1. A method for ablating a coating film, cutting glass, and performing post-treatment by using a laser, the method comprising: (S1) coating one side or both sides of a mother glass (1) having a thickness of approximately 100 μm or less with a coating solution to prevent chemical contact during selective chemical treatment;

(S2) drying the coating solution to form the coating film (2) on one side or both sides of the mother glass (1);

(S3) irradiating the coating film (2) with an ablating laser beam to partially ablate the coating film (2), and irradiating a surface of the mother glass (1) exposed through the ablated portion (A) of the coating film (2) with a cutting laser beam to cut the mother glass (1), thereby obtaining thin-film glasses in cell units (5), each having a thickness of approximately 100 μm or less and suitable for use in electrical and electronic products;

(S4) chemically treating a laser-cut surface of the cell unit glasses (5) to eliminate a thermally-damaged area or other defective area generated during the laser cutting process, thereby forming a bevel-shaped cut portion (11) at a right-angled corner of the cell unit glasses (5) facing the coating film (2),

wherein the bevel-shaped cut portion (11) has a horizontal width (W) of approximately 3 μm to approximately 500 μm, a height (H) of approximately 3 μm or greater, and a thickness of no greater than approximately 50% of the thickness of the thin-film glasses in cell units (5);

(S5) ablating a remainder of the coating film (2) formed on a surface of the cell unit glasses (5); and

(S6) chemically treating the surface of the cell unit glasses (5) from which the coating film (2) has been ablated to eliminate defects or flaws on the surface of the cell unit glasses (5),

wherein:

the ablating laser beam is an ultraviolet laser (4) and the cutting laser beam is an infrared laser (3);

the infrared laser (3) outputs a Bessel beam

having a wavelength of approximately 1020-1040 nm and a beam size of approximately 0.8-1.8 μm, and is selected from a nanosecond, picosecond, or femtosecond infrared laser;

the ultraviolet laser (4) is a femtosecond ultraviolet laser equipped with a scanner, the ultraviolet laser (4) having a wavelength of approximately 250-360 nm, a beam size of approximately 5-50 μm, and an overlap rate of approximately 10-99%; and

the coating solution comprises either (i) an acrylic solution, or (ii) a resin solution selected from polyethylene, polypropylene, polyvinyl chloride, and polystyrene, the resin solution having an ultraviolet absorption rate of approximately 10% or greater at a wavelength of 400 nm or less and an infrared absorption rate of approximately 1% or less at a wavelength of 1000 nm or greater.