12 in a plan view; a cooling water introduction nipple 18 configured to introduce the cooling water 22 into the cooling pipe 17; and a cooling water drainage nipple 19 configured to discharge the cooling water 22 from the cooling pipe 17. It should be noted that the cooler 15 according to the present embodiment cools the resin package module 12 by water cooling of cooling water 22 circulating in the cooling pipe 17, but may cool the resin package module 12 by a method using another refrigerant such as air cooling of gas circulating in the cooling pipe 17. The same applies to a cooler according to another embodiment.

FIG. 4 is a view schematically showing a flow of circulation of cooling water 22 in the cooler 15. As shown with an example in FIG. 4, the cooler 15 circulates cooling water 22 through the cooling pipe 17. Accordingly, the cooler 15 cools the resin package module 12 through the metal base 16.

Specifically, the cooler 15 dissipates heat generated from the semiconductor element 3 and heat generated from the semiconductor element 4, which are transferred through the metal block 1, the insulating material 9, the metal plate 10, and the heat dissipating grease 13 in the resin package module 12, by cooling water 22 circulating in the cooling pipe 17 through the metal base 16.

It should be noted that the semiconductor element 3 is, for example, an insulated gate bipolar transistor (IGBT), a metal-oxide-semiconductor field effect transistor (MOSFET), or the like. In addition, the semiconductor element 4 is, for example, a diode.

In addition, as a semiconductor used for the semiconductor element 3 and the semiconductor element 4, a wide band gap semiconductor such as silicon carbide (SiC) is assumed in addition to silicon (Si), for example. Here, the wide band gap semiconductor generally refers to a semiconductor having a forbidden band width of about 2 eV or more, and known are Group 3 nitrides such as gallium nitride (GaN), Group 2 oxides such as zinc oxide (ZnO), Group 2 chalcogenides such as zinc selenide (ZnSe), diamond, and silicon carbide. Although the case where silicon carbide is used is described in the present embodiment, the same applies to other semiconductors and wide band gap semiconductors.

According to the above configuration, since the cooling pipe 17 of the cooler 15 is disposed to surround the resin package module 12 in a plan view, the height of the entire structure of the semiconductor device can be kept low.

Second Embodiment

A semiconductor device according to the present embodiment will be described. It should be noted that in the following description, the same components as those described in the embodiment described above are denoted by the same reference numerals and illustrated, and the detailed description thereof will be appropriately omitted.

FIG. 5 is a cross-sectional view schematically showing an example of the configuration of the semiconductor device according to the present embodiment. In addition, FIG. 6 is a cross-sectional view from another direction schematically showing an example of a configuration of a semiconductor device according to the present embodiment. In addition, FIG. 7 is a plan view schematically showing an example of the configuration of the semiconductor device according to the present embodiment.

As shown with an example in FIGS. 5, 6, and 7, the semiconductor device includes a resin package module 12 and a cooler 15A that cools the resin package module 12 by water cooling.

The cooler 15A formed of aluminum or the like is disposed in contact with a lower surface of the resin package module 12, specifically, a lower surface of the metal plate 10 while surrounding the resin package module 12 in a plan view.

The cooler 15A includes: a metal base 16 formed of copper or the like in contact with a lower surface of the metal plate 10 with interposition of the heat dissipating grease 13; a cooling pipe 17A disposed on an upper surface of the metal base 16, the cooling pipe 17A being formed of aluminum or the like disposed to partially (that is, only a part of the side surface) surround the resin package module 12 in a plan view; a cooling water introduction nipple 18 configured to introduce the cooling water 22 into the cooling pipe 17A; and two cooling water drainage nipples 19A configured to discharge the cooling water 22 from the cooling pipe 17A.

The cooling water introduction nipple 18 is provided in a linear portion of the cooling pipe 17A partially surrounding the resin package module 12 in a plan view. In addition, the two cooling water drainage nipples 19A are provided at both ends of the cooling pipe 17A partially surrounding the resin package module 12 in a plan view.

FIG. 8 is a view schematically showing a flow of circulation of cooling water 22 in the cooler 15A. As shown with an example in FIG. 8, the cooler 15A circulates cooling water 22 through the cooling pipe 17A. Accordingly, the cooler 15A cools the resin package module 12 through the metal base 16.

Specifically, the cooler 15A dissipates heat generated from the semiconductor element 3 and heat generated from the semiconductor element 4, which are transferred through the metal block 1, the insulating material 9, the metal plate 10, and the heat dissipating grease 13 in the resin package module 12, by cooling water 22 circulating in the cooling pipe 17A through the metal base 16.

According to the above configuration, since the cooling pipe 17A of the cooler 15A is disposed to partially surround the resin package module 12 in a plan view, the height of the entire structure of the semiconductor device can be kept low. In addition, since the cooling pipe 17A is disposed without surrounding the entire periphery of the resin package module 12 in a plan view, the occupied area (foot space) of the semiconductor device can be reduced.

Third Embodiment

FIG. 9 is a cross-sectional view schematically showing an example of the configuration of the semiconductor device according to the present embodiment. In addition, FIG. 10 is a cross-sectional view from another direction schematically showing an example of a configuration of a semiconductor device according to the present embodiment. In addition, FIG. 11 is a plan view schematically showing an example of the configuration of the semiconductor device according to the present embodiment.

As shown with an example in FIGS. 9, 10, and 11, the semiconductor device includes a resin package module 12 and a cooler 15B that cools the resin package module 12 by water cooling.

The cooler 15B formed of aluminum or the like is disposed in contact with a lower surface of the resin package module 12, specifically, a lower surface of the metal plate 10 while surrounding the resin package module 12 in a plan view.

The cooler 15B includes: a metal base 16 formed of copper or the like in contact with a lower surface of the metal plate 10 with interposition of the heat dissipating grease 13; a cooling pipe 17B disposed on an upper surface of the metal base 16, the cooling pipe 17B being formed of aluminum or the like disposed to partially surround the resin package module 12 in a plan view; a cooling water introduction nipple 18B configured to introduce the cooling water 22 into the cooling pipe 17B; and a cooling water drainage nipple 19B configured to discharge the cooling water 22 from the cooling pipe 17B.

The cooling water introduction nipple 18B is provided at one end in the longitudinal direction of the cooling pipe 17B partially surrounding the resin package module 12 in a plan view. In addition, the cooling water drainage nipple 19B is provided at the other end in the longitudinal direction of the cooling pipe 17B partially surrounding the resin package module 12 in a plan view.

FIG. 12 is a view schematically showing a flow of circulation of cooling water 22 in the cooler 15B. As shown with an example in FIG. 12, the cooler 15B circulates cooling water 22 through the cooling pipe 17B. Accordingly, the cooler 15B cools the resin package module 12 through the metal base 16.

Specifically, the cooler 15B dissipates heat generated from the semiconductor element 3 and heat generated from the semiconductor element 4, which are transferred through the metal block 1, the insulating material 9, the metal plate 10, and the heat dissipating grease 13 in the resin package module 12, by cooling water 22 circulating in the cooling pipe 17B through the metal base 16. It should be noted that the shape of the cooling pipe 17B illustrated in FIG. 12 is also applicable to other embodiments.

According to the above configuration, since the cooling pipe 17B of the cooler 15B is disposed to partially surround the resin package module 12 in a plan view, the height of the entire structure of the semiconductor device can be kept low. In addition, since the cooling pipe 17B is disposed without surrounding the entire periphery of the resin package module 12 in a plan view, the occupied area (foot space) of the semiconductor device can be reduced. In addition, since the nipple is not provided in the linear portion of the cooling pipe 17B, it is possible to suppress the manufacturing cost or improve the assembling property.

Fourth Embodiment

FIG. 13 is a cross-sectional view schematically showing an example of the configuration of the semiconductor device according to the present embodiment. In addition, FIG. 14 is a cross-sectional view from another direction schematically showing an example of a configuration of a semiconductor device according to the present embodiment. In addition, FIG. 15 is a plan view schematically showing an example of the configuration of the semiconductor device according to the present embodiment.

As shown with an example in FIGS. 13, 14, and 15, the semiconductor device includes a resin package module 12 and a cooler 15C that cools the resin package module 12 by water cooling.

The cooler 15C formed of aluminum or the like is disposed in contact with a lower surface of the resin package module 12, specifically, a lower surface of the metal plate 10 while surrounding the resin package module 12 in a plan view.

The cooler 15C includes: a metal base 16 formed of copper or the like in contact with a lower surface of the metal plate 10 with interposition of the heat dissipating grease 13; a cooling pipe 17C disposed on an upper surface of the metal base 16, the cooling pipe 17C being formed of aluminum or the like disposed to surround a pair of facing side surfaces of the resin package module 12 in a plan view; a cooling water introduction nipple 18C configured to introduce the cooling water 22 into the cooling pipe 17C; and a cooling water drainage nipple 19C configured to discharge the cooling water 22 from the cooling pipe 17C.

The cooling pipe 17C is a linear pipe along sides facing each other, and is disposed to be divided into two places. Then, the cooling water introduction nipple 18C is provided at one end of each of the cooling pipes 17C. In addition, the cooling water drainage nipple 19C is provided at the other end of each of the cooling pipes 17C.

FIG. 16 is a view schematically showing a flow of circulation of cooling water 22 in the cooler 15C. As shown with an example in FIG. 16, the cooler 15C circulates cooling water 22 through the cooling pipe 17C. Accordingly, the cooler 15C cools the resin package module 12 through the metal base 16.

Specifically, the cooler 15C dissipates heat generated from the semiconductor element 3 and heat generated from the semiconductor element 4, which are transferred through the metal block 1, the insulating material 9, the metal plate 10, and the heat dissipating grease 13 in the resin package module 12, by cooling water 22 circulating in the cooling pipe 17C through the metal base 16.

According to the above configuration, since the cooling pipe 17C of the cooler 15C is disposed to surround only a pair of facing side surfaces of the resin package module 12 in a plan view, the height of the entire structure of the semiconductor device can be kept low. In addition, since the cooling pipe 17C is disposed without surrounding the entire periphery of the resin package module 12 in a plan view, the occupied area (foot space) of the semiconductor device can be reduced.

Fifth Embodiment

FIG. 17 is a cross-sectional view schematically showing an example of the configuration of the semiconductor device according to the present embodiment. In addition, FIG. 18 is a cross-sectional view from another direction schematically showing an example of a configuration of a semiconductor device according to the present embodiment. In addition, FIG. 19 is a plan view schematically showing an example of the configuration of the semiconductor device according to the present embodiment.

As shown with an example in FIGS. 17, 18, and 19, the semiconductor device includes a resin package module 12 and a cooler 15D that cools the resin package module 12 by water cooling.

The cooler 15D formed of aluminum or the like is disposed in contact with a lower surface of the resin package module 12, specifically, a lower surface of the metal plate 10 while surrounding the resin package module 12 in a plan view.

The cooler 15D includes: a metal base 16 formed of copper or the like in contact with a lower surface of the metal plate 10 with interposition of the heat dissipating grease 13; a cooling pipe 17D disposed on an upper surface of the metal base 16, the cooling pipe 17D being formed of aluminum or the like disposed to surround the entire periphery of the resin package module 12 in a plan view; a cooling water introduction nipple 18 configured to introduce the cooling water 22 into the cooling pipe 17D; and a cooling water drainage nipple 19 configured to discharge the cooling water 22 from the cooling pipe 17D.

Here, in the cooling pipe 17D, an inner side surface surrounding the resin package module 12 is in contact with a side surface of the resin package module 12 with interposition of heat dissipating grease 13 (not shown) or the like.

It should be noted that when contact of the inner side surface of the cooling pipe 17D with the side surface of the resin package module 12 makes it difficult to secure the circular surface distance and the space distance of the main terminal 6 and the signal terminal 8 protruding from the side surface of the resin package module 12, these terminals may be changed to protrude from the upper surface of the resin package module 12.

In the lead forming of the main terminal 6 and the signal terminal 8 in this case, the main terminal 6 and the signal terminal 8 are formed so as to be exposed at a corner portion of the upper surface of the molding resin 11 and to extend along the upper surface so as to be flush with the upper surface of the molding resin 11. Then, the main terminal 6 and the signal terminal 8 are formed so as to extend from the corner portion of the upper surface of the molding resin 11 toward the upper side of the molding resin 11 so as to be flush with the side surface of molding resin 11.

FIG. 20 is a view showing an example of lead forming when the side surface of the molding resin 11 is not flush. In addition, FIG. 21 is a view showing an example of lead forming when the upper surface and the side surface of the molding resin 11 are flush.

In the case shown in FIG. 20, the main terminal 6 and the signal terminal 8 are bent by the lead forming die 20 disposed above and the lead forming die 21 disposed below, but none of them are in a flush relationship with the side surface of the molding resin 11.

On the other hand, in the case shown in FIG. 21, the main terminal 6 and the signal terminal 8 are bent by the lead forming die 20A disposed above and the lead forming die 21A disposed below, and both are formed so as to extend upward while maintaining a flush relationship with the side surface of the molding resin 11. In addition, in the case shown in FIG. 21, the bent main terminal 6 and signal terminal 8 are flush also with the upper surface of the molding resin 11.

FIG. 22 is a view schematically showing a flow of circulation of cooling water 22 in the cooler 15D. As shown with an example in FIG. 22, the cooler 15D circulates cooling water 22 through the cooling pipe 17D. Accordingly, the cooler 15D cools the resin package module 12 through the metal base 16.

Specifically, the cooler 15D dissipates heat generated from the semiconductor element 3 and heat generated from the semiconductor element 4, which are transferred through the metal block 1, the insulating material 9, the metal plate 10, and the heat dissipating grease 13 in the resin package module 12, by cooling water 22 circulating in the cooling pipe 17D through the metal base 16.

In addition, the cooler 15D cools the heat generated from the semiconductor element 3 and the heat generated from the semiconductor element 4 transferred through the metal block 1 and the molding resin 11 in the resin package module 12 by the cooling water 22 circulating in the cooling pipe 17D through the inner side surface in contact with the resin package module 12.

According to the above configuration, since the cooling pipe 17D of the cooler 15D is disposed to surround the resin package module 12 in a plan view, the height of the entire structure of the semiconductor device can be kept low. In addition, since the cooler 15D cools the heat generated from the semiconductor element 3 and the heat generated from the semiconductor element 4 through the inner side surface in contact with the resin package module 12, the cooling efficiency is improved. In addition, with the configuration in which the main terminal 6 and the signal terminal 8 protrude from the upper surface of the molding resin 11, the allowable range of the voltage applied to the semiconductor element 3 and the semiconductor element 4 is extended, so that the quality of the semiconductor device is improved.

Sixth Embodiment

FIG. 23 is a cross-sectional view schematically showing an example of the configuration of the semiconductor device according to the present embodiment. In addition, FIG. 24 is a cross-sectional view from another direction schematically showing an example of a configuration of a semiconductor device according to the present embodiment. In addition, FIG. 25 is a plan view schematically showing an example of the configuration of the semiconductor device according to the present embodiment.

As shown with an example in FIGS. 23, 24, and 25, the semiconductor device includes a resin package module 12 and a cooler 15E that cools the resin package module 12 by water cooling.

The cooler 15E formed of aluminum or the like is disposed in contact with a lower surface of the resin package module 12, specifically, a lower surface of the metal plate 10 while surrounding the resin package module 12 in a plan view.

The cooler 15E includes: a metal base 16 formed of copper or the like in contact with a lower surface of the metal plate 10 with interposition of the heat dissipating grease 13; a cooling pipe 17E disposed on an upper surface of the metal base 16, the cooling pipe 17E being formed of aluminum or the like disposed to partially surround the resin package module 12 in a plan view; a cooling water introduction nipple 18 configured to introduce the cooling water 22 into the cooling pipe 17E; and two cooling water drainage nipples 19A configured to discharge the cooling water 22 from the cooling pipe 17E.

The cooling water introduction nipple 18 is provided in a linear portion of the cooling pipe 17E partially surrounding the resin package module 12 in a plan view. In addition, the two cooling water drainage nipples 19A are provided at both ends of the cooling pipe 17E partially surrounding the resin package module 12 in a plan view.

Here, in the cooling pipe 17E, an inner side surface surrounding the resin package module 12 is in contact with a side surface of the resin package module 12 with interposition of heat dissipating grease 13 (not shown) or the like.

It should be noted that when contact of the inner side surface of the cooling pipe 17E with the side surface of the resin package module 12 makes it difficult to secure the circular surface distance and the space distance of the signal terminal 8 protruding from the side surface of the resin package module 12, these terminals may be changed to protrude from the upper surface of the resin package module 12.

In the lead forming of the signal terminal 8 in this case, the signal terminal 8 is formed so as to be exposed at a corner portion of the upper surface of the molding resin 11 and to extend along the upper surface so as to be flush with the upper surface of the molding resin 11. Then, the signal terminal 8 is formed so as to extend from the corner portion of the upper surface of the molding resin 11 toward the upper side of the molding resin 11 so as to be flush with the side surface of molding resin 11.

FIG. 26 is a view schematically showing a flow of circulation of cooling water 22 in the cooler 15E. As shown with an example in FIG. 26, the cooler 15E circulates cooling water 22 through the cooling pipe 17E. Accordingly, the cooler 15E cools the resin package module 12 through the metal base 16.

Specifically, the cooler 15E dissipates heat generated from the semiconductor element 3 and heat generated from the semiconductor element 4, which are transferred through the metal block 1, the insulating material 9, the metal plate 10, and the heat dissipating grease 13 in the resin package module 12, by cooling water 22 circulating in the cooling pipe 17E through the metal base 16.

In addition, the cooler 15E cools the heat generated from the semiconductor element 3 and the heat generated from the semiconductor element 4 transferred through the metal block 1 and the molding resin 11 in the resin package module 12 by the cooling water 22 circulating in the cooling pipe 17E through the inner side surface in contact with the resin package module 12.

According to the above configuration, since the cooling pipe 17E of the cooler 15E is disposed to partially surround the resin package module 12 in a plan view, the height of the entire structure of the semiconductor device can be kept low. In addition, since the cooler 15E cools the heat generated from the semiconductor element 3 and the heat generated from the semiconductor element 4 through the inner side surface in contact with the resin package module 12, the cooling efficiency is improved. In addition, with the configuration in which the signal terminal 8 protrudes from the upper surface of the molding resin 11, the allowable range of the voltage applied to the semiconductor element 3 and the semiconductor element 4 is extended, so that the quality of the semiconductor device is improved. In addition, since the cooling pipe 17E is disposed without surrounding the entire periphery of the resin package module 12 in a plan view, the occupied area (foot space) of the semiconductor device can be reduced.

Seventh Embodiment

FIG. 27 is a cross-sectional view schematically showing an example of the configuration of the semiconductor device according to the present embodiment. In addition, FIG. 28 is a cross-sectional view from another direction schematically showing an example of a configuration of a semiconductor device according to the present embodiment. In addition, FIG. 29 is a plan view schematically showing an example of the configuration of the semiconductor device according to the present embodiment.

As shown with an example in FIGS. 27, 28, and 29, the semiconductor device includes a resin package module 12F and a cooler 15D that cools the resin package module 12F by water cooling.

The resin package module 12F includes: a metal block 1F formed of copper or the like; a semiconductor element 3 including silicon (Si) or the like joined to an upper surface of the metal block 1F with interposition of a brazing material 2 such as solder; a semiconductor element 4 including silicon (Si) or the like joined to an upper surface of the metal block 1F with interposition of a brazing material 2 such as solder; a main terminal 6 formed of copper or the like joined to an upper surface of the semiconductor element 3 and an upper surface of the semiconductor element 4 with interposition of a brazing material 5 such as solder; a signal terminal 8 formed of copper or the like connected to the semiconductor element 3 with interposition of a wire bond 7 formed of aluminum or the like; and a molding resin 11 formed by sealing the above-described configuration while exposing a part of the main terminal 6 and a part of the signal terminal 8. In addition, the lower surface of the metal block IF is covered with the molding resin 11.

The cooler 15D formed of aluminum or the like is disposed in contact with a lower surface of the resin package module 12F, specifically, a lower surface of the molding resin 11 while surrounding the resin package module 12F in a plan view.

The cooler 15D includes: a metal base 16 formed of copper or the like in contact with a lower surface of the molding resin 11 with interposition of the heat dissipating grease 13; a cooling pipe 17D disposed on an upper surface of the metal base 16, the cooling pipe 17D being formed of aluminum or the like disposed to surround the entire periphery of the resin package module 12F in a plan view; a cooling water introduction nipple 18 configured to introduce the cooling water 22 into the cooling pipe 17D; and a cooling water drainage nipple 19 configured to discharge the cooling water 22 from the cooling pipe 17D.

Here, in the cooling pipe 17D, an inner side surface surrounding the resin package module 12F is in contact with a side surface of the resin package module 12F with interposition of heat dissipating grease 13 (not shown) or the like.

It should be noted that in the present embodiment, the cooler 15D is provided as a cooler for cooling the resin package module 12F, but the cooler 15 and the like shown in other embodiments may be provided instead.

FIG. 30 is a view schematically showing a flow of circulation of cooling water 22 in the cooler 15D. As shown with an example in FIG. 30, the cooler 15D circulates cooling water 22 through the cooling pipe 17D. Accordingly, the cooler 15D cools the resin package module 12F through the metal base 16.

Specifically, the cooler 15D dissipates heat generated from the semiconductor element 3 and heat generated from the semiconductor element 4, which are transferred through the metal block 1F and the heat dissipating grease 13 in the resin package module 12F, by cooling water 22 circulating in the cooling pipe 17D through the metal base 16.

In addition, the cooler 15D cools the heat generated from the semiconductor element 3 and the heat generated from the semiconductor element 4 transferred through the metal block 1F and the molding resin 11 in the resin package module 12F by the cooling water 22 circulating in the cooling pipe 17D through the inner side surface in contact with the resin package module 12F.

According to the above configuration, since the cooling pipe 17D of the cooler 15D is disposed to surround the resin package module 12F in a plan view, the height of the entire structure of the semiconductor device can be kept low. In addition, since the cooler 15D cools the heat generated from the semiconductor element 3 and the heat generated from the semiconductor element 4 through the inner side surface in contact with the resin package module 12F, the cooling efficiency is improved. In addition, since the resin package module 12F has a sufficient withstand voltage due to the lower surface of the metal block 1F being covered with the molding resin 11, it is not necessary for the resin package module 12F to separately include an insulating material. Therefore, it is possible to improve the assembling property of the semiconductor device and to suppress the manufacturing cost.

Eighth Embodiment

FIG. 31 is a cross-sectional view schematically showing an example of the configuration of the semiconductor device according to the present embodiment. In addition, FIG. 32 is a cross-sectional view from another direction schematically showing an example of a configuration of a semiconductor device according to the present embodiment. In addition, FIG. 33 is a plan view schematically showing an example of the configuration of the semiconductor device according to the present embodiment.

As shown with an example in FIGS. 31, 32, and 33, the semiconductor device includes a resin package module 12F and a cooler 15E that cools the resin package module 12F by water cooling.

The resin package module 12F includes a metal block 1F, a semiconductor element 3, a semiconductor element 4, a main terminal 6, a signal terminal 8, and a molding resin 11.

The cooler 15E is disposed in contact with a lower surface of the resin package module 12F, specifically, a lower surface of the molding resin 11 while surrounding the resin package module 12F in a plan view.

The cooler 15E includes a metal base 16, a cooling pipe 17E, a cooling water introduction nipple 18, and two cooling water drainage nipples 19A.

The cooling water introduction nipple 18 is provided in a linear portion of the cooling pipe 17E partially surrounding the resin package module 12F in a plan view. In addition, the two cooling water drainage nipples 19A are provided at both ends of the cooling pipe 17E partially surrounding the resin package module 12F in a plan view.

Here, in the cooling pipe 17E, an inner side surface surrounding the resin package module 12F is in contact with a side surface of the resin package module 12F with interposition of heat dissipating grease 13 (not shown) or the like.

It should be noted that in the present embodiment, the cooler 15E is provided as a cooler for cooling the resin package module 12F, but the cooler 15A and the like shown in other embodiments may be provided instead.

FIG. 34 is a view schematically showing a flow of circulation of cooling water 22 in the cooler 15E. As shown with an example in FIG. 34, the cooler 15E circulates cooling water 22 through the cooling pipe 17E. Accordingly, the cooler 15E cools the resin package module 12F through the metal base 16.

Specifically, the cooler 15E dissipates heat generated from the semiconductor element 3 and heat generated from the semiconductor element 4, which are transferred through the metal block 1 and the heat dissipating grease 13 in the resin package module 12F, by cooling water 22 circulating in the cooling pipe 17E through the metal base 16.

In addition, the cooler 15E cools the heat generated from the semiconductor element 3 and the heat generated from the semiconductor element 4 transferred through the metal block 1 and the molding resin 11 in the resin package module 12F by the cooling water 22 circulating in the cooling pipe 17E through the inner side surface in contact with the resin package module 12F.

According to the above configuration, since the cooling pipe 17E of the cooler 15E is disposed to partially surround the resin package module 12F in a plan view, the height of the entire structure of the semiconductor device can be kept low. In addition, since the cooler 15E cools the heat generated from the semiconductor element 3 and the heat generated from the semiconductor element 4 through the inner side surface in contact with the resin package module 12F, the cooling efficiency is improved. In addition, since the resin package module 12F has a sufficient withstand voltage due to the lower surface of the metal block 1F being covered with the molding resin 11, it is not necessary for the resin package module 12F to separately include an insulating material. Therefore, it is possible to improve the assembling property of the semiconductor device and to suppress the manufacturing cost.

Ninth Embodiment

FIG. 35 is a cross-sectional view schematically showing an example of the configuration of the semiconductor device according to the present embodiment. In addition, FIG. 36 is a cross-sectional view from another direction schematically showing an example of a configuration of a semiconductor device according to the present embodiment. In addition, FIG. 37 is a plan view schematically showing an example of the configuration of the semiconductor device according to the present embodiment.

As shown with an example in FIGS. 35, 36, and 37, the semiconductor device includes a resin package module 12G and a cooler 15D that cools the resin package module 12G by water cooling.

The resin package module 12G includes: a metal block 1G formed of copper or the like; a semiconductor element 3 including silicon (Si) or the like joined to an upper surface of the metal block 1G with interposition of a brazing material 2 such as solder; a semiconductor element 4 including silicon (Si) or the like joined to an upper surface of the metal block 1G with interposition of a brazing material 2 such as solder; a main terminal 6 formed of copper or the like joined to an upper surface of the semiconductor element 3 and an upper surface of the semiconductor element 4 with interposition of a brazing material 5 such as solder; a signal terminal 8 formed of copper or the like connected to the semiconductor element 3 with interposition of a wire bond 7 formed of aluminum or the like; an insulating material 9 formed of an epoxy resin, ceramic, or the like provided on a lower surface of the metal block 1G; a metal plate 10G formed of copper or the like provided on a lower surface of the insulating material 9; and a molding resin 11 formed by sealing the above-described configuration while exposing a part of the main terminal 6, a part of the signal terminal 8, and the side surface and the lower surface of the metal plate 10G.

The cooler 15D formed of aluminum or the like is disposed in contact with a lower surface of the resin package module 12G, specifically, a lower surface of the metal plate 10G while surrounding the resin package module 12G in a plan view.

The cooler 15D includes: a metal base 16 formed of copper or the like in contact with a lower surface of the metal plate 10G with interposition of the heat dissipating grease 13; a cooling pipe 17D disposed on an upper surface of the metal base 16, the cooling pipe 17D being formed of aluminum or the like disposed to surround the entire periphery of the resin package module 12G in a plan view; a cooling water introduction nipple 18 configured to introduce the cooling water 22 into the cooling pipe 17D; and a cooling water drainage nipple 19 configured to discharge the cooling water 22 from the cooling pipe 17D.

Here, in the cooling pipe 17D, an inner side surface surrounding the resin package module 12G is in contact with a side surface of the metal plate 10G with interposition of heat dissipating grease 13 (not shown) or the like.

FIG. 38 is a view schematically showing a flow of circulation of cooling water 22 in the cooler 15D. As shown with an example in FIG. 38, the cooler 15D circulates cooling water 22 through the cooling pipe 17D. Accordingly, the cooler 15D cools the resin package module 12G through the metal base 16.

Specifically, the cooler 15D dissipates heat generated from the semiconductor element 3 and heat generated from the semiconductor element 4, which are transferred through the metal block 1G, the insulating material 9, the metal plate 10G, and the heat dissipating grease 13 in the resin package module 12G, by cooling water 22 circulating in the cooling pipe 17D through the metal base 16.

In addition, the cooler 15D cools the heat generated from the semiconductor element 3 and the heat generated from the semiconductor element 4 transferred through the metal block 1G, the insulating material 9, and the metal plate 10G in the resin package module 12G by the cooling water 22 circulating in the cooling pipe 17D through the inner side surface in contact with the resin package module 12G.

According to the above configuration, since the cooling pipe 17D of the cooler 15D is disposed to surround the resin package module 12G in a plan view, the height of the entire structure of the semiconductor device can be kept low. In addition, since the cooler 15D cools the heat generated from the semiconductor element 3 and the heat generated from the semiconductor element 4 through the inner side surface in contact with the side surface of the metal plate 10G of the resin package module 12G, the cooling efficiency is improved.

Tenth Embodiment

FIG. 39 is a cross-sectional view schematically showing an example of the configuration of the semiconductor device according to the present embodiment. In addition, FIG. 40 is a cross-sectional view from another direction schematically showing an example of a configuration of a semiconductor device according to the present embodiment. In addition, FIG. 41 is a plan view schematically showing an example of the configuration of the semiconductor device according to the present embodiment.

As shown with an example in FIGS. 39, 40, and 41, the semiconductor device includes a resin package module 12H and a cooler 15E that cools the resin package module 12H by water cooling.

The resin package module 12H includes: a metal block 1H formed of copper or the like; a semiconductor element 3 including silicon (Si) or the like joined to an upper surface of the metal block 1H with interposition of a brazing material 2 such as solder; a semiconductor element 4 including silicon (Si) or the like joined to an upper surface of the metal block 1H with interposition of a brazing material 2 such as solder; a main terminal 6 formed of copper or the like joined to an upper surface of the semiconductor element 3 and an upper surface of the semiconductor element 4 with interposition of a brazing material 5 such as solder; a signal terminal 8 formed of copper or the like connected to the semiconductor element 3 with interposition of a wire bond 7 formed of aluminum or the like; an insulating material 9 formed of an epoxy resin, ceramic, or the like provided on a lower surface of the metal block 1H; a metal plate 10H formed of copper or the like provided on a lower surface of the insulating material 9; and a molding resin 11 formed by sealing the above-described configuration while exposing a part of the main terminal 6, a part of the signal terminal 8, and a part of the side surface (that is, the side surface facing the cooling pipe 17E of the cooler 15E) and the lower surface of the metal plate 10H.

The cooler 15E is disposed in contact with a lower surface of the resin package module 12H, specifically, a lower surface of the metal plate 10H while surrounding the resin package module 12H in a plan view.

The cooler 15E includes a metal base 16 formed of copper or the like in contact with the lower surface of the metal plate 10H with interposition of the heat dissipating grease 13, a cooling pipe 17E, a cooling water introduction nipple 18, and two cooling water drainage nipples 19A.

The cooling water introduction nipple 18 is provided in a linear portion of the cooling pipe 17E partially surrounding the resin package module 12H in a plan view. In addition, the two cooling water drainage nipples 19A are provided at both ends of the cooling pipe 17E partially surrounding the resin package module 12H in a plan view.

Here, in the cooling pipe 17E, an inner side surface surrounding the resin package module 12H is in contact with a side surface of the metal plate 10H with interposition of heat dissipating grease 13 (not shown) or the like.

FIG. 42 is a view schematically showing a flow of circulation of cooling water 22 in the cooler 15E. As shown with an example in FIG. 42, the cooler 15E circulates cooling water 22 through the cooling pipe 17E. Accordingly, the cooler 15E cools the resin package module 12H through the metal base 16.

Specifically, the cooler 15E dissipates heat generated from the semiconductor element 3 and heat generated from the semiconductor element 4, which are transferred through the metal block 1H, the insulating material 9, the metal plate 10H, and the heat dissipating grease 13 in the resin package module 12H, by cooling water 22 circulating in the cooling pipe 17E through the metal base 16.

In addition, the cooler 15E cools the heat generated from the semiconductor element 3 and the heat generated from the semiconductor element 4 transferred through the metal block 1H, the insulating material 9, and the metal plate 10H in the resin package module 12H by the cooling water 22 circulating in the cooling pipe 17E through the inner side surface in contact with the resin package module 12H.

According to the above configuration, since the cooling pipe 17E of the cooler 15E is disposed to partially surround the resin package module 12H in a plan view, the height of the entire structure of the semiconductor device can be kept low. In addition, since the cooler 15E cools the heat generated from the semiconductor element 3 and the heat generated from the semiconductor element 4 through the inner side surface in contact with the side surface of the metal plate 10H of the resin package module 12H, the cooling efficiency is improved. In addition, since the cooling pipe 17E is disposed without surrounding the entire periphery of the resin package module 12H in a plan view, the occupied area (foot space) of the semiconductor device can be reduced.

Eleventh Embodiment

FIG. 43 is a cross-sectional view schematically showing an example of the configuration of the semiconductor device according to the present embodiment. In addition, FIG. 44 is a cross-sectional view from another direction schematically showing an example of a configuration of a semiconductor device according to the present embodiment. In addition, FIG. 45 is a plan view schematically showing an example of the configuration of the semiconductor device according to the present embodiment.

As shown with an example in FIGS. 43, 44, and 45, the semiconductor device includes a resin package module 12J and a cooler 15C that cools the resin package module 12J by water cooling.

The resin package module 12J includes: a metal block 1J formed of copper or the like; a semiconductor element 3 including silicon (Si) or the like joined to an upper surface of the metal block 1J with interposition of a brazing material 2 such as solder; a semiconductor element 4 including silicon (Si) or the like joined to an upper surface of the metal block 1J with interposition of a brazing material 2 such as solder; a main terminal 6 formed of copper or the like joined to an upper surface of the semiconductor element 3 and an upper surface of the semiconductor element 4 with interposition of a brazing material 5 such as solder; a signal terminal 8 formed of copper or the like connected to the semiconductor element 3 with interposition of a wire bond 7 formed of aluminum or the like; an insulating material 9 formed of an epoxy resin, ceramic, or the like provided on a lower surface of the metal block 1J; a metal plate 10J formed of copper or the like provided on a lower surface of the insulating material 9; and a molding resin 11 formed by sealing the above-described configuration while exposing a part of the main terminal 6, a part of the signal terminal 8, and a part of the side surface (that is, the side surface facing the cooling pipe 17C of the cooler 15C) and the lower surface of the metal plate 10J. Here, each of the main terminal 6 and the signal terminal 8 protrudes from the side surface of the molding resin 11.

The cooler 15C formed of aluminum or the like is disposed in contact with a lower surface of the resin package module 12J, specifically, a lower surface of the metal plate 10J while surrounding the resin package module 12J in a plan view.

The cooler 15C includes: a metal base 16 formed of copper or the like in contact with a lower surface of the metal plate 10J with interposition of the heat dissipating grease 13; a cooling pipe 17C disposed on an upper surface of the metal base 16, the cooling pipe 17C being formed of aluminum or the like disposed to partially surround the resin package module 12J in a plan view; a cooling water introduction nipple 18C configured to introduce the cooling water 22 into the cooling pipe 17C; and a cooling water drainage nipple 19C configured to discharge the cooling water 22 from the cooling pipe 17C.

FIG. 46 is a view schematically showing a flow of circulation of cooling water 22 in the cooler 15C. As shown with an example in FIG. 46, the cooler 15C circulates cooling water 22 through the cooling pipe 17C. Accordingly, the cooler 15C cools the resin package module 12J through the metal base 16.

Specifically, the cooler 15C dissipates heat generated from the semiconductor element 3 and heat generated from the semiconductor element 4, which are transferred through the metal block 1, the insulating material 9, the metal plate 10J, and the heat dissipating grease 13 in the resin package module 12J, by cooling water 22 circulating in the cooling pipe 17C through the metal base 16.

In addition, the cooler 15C cools the heat generated from the semiconductor element 3 and the heat generated from the semiconductor element 4 transferred through the metal block 1J, the insulating material 9, and the metal plate 10J in the resin package module 12J by the cooling water 22 circulating in the cooling pipe 17C through the inner side surface in contact with the resin package module 12J.

According to the above configuration, since the cooling pipe 17C of the cooler 15C is disposed to surround only a pair of facing side surfaces of the resin package module 12J in a plan view, the height of the entire structure of the semiconductor device can be kept low. In addition, since the cooling pipe 17C is disposed without surrounding the entire periphery of the resin package module 12J in a plan view, the occupied area (foot space) of the semiconductor device can be reduced.

Effects Produced by Embodiments Described Above

Next, examples of effects produced by the above-described embodiments will be shown. It should be noted that in the following description, the effects are described based on the specific configuration exemplified in the above-described embodiments, but in the scope where the same effects are produced, the configuration may be replaced with other specific configurations exemplified in the specification of the present application.

In addition, the replacement may be performed across a plurality of embodiments. That is, the case may be used where the same effects are produced by combining the respective configurations exemplified in different embodiments.

According to the embodiments described above, the semiconductor device includes the semiconductor module and the cooler 15 that cools the semiconductor module. Here, the semiconductor module corresponds to, for example, any one of the resin package module 12, the resin package module 12F, the resin package module 12G, the resin package module 12H, the resin package module 12J, and the like (hereinafter, for convenience, any one of these may be described in a corresponding manner.). The resin package module 12 includes a metal block 1 (alternatively, a metal block 1F, a metal block 1G, a metal block 1H, or a metal block 1J), a semiconductor element 3 (or a semiconductor element 4) provided on an upper surface of the metal block 1, a terminal connected to the semiconductor element 3, and a resin covering a part of the terminal, the metal block 1, and the semiconductor element 3. Here, the terminal corresponds to, for example, any one of the main terminal 6, the signal terminal 8, and the like (hereinafter, for convenience, any one of these may be correspondingly described). In addition, the resin corresponds to, for example, the molding resin 11. The cooler 15 includes a metal base 16 and a cooling pipe 17 (alternatively, a cooling pipe 17A, a cooling pipe 17B, a cooling pipe 17C, a cooling pipe 17D, or a cooling pipe 17E). The metal base 16 is in contact with the lower surface of the resin package module 12. In addition, the metal base 16 is provided in a region larger than a region overlapping the resin package module 12 in a plan view. The cooling pipe 17 is disposed on the upper surface of the metal base 16. In addition, the cooling pipe 17 circulates a refrigerant for cooling the resin package module 12. Here, the refrigerant corresponds to, for example, the cooling water 22. Then, the cooling pipe 17 is provided to surround at least a part of the resin package module 12 in a plan view.

According to the configuration, since the cooling pipe 17 of the cooler 15 is disposed to surround the resin package module 12 in a plan view, the height of the entire structure of the semiconductor device can be kept low. Specifically, since dissipating heat generated from the semiconductor element 3 and the semiconductor element 4 in the resin package module 12 to the lower surface of the cooling pipe