20, 30 in which the die vertically overlap one another.

It will be appreciated by those of ordinary skill in the art that the dual-die configuration of the device 10 shown in FIG. 1 can be varied while still benefiting from the advantages of a spark gap formed between a side-exposed tie bar and adjacent side-exposed corner lead. For example, while the embodiment of FIG. 1 has the first ground contact 28 of the first die 20 coupled to the die attach paddle 52 by a wire bond 66c, alternatively the lead frame 50 can have the die attach paddle integrally formed with a lead (i.e., a unitary die attach paddle and lead) and a direct ground connection can be made from the ground contact of the die to the die attach paddle and integral lead as shown in FIG. 2.

Referring to FIG. 2, an alternative multi-die integrated circuit device 200 includes a first die 220 having a first power contact 224 and a first ground contact 228, a second die 230 having a second power contact 234 and a second ground contact 238, and a lead frame 250 including a die attach paddle 252 having a tie bar 254a and leads or pins 256, 258. The first ground contact 228 is electrically coupled to the die attach paddle 252 and the second ground contact 238 is galvanically isolated from the die attach paddle 252. More generally, the first and second die 220, 230 are electrically isolated from each other.

First die 220 can include an ESD clamp 226 between its power and ground contacts 224, 228 and similarly, second die 230 can include an ESD clamp 236, between its power and ground contacts 234, 238, as shown. ESD clamps 226, 236 can be the same as or similar to ESD clamps 26, 36 of FIG. 1.

Device 200 differs from device 10 of FIG. 1 in that the die attach paddle 252 is integrally formed with at least one lead (and here with a lead 256e) as shown. With this unitary die attach paddle and lead arrangement, a direct ground connection is made from the ground contact 228 of the first die 220 to the die attach paddle 252. Thus, a wire bond connection between the first ground contact 228 and the corner lead 256g can be omitted. In other respects, device 200 can be the same as or similar to device 10 of FIG. 1.

Device 200 includes wire bonds 266a, 266b with which electrical connection is made to the first die 220 and wire bonds 268a, 268b with which electrical connection is made to the second die 230. For example, wire bond 266a electrically connects the first power contact 224 to a lead 256a and wire bond 266b electrically connects first ground contact 228 to the die attach paddle 252, as shown. Further, wire bond 268a electrically connects the second power contact 234 to a lead 258g and wire bond 268b electrically connects the second ground contact 238 to a lead 258a.

Device 200 further includes a package body 260 that can be the same as or similar to package body 60 of FIG. 1 and thus, can include a first side 260a, a second side 260b orthogonal to the first side 260a, a third side 260c parallel to the first side 260a, and a fourth side 260d orthogonal to the first side 260a, as shown.

Each of the first plurality of leads 256 extends from the second side 260b of the package body 260 and each of the second plurality of leads 258 extends from the fourth side 260d of the package body.

The tie bar 254a is exposed at the first side 260a of the package body 260.

According to an aspect of the disclosure, a corner lead, such as corner lead 258a of the second plurality of leads 258, is further exposed at the first side 260a of the package body 260 (in addition to being exposed at the fourth side 260d of the package body) in order to form a spark gap 270 between the exposed portion 258a′ of the corner lead 258a and the exposed portion 254a′ of the tie bar 254a. Spark gap 270 can be the same as or similar to spark gap 70 of FIG. 1.

During testing, tester 80 is selectively connected to device leads 256, 258 by a switchable positive connection 82 and negative or return connection 84 in order to test susceptibility of the device 200 to damage from ESD events. In an illustrated testing example, a positive supply connection 82 is made from the tester 80 to lead 256a and a return connection is made to corner lead 258a. Under test, a high voltage is applied between connections 82, 84 causing a current path 290 (shown by a dotted line) to be formed. Current path 290 permits current to flow into lead 256a, to the power contact 224, through the ESD clamp 226, out of the first ground connection 228 to the die attach paddle 252 (here through wire bond 266b). From the die attach paddle 252, current flows to the tie bar 254a, through the spark gap 270 (i.e., out of the exposed portion 254a′ of tie bar 254a, through air external to the package body 260 and back into the package at adjacent exposed portion 258a′ of corner lead 258a), through pin 258a, and back to the tester 80.

With this arrangement, a current path external to the integrated circuit device 200 is provided by the spark gap 270 through which current can flow under certain ESD types of conditions.

Distance “d” between the exposed portion 258a′ of the corner lead 258a and the exposed portion 254a′ of the tie bar 254a along the first side 260a of the package body 260 is designed based on predetermined voltage isolation requirements.

Additional corner leads of device 200 can include a corner lead 256a that has an exposed portion 256a′ from the first side 260a of the package body 260, a corner lead 256g that has an exposed portion 256g′ from the third side 260c of the package body 260, and a corner lead 258g that has an exposed portion 258g′ from the third side 260c of the package body, as shown.

Lead frame 250 can include a second tie bar 254b exposed at the first side 260a of the package body, a third tie bar 254c exposed at the third side 260c of the package body, and a fourth tie bar 254d exposed at the third side 260c of the package body, as shown.

Four tie bars 254a, 254b, 254c, 254d can be used in the example device 200 for ease of manufacturability and balance. Providing tie bars 254a, 254b, 254c, 254d adjacent to respective exposed portions 256a′, 256g′, 258a′, 258g′ of respective corner leads 256a, 256g, 258a, 258g provides flexibility in the device design to provide additional or alternative spark gaps to spark gap 270 (not labeled).

Also shown in FIG. 2 is a side view 200′ of the device 200 from which the exposed portion 256g′, 258g′ of respective corner leads 256g, 258g and the exposed portion 254c′, 254d′ of respective tie bars 254c, 254d can be seen.

Like device 10 of FIG. 1, device 200 can contain various electronic components and circuitry to implement various functionality, such as sensor functionality using one or more sensing elements, in combination with other circuits. Die 220, 230 can be redundant to achieve safety requirements.

Like device 10 of FIG. 1, device 200 can be provided in a “stacked” configuration in which the die vertically overlap one another, as shown.

Referring to FIG. 3, as another alternative to device 10 of FIG. 1, in some embodiments, the ground contact of the top die (rather than the ground contact of the bottom die) is connected to the die attach paddle. To this end, a multi-die integrated circuit device 300 includes a first die 320 having a first power contact 324 and a first ground contact 328, a second die 330 having a second power contact 334 and a second ground contact 338, and a lead frame 350 including a die attach paddle 352 having a tie bars 354a, 354b, 354c, 354d and leads or pins 356, 358. The second ground contact 338 is electrically coupled to the die attach paddle 352 and the first ground contact 328 is galvanically isolated from the die attach paddle 352.

In other respects, device 300 can be the same as or similar to device 10 of FIG. 1. Thus, first die 320 can include an ESD clamp 326 between its power and ground contacts 324, 328 and similarly, second die 330 can include an ESD clamp 336, between its power and ground contacts 334, 338, as shown, which ESD clamps 326, 336 can be the same as or similar to ESD clamps 26, 36 of FIG. 1.

Device 300 includes wire bonds 366a, 366b with which electrical connection is made to the first die 320 and wire bonds 368a, 368b, 368c with which electrical connection is made to the second die 330. For example, wire bond 366a electrically connects the first power contact 324 to a lead 356a and wire bond 366b electrically connects first ground contact 328 to a lead 356g, as shown. Further, wire bond 368a electrically connects the second power contact 334 to a lead 358g, wire bond 368b electrically connects the second ground contact 338 to a lead 358a, and wire bond 368c electrically connects the second ground contact 338 to the die attach paddle 352.

Device 300 further includes a package body 360 that can be the same as or similar to package body 60 of FIG. 1 and thus, can include a first side 360a, a second side 360b orthogonal to the first side 360a, a third side 360c parallel to the first side 360a, and a fourth side 360d orthogonal to the first side 360a, as shown.

Each of the first plurality of leads 356 extends from the second side 360b of the package body 360 and each of the second plurality of leads 358 extends from the fourth side 360d of the package body. Further, corner leads of device 300 are additionally exposed from the first side 360a and the third side 360c of the package body 360. Corner lead 356a has an exposed portion 356a′ from the first side 360a of the package body 360, corner lead 358a has an exposed portion 358a′ from the first side 360a of the package body 360, corner lead 356g that has an exposed portion 356g′ from the third side 360c of the package body 360, and corner lead 358g that has an exposed portion 358g′ from the third side 360c of the package body 360, as shown.

According to an aspect of the disclosure, a spark gap 370 is provided between the exposed portion 356g′ of the corner lead 356g and the exposed portion 354c′ of the tie bar 354c. Spark gap 370 can be the same as or similar to spark gap 70 of FIG. 1.

During testing, tester 80 is selectively connected to device leads 356, 358 by a switchable positive connection 82 and negative or return connection 84 in order to test susceptibility of the device 300 to damage from ESD events. In an illustrated testing example, a positive supply connection 82 is made from the tester 80 to lead 356a and a return connection is made to corner lead 358a. Under test, a high voltage is applied between connections 82, 84 causing a current path 390 (shown by a dotted line) to be formed. Current path 390 permits current to flow into lead 356a, to the power contact 324, through the ESD clamp 326, out of the first ground connection 328 to corner lead 356g (here through wire bond 366b), through spark gap 370 (i.e., out of the exposed portion 356g′ of corner lead 356g, through air external to the package body 360 and back into the package at adjacent exposed portion 354c′ of tie bar 354c), through die attach paddle 352, ground contact 338, to corner pin 358a, and back to the tester 80.

With this arrangement, a current path external to the integrated circuit device 300 is provided by the spark gap 370 through which current can flow under certain ESD types of conditions.

Also shown in FIG. 3 is a side view 300′ of the device 300 from which the exposed portion 356g′, 358g′ of respective corner leads 356g, 358g and the exposed portion 354c′, 354d′ of respective tie bars 354c, 354d can be seen.

Like device 10 of FIG. 1, device 300 can contain various electronic components and circuitry to implement various functionality, such as sensor functionality using one or more sensing elements, in combination with other circuits. Die 320, 330 can be redundant to achieve safety requirements.

Like device 10 of FIG. 1, device 300 can be provided in a “stacked” configuration in which the die vertically overlap one another, as shown.

Referring also to FIG. 4, according to a further aspect of the disclosure, an alternative or additional spark gap can be formed between adjacent leads of an integrated circuit device 400. According to some HBM testing requirements, device packages with less than six pins or leads require that pins configured as “no connect” pins (i.e., pins that are not electrically connected to device components) are included in the pin groups stressed during ESD testing. Stressing “no connect” pins can cause random arcing that could potentially damage device 400 and or the HBM tester 80. To address this issue, one or more spark gaps between adjacent leads can be provided.

Multi-die integrated circuit device 400 includes a first die 420 having a first power contact 424 and a first ground contact 428, a second die 430 having a second power contact 434 and a second ground contact 438, and a lead frame 450 including a die attach paddle 452 having tie bars 454a, 454b, 454c, 454d and leads or pins 456, 458. The first ground contact 428 is electrically coupled to the die attach paddle 452 and the second ground contact 438 is galvanically isolated from the die attach paddle 452.

First die 420 can include an ESD clamp 426 between its power and ground contacts 424, 428 and similarly, second die 430 can include an ESD clamp 436, between its power and ground contacts 434, 438, which ESD clamps 426, 436 can be the same as or similar to ESD clamps 26, 36 of FIG. 1.

Device 400 includes wire bonds 466a, 466b, 466c with which electrical connection is made to the first die 420 and wire bonds 468a, 468b with which electrical connection is made to the second die 430. For example, wire bond 466a electrically connects the first power contact 424 to a lead 456a, wire bond 466b electrically connects first ground contact 428 to a lead 456g, and wire bond 466c electrically connects the first ground contact 428 to the die attach paddle 452, as shown. Further, wire bond 468a electrically connects the second power contact 434 to a lead 458g and wire bond 468b electrically connects the second ground contact 438 to a lead 458a.

Device 400 further includes a package body 460 that can be the same as or similar to package body 60 of FIG. 1 and thus, can include a first side 460a, a second side 460b orthogonal to the first side 460a, a third side 460c parallel to the first side 460a, and a fourth side 460d orthogonal to the first side 460a, as shown.

Each of the first plurality of leads 456 extends from the second side 460b of the package body 460 and each of the second plurality of leads 458 extends from the fourth side 460d of the package body.

Tie bars 454a, 454b, 454c, 454d are exposed from sides of the package body 460 at respective exposed portions 454a′, 454b′, 454c′, 454d′ so as to permit spark gaps to adjacent exposed portions 458a′, 456a′, 456g′, 458g′ of respective corner leads 458a, 456a, 456g, 458g, as shown. For example, corner lead 458a in conjunction with tie bar 454a form a spark gap 470 between the exposed portion 458a′ of the corner lead 458a and the exposed portion 454a′ of the tie bar 454a.

Additionally, one or more “no connect” leads, for example “no connect” lead 456b and its adjacent leads 456a, 456c have exposed portions 456a″, 456b′, 456c′ along a side 460b of the package body 460 designed to form a spark gap 472. A distance “d” between the exposed portion 456b′ of “no connect” lead 456b and the exposed portions 456a″, 456c′ of its respective adjacent leads 456a, 456c is based on predetermined voltage isolation requirements. In the example embodiment, a width “w1” of the exposed portion 456b′ of “no connect” lead 456b is larger than a width “w2” or the portion of the lead that extends beyond the side 460b of the package, as shown.

During testing, tester 80 is selectively connected to device leads 456, 458 by a switchable positive connection 82 and negative or return connection 84 in order to test susceptibility of the device 400 to damage from ESD events. In an illustrated testing example of “no connect” pin testing, a positive supply connection 82 is made from the tester 80 to lead 456b and a return connection is made to corner lead 458a. Under test, a high voltage is applied between connections 82, 84 causing a current path 490 (shown by a dotted line) to be formed. Current path 490 permits current to flow into “no connect” lead 456b and out of the lead 456b to adjacent lead 456a through a spark gap 472. From lead 456a, current flows to the power contact 424, through the ESD clamp 426, out of the first ground connection 428 to the die attach paddle 452 (here through wire bond 466c). From the die attach paddle 452, current flows to the tie bar 454a, through the spark gap 470, through pin 458a, and back to the tester 80.

With this arrangement, a current path external to the integrated circuit device 400 from a “no connect” lead to an adjacent lead is provided by the spark gap 472 through which current can flow under certain ESD types of conditions. Also the current path from tie bar