205, and the source line may be electrically connected to the second chip-on film 206. In some embodiments, the first chip-on film 205 may provide a signal of a gate driving chip (Gate IC) to the gate line, and the second chip-on film 206 may provide a signal of the source line to a reading chip 207 (ROIC).

Optionally, in the above peeling system provided by the embodiment of the present disclosure, as shown in FIG. 3, FIG. 4, and FIG. 6, the clamp 302 may include a first clamping plate 3021 and a second clamping plate 3022, and the control mechanism 303 may include a first manipulator 3031a, a second manipulator 3031b, a first rotating shaft 3032a and a second rotating shaft 3032b, wherein the first clamping plate 3021 is connected with the first manipulator 3031a through the first rotating shaft 3032a, and the second clamping plate 3022 is connected with the second manipulator 3031b through the second rotating shaft 3032b.

During specific implementation, as shown in FIG. 4, after the first clamping plate 3021 and the second clamping plate 3022 clamp the extension portion A, the first manipulator 3031a drives the first clamping plate 3021 to rotate counterclockwise through the first rotating shaft 3032a, while the second manipulator 3031b drives the second clamping plate 3022 to rotate counterclockwise through the second rotating shaft 3032b, thereby generating the pulling force. A direction of the pulling force is a direction of the peeling angle. Afterwards, the first manipulator 3031a and the second manipulator 3031b maintain the peeling angle according to a set action trajectory, and continue to control the first clamping plate 3021 and the second clamping plate 3022 to lift the extension portion A at the peeling angle in a pulling force mode until the complete peeling for the flexible fingerprint component is completed in a peeling direction Y.

It should be noted that the first manipulator 3031a and the second manipulator 3031b may be externally connected to an automatic control system, and motion trajectories of the first manipulator 3031a and the second manipulator 3031b are controlled through the automatic system, so as to freely adjust spatial positions of the first clamping plate 3021 and the second clamping plate 3022, and change the peeling angle through the first rotating shaft 3032a and the second rotating shaft 3032b.

Furthermore, it should be understood that an adhesion force between the infrared cutoff film 203 and the photosensitive device layer 202 must be greater than an adhesion force between the flexible substrate 201 and the rigid substrate 100. Otherwise, the infrared cutoff film 203 will be directly peeled from a surface of the photosensitive device layer 202 and cannot carry the flexible substrate 201.

Optionally, in the above peeling system provided by the embodiment of the present disclosure, in order to improve the firmness of clamping, sizes of the first clamping plate 3021 and the second clamping plate 3022 may be set to be both substantially the same as a size of the extension portion A. Specifically, as shown in FIG. 1 and FIG. 6, lengths L1 of the first clamping plate 3021 and the second clamping plate 3022 are substantially the same as a transverse length a of the extension portion A, and widths W of the first clamping plate 3021 and the second clamping plate 3022 are substantially the same as an extension length d of the extension portion A.

It should be noted that in the embodiments provided by the present disclosure, due to influences of limitation in a process condition or other factors such as measurement, the above “substantially” may be completely equivalent or there may be some deviations. Therefore, as long as a “substantially” relationship between the above features meets an allowable error (such as a 10% fluctuation), it belongs to a protection scope of the present disclosure.

Optionally, the above peeling method provided by the embodiment of the present disclosure, as shown in FIG. 4 and FIG. 7, may further include: an auxiliary peeling mechanism 304, configured to perform auxiliary peeling on the first chip-on film 305 in the peeling direction Y at the peeling speed when peeling the flexible fingerprint component to a bonding zone of the first chip-on film 305.

Due to bonding of a first chip-on film 205 extending in the peeling direction Y and a second chip-on film 206 extending in a direction perpendicular to the peeling direction Y at an edge of the flexible substrate 201, curing of anisotropic conductive adhesive (ACF adhesive) used in a bonding process will cause the flexible substrate 201 in the bonding zone to be harder, stiffer, and less prone to bending. Moreover, due to a larger length of the bonding zone B 1 (as shown in FIG. 1) of the first chip-on film 205 in the peeling direction Y, it is more prone to bending in the peeling process. Therefore, when peeling to the bonding zone B 1 of the first chip-on film 205, the auxiliary peeling mechanism 304 needs to be added for auxiliary peeling to ensure that there is no deformation at a junction of a softer non-bonding zone and the harder bonding zone, and to avoid technical problems such as film layer fracture and device failure.

It should be noted that due to a smaller length of the bonding zone B₂of the second chip-on film 206 in the peeling direction Y and the attention paid to preventing adhesive overflow in the bonding process, the hardness of the flexible substrate 201 in the bonding zone B₂of the first chip-on film 205 is almost not affected. Therefore, the peeling process of the flexible substrate 201 in the bonding zone B₂of the first chip-on film 205 does not require auxiliary peeling.

Optionally, in the above peeling system provided by the embodiment of the present disclosure, as shown in FIG. 6, the auxiliary peeling mechanism 304 may include: a rigid cushion block 3041 and a driver 3042 connected with the rigid cushion block 3041. The driver 3042 may provide power for the rigid cushion block 3041, to enable the rigid cushion block 3041 to move in the peeling direction Y at a moving speed consistent with the peeling speed. After peeling is completed, the auxiliary peeling mechanism 304 will automatically return to a starting position. In some embodiments, the auxiliary peeling mechanism 304 may be externally connected to the automatic control system, and through the automatic control system, the auxiliary peeling mechanism 304 is controlled to advance in the peeling direction Y to execute the auxiliary peeling motion, or to retreat to the starting position.

Optionally, in the above peeling system provided by the embodiment of the present disclosure, as shown in