The ring-shaped body has an asymmetric bending stiffness allowing the ring-shaped body to be bent such that the mounting surface of the ring-shaped body changes from having a first shape to a second more concave shape and preventing or limiting the ring-shaped body to be bent such that the shape of the mounting surface becomes more convex than the first shape. Due to asymmetric bending stiffness, the ring-shaped body can be gripped at opposite sides for moving the ring-shaped body without losing rigidity. This enables automatic transfer of the film frame carrier onto the curved shell and/or it has enabled the wafer to be diced while being mounted on the flexible carrier film that in turn was coupled to the ring-shaped body. The first shape may correspond to the most convex shape the mounting surface can attain.

The asymmetric bending stiffness can be configured to allow the ring-shaped body to be bent such that the mounting surface of the ring-shaped body reversibly changes from having the first shape to the second more concave shape. Alternatively, the bending may result in plastic deformation of the ring-shaped body.

The first shape may correspond to an essentially flat shape. Additionally, or alternatively, the curvature of the mounting surface when having the first shape can be less than 0.2 m⁻¹, and wherein the curvature of the mounting surface when having the second shape can be more than 3.3 m⁻¹.

The ring-shaped body may comprise and/or can be at least partially formed by a leaf spring. Moreover, a surface of the leaf spring may form or be part of the mounting surface. The ring-shaped body may further comprise limiting means connected to the leaf spring for preventing or limiting the ring-shaped body to be bent such that the shape of the mounting surface becomes more convex than the first shape. The limiting means can be coupled to the leaf spring on a surface directed away from said mounting surface. Additionally, or alternatively, the limiting means may comprise a plurality of segments that are connected to the leaf spring, wherein when the mounting surface is in the first shape, adjacent segments abut each other thereby preventing or limiting bending the leaf spring such that the shape of the mounting surface becomes more convex than the first shape, and wherein the segments are configured to move away from abutment upon bending the leaf spring to transform the mounting surface from the first shape to a more concave shape.

Alternatively, the ring-shaped body may comprise a plurality of segments, wherein the segments are hingedly connected to each other. For example, a respective pair of adjacently arranged segments among the plurality of segments may be configured to pivot relative to each other about a respective rotational axis. Moreover, the rotational axes describing the pivotal movements of all pairs of adjacently arranged segments among the plurality of segments can be parallel to each other.

For at least one pair of adjacently arranged segments among the plurality of segments, one segment may comprise a first coupling structure arranged on a first end of said one segment and the other segment may comprise a second coupling structure arranged on a second end of said the other segment. The first coupling structure and the second coupling structure can be hingedly connected to each other to allow said one segment and said the other segment to pivot relative to each about a rotational axis. Said one segment may comprise said second coupling structure arranged on a second side of said one segment opposite to the first side of said one segment. Said the other segment may comprise said first coupling structure arranged on a first side of said the other segment opposite to the second side of said the other segment.

The first coupling structure may comprise a first opening, and the second coupling structure may comprise a protruding element that is rotatably received in said first opening and that defines the rotational axis. This protruding element can be a pin, rod, or shaft.

Alternatively, the first coupling structure may comprise a first opening, wherein the second coupling structure comprises a second opening, and wherein the film frame carrier comprises a shaft rotatably received in at least one of the first and second opening and that defines the rotational axis.

For said respective pair of adjacently arranged segments among the plurality of segments, one segment may comprise a first abutment surface and the other segment a second abutment surface. The first abutment surface and second abutment surface can be shaped and positioned relative to the rotational axis to abut each other for the purpose of preventing the ring-shaped body to be bent such that the shape of the mounting surface becomes more convex than the first shape when the mounting surface has the first shape.

The segments can be made a material chosen out of the group consisting of steel, aluminum, titanium, polymers, or combinations thereof.

According to a further aspect of the present disclosure, an assembly is provided that comprises the film frame carrier as defined above, and a carrier film, foil, or tape having a supporting surface on which an arrangement of dies is arranged, wherein the carrier film, foil, or tape with arrangement of dies is coupled with its supporting surface to the mounting surface of the film frame carrier.

The carrier film, foil, or tape can be provided with an attaching layer by which the arrangement of semiconductor dies is attached to the supporting surface and by which the carrier film, foil, or tape is coupled to the mounting surface of the film frame carrier. The attaching layer may comprise a light-absorbing agent, such as a photo-sensitive adhesive, wherein the light-absorbing agent is configured to at least locally release its attachment with the arrangement of semiconductor dies when illuminated by light having said wavelength. The light-absorbing agent can be configured to at least locally release its attachment by means of photo-ablation and/or by the light-absorbing agent undergoing a chemical reaction as a result of absorbing the light. More in particular, the energy absorbed by the light-absorbing layer may not only be used for releasing the semiconductor die but also to provide some propelling force driving the semiconductor die towards the target.

The arrangement of semiconductor dies is comprised by a diced semiconductor wafer or by a structured semiconductor wafer.

BRIEF DESCRIPTION OF DRAWINGS

So that the manner in which the features of the present disclosure can be understood in detail, a more particular description is made with reference to embodiments, some of which are illustrated in the appended figures. It is to be noted, however, that the appended figures illustrate only typical embodiments and are therefore not to be considered limiting of its scope. The figures are for facilitating an understanding of the disclosure and thus are not necessarily drawn to scale. Advantages of the subject matter claimed will become apparent to those skilled in the art upon reading this description in conjunction with the accompanying figures, in which like reference numerals have been used to designate like elements, and in which:

FIG. 1A illustrates part of an embodiment of an apparatus for placing a semiconductor die from an arrangement of semiconductor dies onto a target in accordance with an aspect of the present disclosure, and FIG. 1B a corresponding schematic representation.

FIG. 2 illustrates a schematic cross-sectional view corresponding to the apparatus of FIG. 1A.

FIGS. 3A, 3B, 3C, 3D and 3E illustrate further embodiments and views of an apparatus for placing a semiconductor die from an arrangement of semiconductor dies onto a target in accordance with an aspect of the present disclosure.

FIG. 4 illustrates a first embodiment of a flexible film frame carrier in accordance with an aspect of the present disclosure.

FIG. 5 illustrates a ring-shaped body for a flexible film frame carrier in accordance with an aspect of the present disclosure.

Hereinafter, embodiments will be presented in which a semiconductor die from a diced semiconductor wafer is placed on a target. The present disclosure is however not limited to placing semiconductor dies from diced semiconductor wafers. In general, semiconductor dies can be placed from an arrangement of dies including but not limited to diced semiconductor wafers and structured wafers.

DETAILED DESCRIPTION

FIG. 1A illustrates part of an embodiment of an apparatus 1 for placing a semiconductor die 2A from a diced semiconductor wafer 2 onto a target 113 in accordance with an aspect of the present disclosure. Here, diced semiconductor wafer 2 is arranged on a carrier film 4 that is mounted to a flexible film frame carrier, FFFC, 3. Typically, wafers are fed to apparatus 1 from a cassette 5, tray, or the like. This can be done in an automated manner.

FFFC 3, of which cross-sections are shown in FIG. 5, comprises a ring-shaped body 30 having a mounting surface 31 that is coupled to a supporting surface 43 of carrier film 4. Here, flexible carrier film 4 comprises a backing/support layer 42, typically made of polyvinyl chloride, which is covered by an attaching layer 41. Using this latter layer, diced semiconductor wafer 2, which comprises a plurality of semiconductor dies 2A, is attached to backing layer 42.

Ring-shaped body 30 has an asymmetric bending stiffness allowing ring-shaped body 30 to be bent such that mounting surface 31 changes from having a first shape, as shown in the top figure of FIG. 5, to a second more concave shape, as shown in the center figure of FIG. 5. At the same time, the asymmetric stiffness prevents ring-shaped body 30 to be bent such that the shape of mounting surface 31 becomes more convex than the first shape.

Ring-shaped body 30 comprises a leaf spring 32, and a plurality of segments 34 that are each connected to leaf spring 32 using a respective connection 33. In the first shape, adjacent segments 34, and more in particular a surface 35A of one segment 34A and a surface 35B of an adjacent segment 34B, abut each other. Consequently, ring-shaped body 30 is not able to be bent by moving the left and right ends upwards relative to a center part of ring-shaped body 30 in FIG. 5. However, the opposite is possible in which the mounting surface 31 assumes a more concave shape. This is shown in FIG. 5, center figure. Here, segments 34A, 34B have moved out of abutment. Using a leaf spring 32 allows the shape deformation of ring-shaped body 30 to be reversible. However, embodiments are equally possible in which the bending from the first to the second shape comprises a plastic deformation. With such embodiments, the ring-shaped body 30 may be discarded after use.

Another embodiment of a ring-shaped body 30 for a FFFC having an asymmetric bending stiffness is shown in FIG. 4. In this embodiment, ring-shaped body 30 comprises a plurality of segments 34, which segments are hingedly connected. For example, FIG. 4 illustrates a segment 34A and a segment 34B. These segments comprise openings 36A, 36B, respectively, in which a shaft 37 is arranged by which segments 34A, 34B are hingedly connected to each other. This is shown in more detail in the cross-sectional views corresponding to lines L1, L2. Shaft 37 can be fixedly connected to one of segments 34A, 34B while it is allowed to rotate in opening 36A, 36B of the other. Alternatively, shaft 37 can rotate in both openings 36A, 36B.

In FIG. 4, mounting surface 31 of ring-shaped body 30 is shown in the first shape, which is an essentially flat shape. Similar to the embodiment in FIG. 5, mounting surface 31 can be coupled to a supporting surface 43 of a carrier film 4. Segments 34A, 34B comprise abutting surfaces 35A, 35B, respectively. The positioning of surfaces 35A, 35B relative to shaft 37 determines that ring-shaped body 30 cannot be bent such that mounting surface 31 becomes more convex. However, bending ring-shaped body 30 such that mounting surface 31 becomes more concave is possible. It should be noted that surfaces 35A, 35B may be positioned differently. For example, they may be substantially in line with shaft 37 albeit at a differential longitudinal position.

Now returning to FIG. 1A, FFFC 3, embodied as illustrated in FIG. 5 and having a diced semiconductor wafer 2 arranged thereon can be mounted on a rotatably mounted curved shell 122, which can rotate about a rotational axis 122A. To this end, curved shell 122 may be provided with a number of small openings through which a suction force can be exerted onto FFFC 3. Alternatively, FFFC 3 may be mounted on curved shell 122 using a mechanical mounting such as clamping.

It is noted that FIG. 1A does not display ring-shaped body 30 for semiconductor wafer 2 that is arranged on curved shell 122 for illustrative purposes. Furthermore, FIG. 1A illustrates that segments 34 are generally elongated having a longitudinal axis that is parallel to rotational axis 122A.

By rotating and translating curved shell 122, diced semiconductor wafer 2 can be positioned relative to a target 113 on which semiconductor dies 2A are to be arranged. Target 113 is arranged on a supporting surface 112A of a target chuck 112. Once properly positioned, a releasing unit (not shown in FIG. 1A) is employed for releasing a semiconductor die 2A from diced semiconductor wafer 2 allowing semiconductor die 2A to be arranged on an intended position on target 113.

FIG. 1B schematically illustrates the apparatus of FIG. 1A. As shown, apparatus 1 comprises a controller 100 that controls a target stage 110, a wafer stage 120, and a releasing unit 130, based on data it receives from inspection system 140. Controller 100 further controls a dispensing apparatus 150 that is configured for dispensing small droplets of conductive glue 151, solder or the like, on target 113.

Target stage 110 comprises one or more motors for controlling the position of target chuck 112 on which target 113 is arranged. For example, target stage 110 may comprise a motor MT0 for translating target chuck 112 along the X-direction, which is taken parallel to rotational axis 122A, a motor MT2 for translating target chuck 112 along the Z-direction, which is taken perpendicular to supporting surface 112A of target chuck 112, and a motor MT1 for translating target chuck 112 along the Y-direction, which is taken perpendicular to the X-direction and Z-direction.

Wafer stage 120 comprises one or more motors for controlling the position of curved shell 122 on which semiconductor wafer 2 is arranged. For example, wafer stage 120 may comprise a motor MW0 for translating curved shell 122 along the X-direction, a motor MW2 for translating curved shell 122 along the Z-direction, and a motor MW3 for rotating curved shell 122 about rotational axis 122A.

Releasing unit 130 may comprise a motor MRO for translating a light source 132 in the X-direction.

It should be noted that the present disclosure is not limited to the abovementioned combination of motors. Target stage 110, wafer stage 120, and releasing unit 130 may comprise more or less motors, and/or motors for translating in a different direction.

Inspection system 150 may comprise one or more optical cameras for recording images of semiconductor wafer 2 and/or semiconductor dies 2A arranged therein, and/or target 113. Based on these recorded images, which may in the form of still or moving images, controller 100 controls target stage 110, wafer stage 120, and/or releasing unit 130 to ensure that each semiconductor die 2A to be placed is arranged on an intended position on target 113. This placing process will be described next in more detail referring to FIG. 2.

FIG. 2 illustrates a schematic cross-sectional view corresponding to the apparatus of FIG. 1. Here, a target 113 is shown, for example a printed circuit board. Target 113 comprises a plurality of intended placement positions on which a semiconductor die 2A from diced semiconductor wafer 2 needs to be placed. Prior to arranging a semiconductor die 2A, a droplet 151 of conductive glue, solder, or the like, is provided, e.g. dispensed, on target 113 by dispensing apparatus 150.

As shown in insert I, target 113 may be provided with a plurality of droplets 151 that are arranged in rows R and columns C. Similarly, semiconductor dies 2A may also be arranged in a matrix of rows r and columns c on semiconductor wafer 2. Here, it is assumed that columns c on diced semiconductor wafer 2 and columns C on target 113 each extend perpendicular to the longitudinal axis curved shell 122 and/or rotational axis 122A.

After having deposited or otherwise arranged droplets 151 on target 113, target 113 is moved underneath curved shell 122 to receive a semiconductor die 2A that is released from diced semiconductor wafer 2. To that end, releasing unit 130 is used.

Curved shell 122 has, at least for the most part, a constant cross section along rotational axis 122A. Curved shell 122 can be a partially circular or circular cylindrical shell. Various examples of a cross section of curved shell 122 are shown in FIG. 1A. Here, example A corresponds to a partially circular cylindrical shell, example B to a circular cylindrical shell, and example C to a further partially circular cylindrical shell, namely a semi-circular cylindrical shell.

Now referring again to FIG. 2, releasing unit 130 comprises a laser source 132 that emits a beam 133 of light through curved shell 122 onto a semiconductor die 2A to be released from carrier film 4. To that end, curved shell 122 is at least partially translucent, at least for the light coming from laser source 132. Curved shell 122 can be made entirely of translucent material or it can have particular regions that are translucent whereas others are not. For example, curved shell 122 can be made of glass, quartz, or fused silica.

Attaching layer 41 comprises a light-absorbing agent, such as a photo-sensitive adhesive. Once attaching layer 41 has been irradiated with light from laser source 132, it will lose its attachment with semiconductor die 2A. For example, the absorption of light will cause a chemical reaction of the light-absorbing agent as a result of which the adhesive properties of attaching layer 41 will diminish. Additionally, or alternatively, absorption of light may cause a sharp and local increase in temperature. This may even lead to local ablation and/or the production of gaseous components that would propel the released semiconductor die 2A towards target 113.

After losing attachment, semiconductor die 2A falls down onto an intended placement position on target 113. Thereafter, curved shell 122 is rotated by motor M3 to bring another semiconductor die 2A into alignment with laser source 132. Furthermore, curved shell 122 and target 113 are mutually translated to bring a next intended placement position at the correct position relative to curved shell 122.

As shown in FIG. 2, various inspection systems can be mounted. An inspection system can be used for inspecting semiconductor dies 2A from diced semiconductor wafer 2 prior to being placed on target 113. Such inspection may comprise determining position and orientation of semiconductor dies 2A. This allows a final correction to be made, for example by translating curved shell 122, target 113, and/or laser source 132 prior to releasing a semiconductor die 2A. It is noted that each semiconductor die 2A may be slightly offset from its ideal position and/or orientation. Such deviation may occur during dicing and/or when mounting FFFC 3 onto curved shell 122. Recording such deviation is possible by one or more cameras 141 of inspection system 140. Because curved shell 122 is at least locally translucent, camera(s) 141 can also be arranged inside curved shell 122.

Another or the same camera can also be used for checking whether a semiconductor die 2A is damaged prior to releasing that die. If it is determined that a semiconductor die 2A is damaged, it may be decided, by controller 100 of apparatus 1, to skip that semiconductor die.

Another or the same camera can also be used for checking whether a semiconductor die