112 and 113 may basically serve to prevent damage to the internal electrodes due to physical or chemical stress. The cover portions 112 and 113 may have the same configuration as the dielectric layer 111 except that they do not include the internal electrodes.

An average thickness tc of the cover portions 112 and 113 does not need to be particularly limited, but may be, for example, 20 μm or less, more preferably 10 μm or less. Here, the average thickness of the cover portions 112 and 113 denotes an average thickness of each of the first cover portion 112 and the second cover portion 113. The average thickness tc of the cover portions 112 and 113 may denotes an average size of the cover portions 112 and 113 in the first direction, and may be a value obtained by averaging first directional sizes measured at five points spaced apart from each other at equal intervals in the cross-sections of the body 110 in the first direction and the second direction.

The external electrodes 130 and 140 may be disposed on the third surface 3 and the fourth surface 4 of the body 110, and may extend onto portions of the first, second, fifth and sixth surfaces. Furthermore, the external electrodes 130 and 140 may include a first external electrode 130 disposed on the third surface 3 and connected to the first internal electrode 121, and a second external electrode 140 disposed on the fourth surface 4 and connected to the second internal electrode 122.

Furthermore, as illustrated in FIG. 3, the external electrodes 130 and 140 include basic electrode layers 131 and 141 connected to the internal electrodes 121 and 122, intermediate electrode layers 132 and 142 disposed on the basic electrode layers, and terminal electrode layers 133 and 143 disposed on the intermediate electrode layer.

The basic electrode layers 131 and 141 may include a conductive metal and glass. The glass included in the basic electrode layers 131 and 141 may serve to improve bonding force between the external electrodes 130 and 140 and the body 110. The basic electrode layers 131 and 141 may be formed, for example, by dipping the third surface 3 and the fourth surface 4 of the body 110 in a conductive paste including the conductive metal and the glass and then sintering the third surface 3 and the fourth surface 4 of the body 110.

The conductive metal included in the basic electrode layers 131 and 141 may include copper (Cu), nickel (Ni), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), lead (Pb), and/or alloys containing these metals, but the present disclosure is not limited thereto.

The intermediate electrode layers 132 and 142 may include, for example, a conductive metal and a resin. As the conductive metal included in the intermediate electrode layers 132 and 142, a material having excellent electrical conductivity may be used, but the present disclosure is not particularly limited. For example, the conductive metal included in the intermediate electrode layers 132 and 142 may include copper (Cu), nickel (Ni), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), lead (Pb), and/or alloys containing these metals.

A resin included in the intermediate electrode layers 132 and 142 may be a thermosetting resin, and may include, for example, one or more of an epoxy resin, a phenol resin, a urethane resin, a silicone resin, and a polyimide resin, but the present disclosure is not limited thereto. The intermediate electrode layers 132 and 142 may be formed by applying and curing a conductive resin composition including the conductive metal and the resin.

Because the intermediate electrode layers 132 and 142 include a resin, they may have relatively higher flexibility than the basic electrode layers 131 and 141. Accordingly, the intermediate electrode layers 132 and 142 may protect the body 110 of the multilayer ceramic capacitor 100 from external physical shocks or bending shocks, may prevent cracks from occurring in the multilayer ceramic capacitor 100, and may suppress acoustic noise by adsorbing piezoelectric vibration caused by the dielectric layer 111.

The terminal electrode layers 133 and 143 may improve mounting characteristics. The type of the terminal electrode layers 133 and 143 is not particularly limited, and may be a plating layer including nickel (Ni), tin (Sn), palladium (Pd), and/or alloys containing these metals, and may be formed of a plurality of layers. The terminal electrode layers 133 and 143 may be, for example, a nickel (Ni) plating layer or a tin (Sn) plating layer, or may be formed by sequentially forming the nickel (Ni) plating layer and the tin (Sn) plating layer. Furthermore, the terminal electrode layers 133 and 143 may include a plurality of nickel (Ni) plating layers and/or a plurality of tin (Sn) plating layers.

Referring to FIGS. 3 to 5, a composite electronic component 1000 according to a first example embodiment may include interposers 200 and 300 disposed on the first surface 1 of the body 110, and the interposer may include a first interposer 200 connected to the first external electrode 130 and a second interposer 300 connected to the second external electrode 140. The first interposer 200 may be connected to the first external electrode 130 through a first conductive bonding agent 410, and the second interposer 300 may be connected to the second external electrode 140 through a second conductive bonding agent 420.

Referring to FIG. 4, a printed circuit board 600 on which the composite electronic component 1000 according to the first example embodiment is mounted may include a first electrode pad 610 and a second electrode pad 620 on one surface thereof, and the first and second interposers 200 and 300 may be electrically connected to the first and second electrode pads 610 and 620 through a first conductive mounting agent 510 and a second conductive mount agent 520, respectively. The conductive bonding agents 410 and 420 and the conductive mounting agents 510 and 520 may be, for example, solders for bonding, and may include at least one of tin (Sn), antimony (Sb), cadmium (Cd), lead (Pb), zinc (Zn), aluminum (Al), and copper (Cu), but the present disclosure is not limited thereto.

When voltages having different polarities are applied to the first and second external electrodes 130 and 140 in a state in which the composite electronic component 1000 is mounted on the printed circuit board 600, due to a reverse piezoelectric effect of the dielectric layer 111, the body 110 can repeatedly expand and contract to generate vibrations, and such vibrations may be transmitted to the printed circuit board 600, thus causing the acoustic noise.

Meanwhile, in the case of the composite electronic component 1000 according to the first example embodiment, the interposers 200 and 300 may be disposed on the first surface 1 oriented toward a mounting direction of the multilayer ceramic capacitor 100, so that the multilayer ceramic capacitor 100 may be spaced apart from the printed circuit board 600. Accordingly, vibrations transmitted from the multilayer ceramic capacitor 100 to the printed circuit board 600 may be absorbed to reduce the acoustic noise.

The first interposer 200 may include, for example, a first substrate 210, a first electrode 220 disposed outside the first substrate, and a first via 230 penetrating through a portion of the first interposer 200. Furthermore, the second interposer 300 may include, for example, a second substrate 310, a second electrode 320 disposed outside the second substrate, and a second via 330 penetrating through a portion of the second interposer 300.

The first substrate 210 may include a first connection substrate 211 adjacent to the multilayer ceramic capacitor 100 and a first mounting substrate 212 disposed below the first connection substrate 211. The second substrate 310 may include a second connection substrate 311 adjacent to the multilayer ceramic capacitor 100 and a second mounting substrate 312 disposed below the second connection substrate 311. The first and second substrates 210 and 310 may be formed of, for example, ceramic and/or an insulating resin. The ceramic may be, for example, Al₂O₃, and the insulating resin may be, for example, an epoxy resin, a phenol resin, and/or a polyimide resin, but the present disclosure is not limited thereto.

The first electrode 220 may include a first connection electrode 221 disposed above the first substrate 210 and connected to the first external electrode 130, and a first mounting electrode 222 disposed below the first substrate 210. The second electrode 320 may include a second connection electrode 321 disposed above the second substrate 310 and connected to the second external electrode 140, and a second mounting electrode 322 disposed below the second substrate 310. The first and second electrodes 220 and 320 may serve to electrically connect the multilayer ceramic capacitor 100 and the printed circuit board 600. The first and second electrodes 220 and 320 may include, for example, copper (Cu), nickel (Ni), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), lead (Pb), and/or alloys containing these metals.

The first via 230 may include a first connection via 231 disposed at an upper portion of the first interposer 200 adjacent to the multilayer ceramic capacitor 100, and a first mounting via 232 disposed at a lower portion of the first interposer 200. The second via 330 may include a second connection via 331 disposed at an upper portion of the second interposer 300 adjacent to the multilayer ceramic capacitor 100, and a second mounting via 332 disposed at a lower portion of the second interposer 300. As will be described later, the first and second vias 230 and 330 may serve to improve the mounting stability of the composite electronic component electrically connect the multilayer ceramic capacitor 100 and the printed circuit board 600.

In this case, when the first interposer 200 is divided into regions according to arranged position, the first interposer 200 may include a first connection unit C1 adjacent to the multilayer ceramic capacitor 100 and a first mounting unit M1 disposed below the first connection unit C1. The first connection unit C1 may include a first connection substrate 211 and a first connection electrode 221 disposed above the first connection substrate 211 and connected to the first external electrode 130, and the first mounting unit M1 may include a first mounting substrate 212 and a first mounting electrode 222 disposed below the first mounting substrate 212.

Furthermore, when the second interposer 300 is divided into regions according to arranged position, the second interposer 300 may include a second connection unit C2 adjacent to the multilayer ceramic capacitor 100 and a second mounting unit M2 disposed below the second connection unit C2. The second connection unit C2 may include a second connection substrate 311 and a second connection electrode 321 disposed above the second connection substrate 311 and connected to the second external electrode 140, and the second mounting unit M2 may include a second mounting substrate 312 and a second mounting electrode 322 disposed below the second mounting substrate 312.

According to the first example embodiment of the present disclosure, the first connection via 231 may penetrate through the first connection unit C1 in the first direction, and the first mounting via 232 may penetrate through the first mounting unit M1 in the first direction. Furthermore, the second connection via 331 may penetrate through the second connection unit C2 in the first direction, and the second mounting via 332 may penetrate through the second mounting unit M2 in the first direction. Accordingly, at least a portion of an interior of the first connection via 231 may be filled with the first conductive bonding agent 410, and at least a portion of an interior of the second connection via 331 may be filled with the second conductive bonding agent 420. As a result, bonding force between the multilayer ceramic capacitor 100 and the interposers 200 and 300 may be improved.

Meanwhile, the first connection via 231 and the first mounting via 232 may be disposed so as not to overlap each other in the first direction, and the second connection via 331 and the second mounting via 332 may be disposed so as not to overlap each other in the first direction. Accordingly, the first mounting via 232 may not be filled with the first conductive bonding agent 410, and the second mounting via 332 may not be filled with the second conductive bonding agent 420. That is, by preventing the conductive bonding agents 410 and 420 from flowing into the mounting vias 232 and 332, it may be possible to secure a space which the conductive mounting agents 510 and 520 may fill inside the mounting vias 232 and 332, which may improve the bonding force between the interposers 200 and 300 and the electrode pads 610 and 620 of the printed circuit board 600 and secure mounting stability of the composite electronic component 1000.

In this case, the first connection via 231 may not penetrate through the first mounting unit M1, and the first mounting via 232 may not penetrate through the first connection unit C1. Additionally, the second connection via 331 may not penetrate through the second mounting unit M2, and the second mounting via 332 may not penetrate through the second connection unit C2. This may prevent the connection vias 231 and 331 and the mounting vias 232 and 332 from being filled with the conductive bonding agents 410 and 420, and an interior of the mounting vias 232 and 332 may be filled with only the conductive mounting agents 510 and 520, thereby improving the mounting stability of the composite electronic component 1000.

Referring to FIGS. 5 and 6A, in an example embodiment, the first connection via 231 and the first mounting via 232 may be disposed in different positions in the second direction, and the second connection via 331 and the second mounting vias 332 may be disposed in different positions in the second direction. Accordingly, the first connection via 231 and the first mounting via 232 may be disposed so as not to overlap each other in the first direction, and the second connection via 331 and the second mounting via 332 may be disposed so as not to overlap each other in the first direction, and accordingly, it may be possible to prevent the conductive bonding agents 410 and 420 from flowing into the mounting vias 232 and 332.

However, the present disclosure is not limited thereto. For example, as illustrated in FIG. 6B, in an example embodiment, the first connection via 231 and the first mounting via 232 may be disposed in different positions in the third direction. Meanwhile, although not illustrated, the first interposer 200 and the second interposer 300 may be in a symmetrical relationship with each other in the second direction, and accordingly, the second connection via 331 and the second mounting via 332 may likewise be disposed in different positions in the third direction.

In an example embodiment, a via electrode may be disposed on an internal wall of one or more of the first connection via 231, the first mounting via 232, the second connection via 331, and the second mounting via 332. For example, as illustrated in FIG. 5, a first connection via electrode 241 may be disposed on an internal wall of the first connection via 231, and a first mounting via electrode 242 may be disposed on an inner wall of the first mounting via 232. Accordingly, the first conductive bonding agent 410 may sufficiently flow into the first connection via 231 through the first connection via electrode 241, and the first conductive mounting agent 510 may sufficiently flow into the first mounting via 232 through the first mounting via electrode 242, thereby improving the bonding force between the multilayer ceramic capacitor 100 and the interposers 200 and 300 and the bonding force between the interposers 200 and 300 and the electrode pads 610 and 620.

Referring to FIGS. 3 to 5, in an example embodiment, the first interposer 200 may include a first linking electrode 233 disposed on one side surface of the first interposer and connecting the first connection electrode 221 and the first mounting electrode 222, and the second interposer 300 may include a second linking electrode 323 disposed on one side surface of the second interposer and connecting the second connection electrode 321 and the second mounting electrode 322. Accordingly, the first electrode 220 may include the first connection electrode 221, the first mounting electrode 222, and the first linking electrode 223, and the second electrode 320 may include the second connection electrode 321, the second mounting electrode 322, and the second linking electrode 323. The linking electrodes 223 and 323 may connect the connection electrodes 221 and 321 connected to the multilayer ceramic capacitor 100 and the mounting electrodes 222 and 322 connected to the printed circuit board 600, thereby forming a path through which electricity flows between the multilayer ceramic capacitor 100 and the printed circuit board 600.

FIG. 7A is a partially enlarged view schematically illustrating a side of a first interposer of a composite electronic component according to a modified form of the first example embodiment mounted on a printed circuit board and FIG. 7B is a partially enlarged view schematically illustrating a side of a second interposer of a composite electronic component according to a modified form of the first example embodiment mounted on a printed circuit board. Referring to FIGS. 7A and 7B, in an example embodiment, a first interposer 200 includes a first intermediate electrode 224 disposed between a first connection unit C1 and a first mounting unit M1, and a second interposer 300 may include a second intermediate electrode 324 disposed between a second connection unit C2 and a second mounting unit M2. That is, the first intermediate electrode 224 may be disposed inside a first substrate 210 and connected to a first connection via 231 and a first mounting via 232, and the second intermediate electrode 324 may be disposed inside a second substrate 310 and connected to a second connection via 331 and a second mounting via 332.

In this case, the first conductive bonding agent 410 may fill a space defined by an internal wall of the first connection via 231 and the first intermediate electrode 224, and the second conductive bonding agent 420 may fill a space defined by an internal wall of the second connection via 232 and the second intermediate electrode 324. This may ensure bonding force between the multilayer ceramic capacitor 100 and the interposers 200 and 300 and simultaneously reducing a distance through which electricity flows from external electrodes 130 and 140 to electrode pads 610 and 620 of a printed circuit board 600, thereby further reducing ESL.

Furthermore, when the interposers 200 and 300 include intermediate electrodes 224 and 324, even if the first connection via 231 and the first mounting via 232 overlap each other in the first direction, or the second connection via 331 and the second mounting via 332 overlap each other in the first direction, the intermediate electrodes 224 and 324 may physically separate the connection vias 231 and 331 from the mounting vias 232 and 332, the conductive bonding agents 410 and 420 may be prevented from flowing into the mounting vias 232 and 332. Accordingly, a space in which the conductive mounting agents 510 and 520 fill inside the mounting vias 232 and 332 may be secured, thereby ensuring the stability of mounting the composite electronic component 1000.

In FIGS. 7A and 7B, the interposers 200 and 300 of the composite electronic component according to the modified form of the first example embodiment are illustrated as not including the linking electrodes 223 and 323, but the present disclosure is not limited thereto, and the interposers 200 and 300 may include both linking electrodes 223 and 323 and the intermediate electrodes 224 and 324.

Referring to FIG. 5, in an example embodiment, a first interposer 200 may include an internal surface Sin and an external surface Sout opposing each other in the second direction, and in the first and second directional cross-sections of the first interposer 200, the first connection via 231 may be disposed to be biased toward the external surface Sout based on the center of the first connection unit C1 in the second direction, and the first mounting via 232 may be disposed to be biased toward the internal surface Sin based on the center of the first mounting unit M1 in the second direction. Accordingly, the first connection via 231 filled with the first conductive bonding agent 410 and the first mounting via 232 filled with the first conductive mounting agent 510 may distribute internal stress, thereby more effectively fixing the composite electronic component 1000 mounted on the printed circuit board 600.

Furthermore, referring to FIGS. 7A and 7B, when the composite electronic component 1000 includes the intermediate electrodes 224 and 324, the first connection via 231 may be disposed to be biased toward the external surface Sout based on the center of the first connection unit C1 in the second direction, so that ESL may be further reduced by reducing the distance through which electricity flows from the external electrodes 130 and 140 to the electrode pads 610 and 620 of the printed circuit board 600.

In this case, a distance L1 in the second direction from the external surface to the internal wall of the first connection via 231 is not particularly limited, but may be within about 0.15 mm, and a distance L2 in the second direction from the internal surface to the internal wall of the first mounting via 232 is not particularly limited, but may be within about 0.15 mm. In this case, an effect of improving mounting stability of the composite electronic component 1000 and reducing the ESL may be more remarkable.

Second Example Embodiment

Next, a composite electronic component 1000 according to the second example embodiment of the present disclosure will be described. Hereinafter, among the configurations of the composite electronic component according to the second example embodiment, configurations similar to those of the first example embodiment will be given the same reference numerals, and descriptions overlapping with the above-described first example embodiment of the present disclosure will be omitted.

FIG. 8A is a partially enlarged view schematically illustrating a side of a first interposer of a composite electronic component according to a second example embodiment of the present disclosure mounted on a printed circuit board, and FIG. 8B is a partially enlarged view schematically illustrating a side of a second interposer of a composite electronic component according to a second example embodiment of the present disclosure mounted on a printed circuit board.

Referring to FIGS. 8A and 8B, a first interposer 200A may include, for example, a first substrate 210A, a first electrode 220A including a first connection electrode 221A, a first mounting electrode 222A and a first linking electrode 223A, and a first via 230A. Furthermore, a second interposer 300A may include, for example, a second substrate 310A, a second electrode 320A including a second connection electrode 321A, a second mounting electrode 322A and a second linking electrode 323A, and a second via 330A.

Furthermore, a first via electrode 240A may be disposed on an internal wall of the first via 230A, and a second via electrode 340A may be disposed on an internal wall of the second via 330A. Conductive bonding agents 410 and 420 and conductive mounting agents 510 and 520 may flow into the vias 320A and 330A through the via electrodes 240A and 340A. As a result, bonding force between the multilayer ceramic capacitor and the interposers 200A and 300A may be secured.

Meanwhile, the first interposer 200A may include a plurality of first vias 230A, and the second interposer 300A may include a plurality of second vias 330A. According to the second example embodiment of the present disclosure, the interposers 200A and 300A may include the plurality of vias 230A and 330A to provide a sufficient space into which the conductive bonding agents 410 and 420 and the conductive mounting agents 510 and 520 may flow. This may prevent the conductive bonding agents 410 and 420 for connecting the multilayer ceramic capacitor and the interposers from filling an interior of the vias 230A and 330A completely, and thus a space in which the conductive mounting agents 510 and 520 may fill inside the vias 230A and 330A may be secured, thereby improving mounting stability of the composite electronic component 1000.

The plurality of first vias 230A may be spaced apart from each other, for example, in the second direction, and the plurality of second vias 330A may be spaced apart from each other, for example, in the second direction. Among the plurality of vias, vias 230A and 330A disposed adjacently to external surfaces of the interposers 200A and 300A may serve to reduce ESL by reducing a distance in which electricity flows from the external electrode to electrode pads 610 and 620. Furthermore, among the plurality of vias, vias 230A and 330A disposed adjacently to internal surfaces of the interposers 200A and 300A may be disposed in an area in which piezoelectric vibrations occurs frequently, thereby serving to improve the mounting stability of the composite electronic component.

Third Example Embodiment

Next, a composite electronic component 1000 according to a third example embodiment of the present disclosure will be described. Hereinafter, among the configurations of the composite electronic component according to the third example embodiment, configurations similar to those of the first example embodiment will be given the same reference numerals, and descriptions overlapping with the above-described first example embodiment of the present disclosure will be omitted.

FIG. 9A is a partially enlarged view schematically illustrating a side of a first interposer of a composite electronic component according to a third example embodiment of the present disclosure mounted on a printed circuit board, and FIG. 9B is a partially enlarged view schematically illustrating a side of a second interposer of a composite electronic component according to a third example embodiment of the present disclosure mounted on a printed circuit board.

Referring to FIGS. 9A and 9B, a first interposer 200B may include, for example, a first substrate 210B, a first electrode 220B including a first connection electrode 221B, a first mounting electrode 222B and a first linking electrode 223B, and a first via 230B. Furthermore, a second interposer 300B may include, for example, a second substrate 310B, a second electrode 320B including a second connection electrode 321B, a second mounting electrode 322B and a second linking electrode 323B, and a second via 330B.