, and 10p6. The conductive vias 10v1 may be arranged along three sides of each of the patterns 10p1, 10p2, 10p3, 10p4, 10p5, and 10p6. However, in some arrangements, the conductive vias 10v1 may be arranged along one side, two sides, or four sides of each of the patterns 10p1, 10p2, 10p3, 10p4, 10p5, and 10p6.

The conductive via 10v2 may be disposed near to a side or an end of the feeding element 10f1. For example, the conductive via 10v2 may be in proximity to one of a side and an end of the feed element 10f1. In some arrangements, the conductive via 10v2 may be disposed at the center of the feeding element 10f1. The conductive via 10v3 may be disposed near to a side or an end of the feeding element 10f2. For example, the conductive via 10v3 may be in proximity to one of a side and an end of the feed element 10f2. In some arrangements, the conductive via 10v3 may be disposed at the center of the feeding element 10f2. For example, the feed element 10f1 may have a portion extending exceed a lateral side of the pattern 10p1, and the conductive via 10v2 may be connected with the portion. For example, the feed element 10f1 may have a portion extending exceed a lateral side of the pattern 10p4, and the conductive via 10v2 may be connected with the portion.

FIG. 1C is a cross-section of the electronic device 1a, in accordance with an arrangement of the present disclosure. In some arrangements, FIG. 1C may be a cross-section through line AA′ of FIG. 1B. FIG. 1C′ is a cross-section of the electronic device 1a, in accordance with an arrangement of the present disclosure. In some arrangements, FIG. 1C′ may be a cross-section through line AA′ of FIG. 1B.

The electronic device 1a may also include a radiating structure 10, a circuit structure 11, an electronic component 12, and an encapsulant 13.

The radiating structure 10 may be capable of operating at multiple frequencies (frequency bands and/or bandwidths). For example, the radiating structure 10 may be configured to operate at a relatively higher frequency (a relatively higher frequency band and/or bandwidth) and a relatively lower frequency (a relatively lower frequency band and/or bandwidth). For example, the radiating structure 10 may be configured to radiate and/or receive an EM wave having a relatively higher frequency and an EM wave having a relatively lower frequency. In some arrangements, the radiating structure 10 may be capable of radiating and/or receiving an EM wave having a relatively higher frequency and an EM wave having a relatively lower frequency in parallel.

The radiating structure 10 may include a surface 101, a surface 102 opposite to the surface 101, and lateral surfaces (or sidewalls) 103, 104 extending between the surfaces 101 and 102. The surface 101 and/or the surface 102 of the radiating structure 10 may be parallel to the xy-plane. The radiating structure 10 may include an antenna layer (where the patterns 10p1, 10p2, 10p3, 10p4, 10p5, and 10p6, and the feeding elements 10f1 and 10f2 in FIGS. 1A and 1B are located), the grounding plane 10g, dielectric layers 10d1, 10d2, and conductive vias 10v1, 10v2, and 10v3. In some arrangements, as shown in FIG. 1C′, the dielectric layers 10d2 may include a multi-layer structure, which has several layers 10d21, 10d22, and 10d23.

The antenna layer may be adjacent to the surface 102 of the radiating structure 10. Although there is one antenna layer in FIG. 1C, the number of antenna layers is not limited thereto. In some arrangements, there may be any number of antenna layers depending on design requirements.

The antenna layer may be partially or fully within (or covered by) the dielectric layers 10d1. In some arrangements, an upper surface (not annotated in the figures) of the patterns 10p1, 10p2, 10p3 may be exposed by the dielectric layers 10d1 and exposed on the surface 102 of the radiating structure 10.

The grounding plane 10g may be adjacent to the surface 101 of the radiating structure 10. The grounding plane 10g may be disposed under the antenna layer (where the patterns 10p1, 10p2, 10p3, 10p4, 10p5, and 10p6, and the feeding elements 10f1 and 10f2 in FIGS. 1A and 1B are located). Although there is one grounding plane in FIG. 1C, the number of grounding planes is not limited thereto. In some arrangements, there may be any number of grounding planes depending on design requirements. The grounding plane 10g may be partially or fully within (or covered by) the dielectric layers 10d2.

Grounding plane 10g and the antenna layer may at least partially overlap to each other in a direction substantially perpendicular to the surface 101 and/or the surface 102 of the radiating structure 10. For example, a vertical projection of pattern 10p1 may be within the boundary of the grounding plane 10g. For example, a vertical projection of pattern 10p2 may be within the boundary of the grounding plane 10g. For example, a vertical projection of pattern 10p3 may be within the boundary of the grounding plane 10g.

The conductive vias 10v1, 10v2, and 10v3 may be electrically coupled between the antenna layer and the grounding plane 10g. Although three conductive vias are stacked above the grounding plane 10g in FIG. 1C, the number of stacked conductive vias is not limited thereto. In some arrangements, there may be any number of stacked conductive vias depending on design requirements.

The feeding elements 10f1 and 10f2 may be located at the same horizontal level as the patterns 10p1, 10p2, and 10p3. For example, the feeding elements 10f1 and 10f2 may be located at the same elevation as the patterns 10p1, 10p2, and 10p3 with respect to the surface 111 of the circuit structure 11. For example, the feeding elements 10f1 and 10f2 may be located at the same elevation as the patterns 10p1, 10p2, and 10p3 with respect to the grounding plane 10g. The feeding element 10f1 may not be vertically overlapped with the patterns 10p1 and 10p2. The feeding element 10f1 may not be overlapped with the patterns 10p1 and 10p2 in a direction substantially perpendicular to the surface 111 of the circuit structure 11. The feeding element 10f2 may not be vertically overlapped with the patterns 10p2 and 10p3. The feeding element 10f2 may not be overlapped with the patterns 10p2 and 10p3 in a direction substantially perpendicular to the surface 111 of the circuit structure 11.

The conductive vias 10v1, 10v2, and 10v3 may be covered, encapsulated, or surrounded by the dielectric layers 10d2. In some arrangements, the dielectric layers 10d1 and 10d2 may include pre-impregnated composite fibers (e.g., pre-preg), ceramic-filled polytetrafluoroethylene (PTFE) composites, Borophosphosilicate Glass (BPSG), silicon oxide, silicon nitride, silicon oxynitride, Undoped Silicate Glass (USG), any combination thereof, or the like. Examples of a pre-preg may include, but are not limited to, a multilayer structure formed by stacking or laminating a number of pre-impregnated materials/sheets. In some arrangements, the dielectric layers 10d1 and 10d2 may include the same materials as the encapsulant 13.

The circuit structure 11 may be disposed adjacent to the surface 101 of the radiating structure 10. The circuit structure 11 may be disposed over or on the surface 101 of the radiating structure 10. The circuit structure 11 may be disposed under the radiating structure 10. The circuit structure 11 may contact (such as directly contact) the grounding plane 10g of the radiating structure 10. The grounding plane 10g may be disposed between the circuit structure 11 and antenna layer (where the patterns 10p1, 10p2, 10p3, 10p4, 10p5, and 10p6, and the feeding elements 10f1 and 10f2 are located). The grounding plane 10g may be configured to alleviate electromagnetic interference (EMI) on the circuit structure 11.

In some arrangements, the circuit structure 11 may be or include, for example, a substrate. In some arrangements, the circuit structure 11 may include, for example, a printed circuit board (PCB), such as a paper-based copper foil laminate, a composite copper foil laminate, or a polymer-impregnated glass-fiber-based copper foil laminate. In some arrangements, the circuit structure 11 may include a dielectric layer 11d, which may include a dielectric material stated above with respect to the dielectric layers 10d1 and 10d2. In some arrangements, as shown in FIG. 1C′, the dielectric layer 11d may include a multi-layer structure, which has several layers 11d1, 11d2, and 11d3.

In some arrangements, the circuit structure 11 may include conductive pads, traces, vias, layers, other conductive elements, or other interconnections. For example, the circuit structure 11 may include one or more transmission lines or communications cables. For example, the circuit structure 11 may include one or more conductive pads 11p in proximity to, adjacent to, or embedded in and exposed by a surface 111 of the circuit structure 11.

For example, the circuit structure 11 may include one or more conductive vias 11v. In some arrangements, the conductive vias 11v may be disposed over or on the surface 111 and electrically couple the conductive pads 11p on the surface 111. The conductive vias 11v may be covered by the dielectric material of the circuit structure 11. Some of the conductive vias 11v may be electrically coupled to the feeding elements 10f1 and 10f2. Some of the conductive vias 11v may be electrically coupled to the grounding plane 10g. In some arrangements, the conductive vias 11v may provide a feed signal to the ME dipole antennas (such as the antennas 14 and 15 in FIG. 1A) of the radiating structure 10 through the feeding elements 10f1 and 10f2.

The electronic component 12 may be disposed over or on the surface 111 of the circuit structure 11. The electronic component 12 may be electrically connected to one or more other electrical components (if any) and to the circuit structure 11 (e.g., to the interconnections), and the electrical connection may be attained by way of flip-chip, wire-bond techniques, metal to metal bonding (such as Cu to Cu bonding), or hybrid bonding. In some arrangements, the electronic component 12 may be electrically connected to the circuit structure 11 through one or more conductive elements (or electrical contacts) 12e. In some arrangements, the conductive elements 12e may include a controlled collapse chip connection (C4) bump, a ball grid array (BGA) or a land grid array (LGA).

The electronic component 12 may be a chip or a die including a semiconductor substrate, one or more integrated circuit (IC) devices, and one or more overlying interconnection structures therein. The IC devices may include active devices such as transistors and/or passive devices such as resistors, capacitors, inductors, or a combination thereof. For example, the electronic component 12 may include a system on chip (SoC). For example, the electronic component 12 may include a radio frequency integrated circuit (RFIC), an application-specific IC (ASIC), a central processing unit (CPU), a microprocessor unit (MPU), a graphics processing unit (GPU), a microcontroller unit (MCU), a field-programmable gate array (FPGA), or another type of IC.

In some arrangements, the electronic component 12 may be an RF signal generator or transmitter. In some arrangements, the electronic component 12 may be configured to generate EM waves that are fed into the ME dipole antenna in the radiating structure 10, which in turn radiates the signal into the surrounding space. The electronic component 12 may be configured to adjust the frequency, amplitude, and other parameters of the feeding signal to optimize the performance of the ME dipole antenna. Although there is one electronic component in FIG. 1C, the number of electronic components is not limited thereto. In some arrangements, there may be any number of electronic components depending on design requirements.

The encapsulant 13 may be disposed over or on the surface 111 of the circuit structure 11 to cover the electronic component 12. The encapsulant 13 may include insulation or dielectric material. In some arrangements, the encapsulant 13 may include an epoxy resin having fillers, a molding compound (e.g., an epoxy molding compound or other molding compound), a polyimide, a phenolic compound or material, a material with a silicone dispersed therein, or a combination thereof. In some arrangements, the dielectric layers 10d2 may include an epoxy resin having fillers, a molding compound (e.g., an epoxy molding compound or other molding compound), a polyimide, a phenolic compound or material, a material with a silicone dispersed therein, or a combination thereof. In some arrangements, the dielectric constant (Dk value) of the dielectric layers 10d2 may be different from the Dk value of the encapsulant 13. For example, the Dk value of the dielectric layers 10d2 may be greater than the Dk value of the encapsulant 13. For example, the Dk value of the dielectric layers 10d2 may be less than the Dk value of the encapsulant 13.

FIG. 1D is a cross-section of an electronic device 1d, in accordance with an arrangement of the present disclosure. FIG. 1D′ is a cross-section of an electronic device 1d, in accordance with an arrangement of the present disclosure. The electronic device 1d is similar to the electronic device 1a in FIG. 1C, with differences therebetween as follows.

The feeding elements 10f1 and 10f2 may be located at a different horizontal levels with respect to the patterns 10p1, 10p2, and 10p3. For example, the feeding elements 10f1 and 10f2 may be located at a lower elevation than the patterns 10p1, 10p2, and 10p3 with respect to the surface 111 of the circuit structure 11. For example, the feeding elements 10f1 and 10f2 may be located at a lower elevation than the patterns 10p1, 10p2, and 10p3 with respect to the grounding plane 10g. For example, the feeding elements 10f1 and 10f2 may be separated from the patterns 10p1, 10p2, and 10p3 vertically.

By separating the feeding elements 10f1 and 10f2 from the patterns 10p1, 10p2, and 10p3 vertically, a more compact design is provided which can help reduce the overall size of the electronic device 1d. Additionally, separating the feeding elements 10f1 and 10f2 from the patterns 10p1, 10p2, and 10p3 vertically can also help to reduce mutual coupling and improve isolation between the elements, which can lead to better overall antenna performance. In some arrangements, the feeding elements 10f1 and 10f2 may be disposed at different elevations with respect to the surface 111 of the circuit structure 11 (or the grounding plane 10g). For example, the feeding element 10f1 may be located at a lower elevation than the feeding element 10f2 with respect to the surface 111 of the circuit structure 11 (or the grounding plane 10g).

FIG. 1E is a cross-section of an electronic device 1e, in accordance with an arrangement of the present disclosure. The electronic device 1e is similar to the electronic device 1a in FIG. 1C, with differences therebetween as follows.

The conductive vias 10v1, 10v2, and 10v3 may be replaced with conductive wires 10w1, 10w2, and 10w3. In some arrangements, the conductive vias 10v1, 10v2, and 10v3 may be replaced with other conductive elements. The conductive elements may include, for example, a conductive pillar, conductive paste, conductive filler, solder material, or other suitable elements. The conductive elements may be chosen based on factors of the EM waves, which may including resonant frequency, impedance, admittance (the reciprocal of impedance), phase, wavelength, etc. The conductive wires 10w1, 10w2, and 10w3 may include vertical bonding wires or vertical conductive wires. In some arrangements, the dielectric layers 10d2 may include an epoxy resin having fillers, a molding compound (e.g., an epoxy molding compound or other molding compound), a polyimide, a phenolic compound or material, a material with a silicone dispersed therein, or a combination thereof.

FIG. 1F shows current distribution of the electronic device 1a, in accordance with an arrangement of the present disclosure.

The all-black vector t1 represents a magnetic field between 240 and 300 A/m (ampere per meter), the striped vector t2 represents a magnetic field between 120 and 210 A/m, and the all-white vector t3 represents a magnetic field between 0 and 90 A/m. To reduce interference between the feeding elements 10f1 and 10f2, the patterns 10p1, 10p2, 10p3, 10p4, 10p5, and 10p6 are electrically coupled to the grounding plane 10g. It is shown that currents on the feeding elements 10f1 and 10f2 flow substantially up and down, such that current intensity is greater in upward and downward and lateral interference (left and right directions, i.e., between the feeding elements 10f1 and 10f2) is reduced. In some arrangements, the interference between the patterns 10p1 and 10p3 may be reduced. In some arrangements, the interference between the patterns 10p4 and 10p6 may be reduced. In some arrangements, the interference between the antennas 14 and 15 may be reduced. This results in a more efficient and effective radiation pattern for the antenna (e.g., the ME dipole antenna) of the electronic device 1a, as the electric and magnetic fields work together to propagate the electromagnetic waves.

According to some arrangements of the present disclosure, the utilization of a common antenna plate design allows an increase in antenna gain while maintaining a smaller antenna array size compared to the traditional ME dipole antenna array. This satisfies demands for miniaturization. Simulation data in FIG. 4B demonstrates that the common antenna plate design (in 1×4 array, as shown in FIG. 2A) achieves a gain increase of 3.8 dB compared to a single ME dipole. In addition, from the simulated antenna gain pattern in FIG. 4A, it can be seen that the common antenna plate design (in 1×4 array, as shown in FIG. 2A) helps to increase directionality and coverage area of the antenna.

Furthermore, connecting the common antenna plate to a grounding plane reduces interference between feeding lines. This leads to improved signal quality and reliability without the need for increased package size.

Additionally, the common plate design offers the flexibility to adjust impedance according to different frequency and bandwidth requirements. This enhances design flexibility without increasing the overall area.

FIGS. 1G, 1H, and 1I illustrate other exemplary arrangements of the conductive vias 10v1 from top views, in accordance with an arrangement of the present disclosure. In FIG. 1G, the conductive vias 10v1 of the patterns 10p1, 10p3, 10p4, and 10p6 are located along sides of a corner of the patterns 10p1, 10p3, 10p4, and 10p6.

In FIG. 1H, the conductive vias 10v1 of the patterns 10p1, 10p3, 10p4, and 10p6 are positioned in a T shape, with one vertical line intersecting one horizontal line. In FIG. 1H, the conductive vias 10v1 of the patterns 10p2 and 10p5 are positioned in an H configuration, with two vertical lines intersecting one horizontal line. In some arrangements, the H configuration may reduce the interference between the patterns 10p1 and 10p3.

In FIG. 1I, the conductive vias 10v1 of the patterns 10p1, 10p2, 10p3, 10p4, 10p5, and 10p6 are positioned in an H configuration, with two vertical lines intersecting one horizontal line.

FIG. 2A is a top view of an electronic device 2a, in accordance with an arrangement of the present disclosure. The electronic device 2a is similar to the electronic device 1a in FIG. 1B, with differences therebetween as follows.

The electronic device 2a further includes patterns 10p7, 10p8, 10p9, 10p10, and feeding elements 10f3, 10f4.

The patterns 10p3, 10p7, 10p6, and 10p9 and the feeding element 10f3 may be a part of an antenna 16. The patterns 10p3, 10p7, 10p6, and 10p9 and the feeding element 10f3 may be collectively configured to form the antenna 16. The antenna 16 may include an ME dipole antenna.

The patterns 10p7, 10p8, 10p9, and 10p10 and the feeding element 10f4 may be a part of an antenna 17. The patterns 10p7, 10p8, 10p9, and 10p10 and the feeding element 10f4 may be collectively configured to form the antenna 17. The antenna 17 may include an ME dipole antenna. In some arrangements, the antennas 14, 15, 16, and 17 may form a beamforming antenna structure.

The antenna 14, antenna 15, the antenna 16, and the antenna 17 may be arranged along an x axis. The feeding elements 10f1, 10f2, 10f3, and 10f4 may be arranged along a y axis, which may be substantially perpendicular to the x axis. For example, the feeding elements 10f1, 10f2, 10f3, and 10f4 may each have a longer side and a shorter side, with the longer side arranged along the y axis. For example, the feeding elements 10f1, 10f2, 10f3, and 10f4 may each have a longer side and a shorter side, with the shorter side arranged along the x axis. The patterns 10p1, 10p2, 10p3, 10p7, and 10p8 are arranged along the x axis. The patterns 10p4, 10p5, 10p6, 10p9, and 10p10 are arranged along the x axis. The feeding elements 10f1, 10f2, 10f3, and 10f4 may each be overlapped with the patterns 10p1 through 10p10 along the x axis.

The antenna 15 and the antenna 16 may include common patterns. The antenna 15 and the antenna 16 may share common patterns. For example, pattern 10p3 and pattern 10p6 may be common patterns of the antenna 15 and the antenna 16. For example, pattern 10p3 and pattern 10p6 may be shared by the antenna 15 and the antenna 16. For example, pattern 10p3 and pattern 10p6 may both be a part of the antenna 15 and a part of the antenna 16. For example, pattern 10p3 and pattern 10p6 may both be capable of being excited by the feeding element 10f2. For example, pattern 10p3 and pattern 10p6 may both be capable of being excited by the feeding element 10f3.

The antenna 16 and the antenna 17 may include common patterns. The antenna 16 and the antenna 17 may share common patterns. For example, pattern 10p7 and pattern 10p9 may be common patterns of the antenna 16 and the antenna 17. For example, pattern 10p7 and pattern 10p9 may be shared by the antenna 16 and the antenna 17. For example, pattern 10p7 and pattern 10p9 may both be a part of the antenna 16 and a part of the antenna 17. For example, pattern 10p7 and pattern 10p9 may both be capable of being excited by the feeding element 10f3. For example, pattern 10p7 and pattern 10p9 may both be capable of being excited by the feeding element 10f