensor 510, based on the specific display(s) to which each fingerprint sensor 510 is coupled. These parameters may vary, for example, based on glass thickness, which can vary from display to display. Thus, such tuning may be performed after the fingerprint sensors 510 are coupled with the display(s) (e.g., after lamination). In some embodiments, tuning parameters may be stored in the memory of the ASIC 530.

FIG. 6 is an illustration of another flexible printed circuit module 600, according to a second embodiment. In many aspects, the flexible printed circuit module 600 of FIG. 6 is similar to the flexible printed circuit module 500 of FIG. 5. More specifically, it has fingerprint sensors 610-1 and 610-2 (collectively and generically referred to herein as fingerprint sensors 610), a first flexible printed circuit substrate 620, a control chip 630, and a first connector 640. These components may have functionality similar to the corresponding components in FIG. 5, described above.

A key difference between the flexible printed circuit module 600 of FIG. 6 and the flexible printed circuit module 500 of FIG. 5 is the use of a second printed circuit substrate 650. As shown in FIG. 6, the first printed circuit substrate 620 includes the control chip 630 and a first fingerprint sensor 610-1, either or both of which may be mounted onto the first flexible printed circuit substrate 620 using COF technology, according to some embodiments. A second fingerprint sensor 610-2 is mounted on and/or incorporated into the second flexible printed circuit substrate 650. The second flexible printed circuit substrate 650 is electronically coupled with the first flexible printed circuit substrate 620 via a second connector 660 (e.g., a zero insertion force (ZIF) connector or similar) in what could be considered a “master” and “slave” design, where a first submodule 670 of the flexible printed circuit module 600 (e.g., comprising the control chip 630, among other components) may operate as a master component, and a second submodule 680 (e.g., comprising the second flexible printed circuit substrate 650 and second fingerprint sensor 610-2) may operate as a slave component. Alternative embodiments may include one or more additional fingerprint sensors on the first portion 670 and/or second portion 680. Additionally or alternatively, additional fingerprint sensors may be included in additional submodules (each of which may comprise one or more fingerprint sensors), which may be connected to the first submodule 670 in a manner similar to the second submodule 680.

An additional feature that the flexible printed circuit module 600 may include is a memory chip 690 coupled with the second flexible printed circuit substrate 650. According to some embodiments, the memory chip 690 may comprise an erasable programmable read-only memory (EPROM) and/or other nonvolatile memory, for example. Together with the second connector 660, the memory chip 690 can enable the second submodule 680 to be separately manufactured from the first submodule 670. More specifically, during manufacture, after the second fingerprint sensor 610-2 is coupled to a display (e.g., after lamination), the second submodule 680 may be connected via the second connector 660 to a testing board capable of performing the tuning of the second fingerprint sensor 610-2 to its display in a manner similar to the controller chip 630. The testing board can then write the tuning parameters to the memory chip 690, enabling the second printed circuit module 680 to be manufactured separately from the first submodule 670. (In other words, the first submodule 670 and second submodule 680 may be manufactured separately, and subsequently coupled as illustrated in FIG. 6 during the assembly process.) The second submodule 680 subsequently may be coupled with the first submodule 670 via the second connector 660. Thus, any second module 680, once tuned, can be coupled with any first module 670. This can simplify the manufacturing process that enables two or more fingerprint sensors 610 to be coupled to a single controller chip 630. Once the second submodule 680 is coupled with the first submodule 670, the second fingerprint sensor 610-2 is electrically and communicatively coupled with the controller chip 630. The memory chip 690 may also be electrically and communicatively coupled with the controller chip 630. However, this may depend on the capabilities of the controller chip 630. If the controller chip 630 does not have I/O pins available to read from and/or write to the memory chip 690, some embodiments may electrically couple the memory chip 690 to the first connector 640 (e.g., a flexible printed circuit (FPC) connector or other board-to-board (B2B) connector), enabling another component (e.g., an application processor) to read from and/or write to the memory chip 690 (e.g., using a bus such as an inter-integrated circuit (I2C) bus) and relay the read/write operations to the controller chip 630. In some embodiments, the controller chip 630 may store the tuning parameters stored in the memory chip 690 once the second submodule 680 is coupled with the first submodule 670 (and, if applicable, an application processor relays information from the memory chip 690 to the controller chip 630).

Depending on the capabilities of the controller chip, some additional circuitry may be needed, in some embodiments, to help route signals from a plurality of fingerprint sensors to the correct pins of a controller chip. This can include components such as multiplexer(s) (mux(es)), switch(es), and/or other such circuitry. FIGS. 7 and 8, discussed below, show examples of how a plurality of fingerprint sensors may be coupled with an existing ASIC

FIG. 7 is a schematic diagram of a configuration 700 in which a number, n, of muxes 710 may be used to route output signals from a number, m, of fingerprint sensors 720 to an ASIC 730. It will be understood that the configuration 700 represents a generalized implementation in which m>2 and n>1, and where other electronic connections between components (e.g., control signals to muxes 710, other signaling between the fingerprint sensors 720 and ASIC 730, etc.) are omitted to avoid clutter. In some embodiments, muxes 710 may comprise one or more discrete components.

A configuration like this can allow an ASIC 730 to switch between signals of the various fingerprint sensors 720. This configuration 700 may provide similar functionality, from a user's perspective, to a configuration in which each fingerprint sensor has a separate ASIC. That is, an ASIC may switch between fingerprint sensors 720 at a rate that allows fingerprint sensing of the various fingerprint sensors 720 to occur nearly simultaneously from the perspective of the user. That said, there may be additional considerations to take into account when controlling multiple fingerprint sensors 720 with a single ASIC 730. Some such considerations are described below with respect to FIGS. 8-10.

FIG. 8 is a schematic illustration of a first example configuration 800, illustrating how pins of a first sensor 810-1 and a second sensor 810-2 (collectively and generically referred to herein as sensors 810) can be routed to a controller 820 (optionally through connector 830, as illustrated in FIG. 6). The configuration 800 further includes a memory 835 (e.g., EPROM), which may be used as described above, e.g., with respect to FIG. 6. Submodules 833 and 837 may correspond with submodules 670 and 680 in FIG. 6, for example. Arrows show the direction of signals. Sensors 810 may comprise, for example, ultrasonic fingerprint sensors, multipurpose ultrasonic sensors, optical and/or capacitive fingerprint sensors, and/or other types of sensors associated with the display. Because controller designs very, it will be understood that the example configuration 800 is provided for illustrative purposes, and the discussion below illustrates some considerations that may be taken into account when multiple sensors are controlled by a single control chip (e.g., controller 820). Alternative embodiments utilizing various alternative controllers may utilize similar considerations based on the types of pins available for a specific controller (e.g., ASIC or TX power chip) in a particular implementation. The example configuration 800 in which a single controller 820 is used to control two sensors 810, may reflect previously-described embodiments in FIGS. 5-7, for example. Further, it will be understood that the pins (inputs and outputs of each component) illustrated in FIG. 8 may represent only a subset of the total number of pins for any or all of the components. The considerations described below with respect to the specific controllers shown in FIGS. 8-10 may be applied to other types of control chips. It can be further noted that the configuration 800 also identifies various components (touch controller 840, application processor 850, and power source 860) of the mobile device with which the controller 820 and memory 835 may communicate via the B2B connector 870. (Subsequent configurations illustrated in FIGS. 9 and 10 do not explicitly show such components, but may be similarly connected.)

In this example, the controller 820 has various outputs that can be used to control the two sensors 810. These pins include low-dropout voltage regulator (LDO), voltage-controlled switch (VSW), receive (RX), electrical ground (GND), general-purpose output (GPO), and sense (Asense), and they may be connected (e.g., via conductive traces on a flexible printed circuit (FPC), as previously described) with corresponding pins of the sensors 810. (Note that VSW pins of the controller 820 may be connected with transmit (TX) pins of each sensor 810, as shown.) In this example, the controller 820 may have sufficient Rx channels to receive sensor data from the Rx pins of each sensor 810 without the need to switch between pins. However, in some embodiments, switching can be performed by one or more muxes, in the manner shown in FIG. 7 (or FIG. 10, described below), for example, and may require the use of additional pins of the controller 820 to provide a control signal to control the switching.)

In this example, the Asense pin of the sensors may comprise sensor information, such as temperature and/or voltage-based sensing, which may be used by the controller 820 for accurate sensing. According to some embodiments, considerations for temperature sensing when coupling a controller to multiple sensors may not only include whether there are sufficient temperature sensing (e.g., Asense) pins, but also power and timing considerations. In the example in FIG. 8, the controller 820 has two sense pins (AI1 and AI2), enabling the controller 820 to control sensing (e.g., temperature sensing) for each sensor 810 without the need to switch between sensors 810. Even so, the sensing function may require the controller 820 to drive in output current to power a sensor in each sensor 810 (e.g., a temperature sense diode). Powering sensors in both sensors 810 at the same time may require a relatively large amount of power, which could make the controller 820 bulkier. Thus, according to some embodiments, the controller 820 may drive sensing for sensors 810 at different times.

Embodiments that utilize switching between one or more sense (Asense) pins (in instances in which the number of sensors is larger than the number of sense pins of a controller) may do so in a manner that accommodates the current output of the sense pin(s). For TFT-based ultrasonic sensors, a knowledge of the temperature where the sensor is located may be needed for sensing to work properly. Thus, the temperature is monitored (e.g., using Asense pins) to determine how a baseline is drifting/changing. (If a change occurs beyond a threshold, a new temperature/baseline may be stored by the controller.) According to some embodiments, controllers may switch between one or more sense pins by utilizing one or more internal switches in the controller to perform sensing (e.g., temperature sensing) with more than one sensors. This can allow an controller to read signals from multiple sensors sequentially using a single port (pin) on the controller. Because monitoring sensing may occur with a relatively low periodicity (e.g., every 30 seconds), but switching components may provide switching between sensors at a relatively high speed (e.g., 1 ms), such switching can easily accommodate sensing (e.g., temperature sensing) across multiple sensors. Again, a controller may use one or more pins to provide a control signal to control switching between sensors, and switching in this manner can be expanded to other types of pins, in addition, or as an alternative to, sense pins. FIG. 9 is a schematic illustration of a second example configuration 900, providing another example of how pins of sensors 910-1 and 910-2 can be routed to a controller 920. As can be seen, the pins of the sensors 910 and controller 920 are generally similar to those illustrated in FIG. 8, described above, and may operate in a similar manner. In this configuration 900, however, various pins of the controller 920 are connected with various pins of the sensors 910 using various traces/conductors, represented by line 930. Thus, ground (GND) pins of the controller 920 and sensors 910 may be electrically connected by a single conductor/trace, RX pins of the controller 920 and sensors 910 may be electrically connected by another single conductor/trace, and so forth. General outputs (GPOs) of the controller 920 may be used to activate different sensors 910, one at a time, to control each sensor 910. For example, the controller 920 may activate the first sensor 910-1 at a first time, allowing the RX, GPO, and AI pins of the controller 920 to receive outputs from the first sensor 910-1 as illustrated. Subsequently (e.g., once the first sensor 910-1 is deactivated), the controller may then activate the second sensor 910-2 at a second time, allowing the RX, GPO, and AI pins of the controller 920 to receive outputs from the second sensor 910-2 as illustrated.

FIG. 10 is a schematic illustration of a third example configuration 1000, providing yet another example of how pins of sensors 1010-1 and 1010-2 can be routed to a controller 1020. Again, the pins of the sensors 1010 and controller 1020 are generally similar to those illustrated in FIG. 8, described above, and may operate in a similar manner. In this configuration 1000, various pins of the controller 1020 are connected with various pins of the sensors 1010 via a mux 1030. Thus, in contrast with the configuration 900 in FIG. 9 in which the controller 920 activated each sensor 910, the controller 1020 in the configuration 1000 of FIG. 10 will simply switch between the outputs of each sensor 1010 using the mux 1030. (It can be noted that outputs of the controller 1020 that control the switching of the mux 1030 are not illustrated in FIG. 10.)

As used herein, a phrase referring to “at least one of” a list of items refers to any combination of those items, including single members. As an example, “at least one of: a, b, or c” is intended to cover: a, b, c, a-b, a-c, b-c, and a-b-c.

The various illustrative logics, logical blocks, modules, circuits and algorithm processes described in connection with the implementations disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. The interchangeability of hardware and software has been described generally, in terms of functionality, and illustrated in the various illustrative components, blocks, modules, circuits and processes described above. Whether such functionality is implemented in hardware or software depends upon the particular application and design constraints imposed on the overall system.

The hardware and data processing apparatus used to implement the various illustrative logics, logical blocks, modules and circuits described in connection with the aspects disclosed herein may be implemented or performed with a general purpose single- or multi-chip processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. A general purpose processor may be a microprocessor, or, any conventional processor, controller, microcontroller, or state machine. A processor also may be implemented as a combination of computing devices, e.g., a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration. In some implementations, particular processes and methods may be performed by circuitry that is specific to a given function.

In one or more aspects, the functions described may be implemented in hardware, digital electronic circuitry, computer software, firmware, including the structures disclosed in this specification and their structural equivalents thereof, or in any combination thereof. Implementations of the subject matter described in this specification also may be implemented as one or more computer programs, i.e., one or more modules of computer program instructions, encoded on a computer storage media for execution by, or to control the operation of, data processing apparatus.

If implemented in software, the functions may be stored on or transmitted over as one or more instructions or code on a computer-readable medium, such as a non-transitory medium. The processes of a method or algorithm disclosed herein may be implemented in a processor-executable software module which may reside on a computer-readable medium. Computer-readable media include both computer storage media and communication media including any medium that may be enabled to transfer a computer program from one place to another. Storage media may be any available media that may be accessed by a computer. By way of example, and not limitation, non-transitory media may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium that may be used to store desired program code in the form of instructions or data structures and that may be accessed by a computer. Also, any connection may be properly termed a computer-readable medium. Disk and disc, as used herein, includes compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk, and Blu-ray disc where disks usually reproduce data magnetically, while discs reproduce data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media. Additionally, the operations of a method or algorithm may reside as one or any combination or set of codes and instructions on a machine readable medium and computer-readable medium, which may be incorporated into a computer program product.