43 has the same dimensions as the third electrode portion 42, the largest dimension of the fifth electrode portion 43 in a direction along the third axis Z is smaller than the largest dimension of the first electrode portion 41 in the direction along the third axis Z.

The sixth electrode portion 53 is composed of the same material as the second electrode portion 51. The sixth electrode portion 53 is L shaped with the same dimensions as the fourth electrode portion 52 and is located at the same place as the fourth electrode portion 52 when the third layer L3 is viewed in the first negative direction X2. Therefore, the sixth electrode portion 53 is stacked on a surface of the fourth electrode portion 52 that faces in the first negative direction X2. Since the sixth electrode portion 53 has the same dimensions as the fourth electrode portion 52, the largest dimension of the sixth electrode portion 53 in a direction along the third axis Z is smaller than the largest dimension of the second electrode portion 51 in the direction along the third axis Z.

The second wiring portion 33 is composed of the same material as the first wiring portion 31. The second wiring portion 33 extends in a spiral shape around the center of the third layer L3 on the whole when the third layer L3 is viewed in the first negative direction X2. Specifically, the position of a first end portion 33A of the second wiring portion 33 lies on a surface of the via 32 that faces in the first negative direction X2. Therefore, the first end portion 33A of the second wiring portion 33 is connected to the via 32. The wiring width of the second wiring portion 33 is substantially constant except for at the first end portion 33A and a second end portion 33B thereof. The position of the second end portion 33B of the second wiring portion 33 in a direction along the third axis Z is on the third negative direction Z2 side relative to the center in a direction along the third axis Z. In addition, the position of the second end portion 33B of the second wiring portion 33 in a direction along the second axis Y is on the second positive direction Y1 side relative to the center in the direction along the second axis Y and is nearer the center in the direction along the second axis Y than the position of the second end portion 31B of the first wiring portion 31 in the direction along the second axis Y. The second wiring portion 33 extends clockwise from the first end portion 33A to the second end portion 33B when the second wiring portion 33 is viewed in the first negative direction X2.

The parts of the third layer L3 other than the fifth electrode portion 43, the sixth electrode portion 53, and the second wiring portion 33 are constituted by the third insulating portion 23. The third insulating portion 23 consists of a non-magnetic insulator composed of the same material as the first insulating portion 21.

The fourth layer L4 is stacked on a main surface of the third layer L3 that faces in the first negative direction X2. The fourth layer L4 has the same rectangular shape as the first layer L1 when the fourth layer L4 is viewed in the first negative direction X2. The fourth layer L4 consists of a seventh electrode portion 44, an eighth electrode portion 54, a via 34, and a fourth insulating portion 24.

The seventh electrode portion 44 is composed of the same material as the first electrode portion 41. The seventh electrode portion 44 is L shaped with the same dimensions as the fifth electrode portion 43 and is located at the same place as the fifth electrode portion 43 when the fourth layer L4 is viewed in the first negative direction X2. Therefore, the seventh electrode portion 44 is stacked on a surface of the fifth electrode portion 43 that faces in the first negative direction X2. Since the seventh electrode portion 44 has the same dimensions as the fifth electrode portion 43, the largest dimension of the seventh electrode portion 44 in a direction along the third axis Z is smaller than the largest dimension of the first electrode portion 41 in the direction along the third axis Z.

The eighth electrode portion 54 is composed of the same material as the second electrode portion 51. The eighth electrode portion 54 is L shaped with the same dimensions as the sixth electrode portion 53 and is located at the same place as the sixth electrode portion 53 when the fourth layer L4 is viewed in the first negative direction X2. Therefore, the eighth electrode portion 54 is stacked on a surface of the sixth electrode portion 53 that faces in the first negative direction X2. Since the eighth electrode portion 54 has the same dimensions as the sixth electrode portion 53, the largest dimension of the eighth electrode portion 54 in a direction along the third axis Z is smaller than the largest dimension of the second electrode portion 51 in the direction along the third axis Z.

The via 34 is composed of the same material as the first wiring portion 31. The via 34 has a cylindrical shape that extends in a direction along the first axis X. The via 34 is stacked on a surface of the second end portion 33B of the second wiring portion 33 that faces in the first negative direction X2. Therefore, the via 34 is electrically connected to the second end portion 33B of the second wiring portion 33. The via 34 extends in the first negative direction X2 from the second end portion 33B of the second wiring portion 33.

The parts of the fourth layer L4 other than the seventh electrode portion 44, the eighth electrode portion 54, and the via 34 are constituted by the fourth insulating portion 24. The fourth insulating portion 24 consists of a non-magnetic insulator composed of the same material as the first insulating portion 21.

The fifth layer L5 is stacked on a main surface of the fourth layer L4 that faces in the first negative direction X2. The fifth layer L5 has the same rectangular shape as the first layer L1 when the fifth layer L5 is viewed in the first negative direction X2. The fifth layer L5 consists of a ninth electrode portion 45, a tenth electrode portion 55, a third wiring portion 35, and a fifth insulating portion 25.

The ninth electrode portion 45 is composed of the same material as the first electrode portion 41. The ninth electrode portion 45 is L shaped with the same dimensions as the seventh electrode portion 44 and is located at the same place as the seventh electrode portion 44 when the fifth layer L5 is viewed in the first negative direction X2. Therefore, the ninth electrode portion 45 is stacked on a surface of the seventh electrode portion 44 that faces in the first negative direction X2. Since the ninth electrode portion 45 has the same dimensions as the seventh electrode portion 44, the largest dimension of the ninth electrode portion 45 in a direction along the third axis Z is smaller than the largest dimension of the first electrode portion 41 in the direction along the third axis Z.

The tenth electrode portion 55 is composed of the same material as the second electrode portion 51. The tenth electrode portion 55 is L shaped with the same dimensions as the eighth electrode portion 54 and is located at the same place as the eighth electrode portion 54 when the fifth layer L5 is viewed in the first negative direction X2. Therefore, the tenth electrode portion 55 is stacked on a surface of the eighth electrode portion 54 that faces in the first negative direction X2. Since the tenth electrode portion 55 has the same dimensions as the eighth electrode portion 54, the largest dimension of the tenth electrode portion 55 in a direction along the third axis Z is smaller than the largest dimension of the second electrode portion 51 in the direction along the third axis Z.

The third wiring portion 35 is composed of the same material as the first wiring portion 31. The third wiring portion 35 extends in a spiral shape around the center of the fifth layer L5 on the whole when the fifth layer L5 is viewed in the first negative direction X2. Specifically, the position of a first end portion 35A of the third wiring portion 35 lies on a surface of the via 34 that faces in the first negative direction X2. Therefore, the first end portion 35A of the third wiring portion 35 is connected to the via 34. The wiring width of the third wiring portion 35 is substantially constant except for at the first end portion 35A and a second end portion 35B thereof. The position of the second end portion 33B of the third wiring portion 35 in a direction along the third axis Z is on the third negative direction Z2 side relative to the center in a direction along the third axis Z. In addition, the position of the second end portion 33B of the second wiring portion 33 in a direction along the second axis Y is on the second negative direction Y2 side relative to the center in a direction along the second axis Y. The third wiring portion 35 extends clockwise from the first end portion 35A to the second end portion 35B when the third wiring portion 35 is viewed in the first negative direction X2.

The parts of the fifth layer L5 other than the ninth electrode portion 45, the tenth electrode portion 55, and the third wiring portion 35 are constituted by the fifth insulating portion 25. The fifth insulating portion 25 consists of a non-magnetic insulator composed of the same material as the first insulating portion 21.

The sixth layer L6 is stacked on a main surface of the fifth layer L5 that faces in the first negative direction X2. The sixth layer L6 has the same rectangular shape as the first layer L1 when the sixth layer L6 is viewed in the first negative direction X2. The sixth layer L6 consists of an eleventh electrode portion 46, a twelfth electrode portion 56, a via 36, and a sixth insulating portion 26.

The eleventh electrode portion 46 is composed of the same material as the first electrode portion 41. The eleventh electrode portion 46 is L shaped with the same dimensions as the ninth electrode portion 45 and is located at the same place as the ninth electrode portion 45 when the sixth layer L6 is viewed in the first negative direction X2. Therefore, the eleventh electrode portion 46 is stacked on a surface of the ninth electrode portion 45 that faces in the first negative direction X2. Since the eleventh electrode portion 46 has the same dimensions as the ninth electrode portion 45, the largest dimension of the eleventh electrode portion 46 in a direction along the third axis Z is smaller than the largest dimension of the first electrode portion 41 in the direction along the third axis Z.

The twelfth electrode portion 56 is composed of the same material as the second electrode portion 51. The twelfth electrode portion 56 is L shaped with the same dimensions as the tenth electrode portion 55 and is located at the same place as the tenth electrode portion 55 when the sixth layer L6 is viewed in the first negative direction X2. Therefore, the twelfth electrode portion 56 is stacked on a surface of the tenth electrode portion 55 that faces in the first negative direction X2. Since the twelfth electrode portion 56 has the same dimensions as the tenth electrode portion 55, the largest dimension of the twelfth electrode portion 56 in a direction along the third axis Z is smaller than the largest dimension of the second electrode portion 51 in the direction along the third axis Z.

The via 36 is composed of the same material as the first wiring portion 31. The via 36 has a cylindrical shape that extends in a direction along the first axis X. The via 36 is stacked on a surface of the second end portion 35B of the third wiring portion 35 that faces in the first negative direction X2. Therefore, the via 36 is electrically connected to the second end portion 35B of the third wiring portion 35. The via 36 extends in the first negative direction X2 from the second end portion 35B of the third wiring portion 35.

The parts of the sixth layer L6 other than the eleventh electrode portion 46, the twelfth electrode portion 56, and the via 36 are constituted by the sixth insulating portion 26. The sixth insulating portion 26 consists of a non-magnetic insulator composed of the same material as the first insulating portion 21.

The seventh layer L7 is stacked on a main surface of the sixth layer L6 that faces in the first negative direction X2. The seventh layer L7 has the same rectangular shape as the first layer L1 when the seventh layer L7 is viewed in the first negative direction X2. The seventh layer L7 consists of a thirteenth electrode portion 47, a fourteenth electrode portion 57, a fourth wiring portion 37, and a seventh insulating portion 27.

The thirteenth electrode portion 47 is composed of the same material as the first electrode portion 41. The thirteenth electrode portion 47 is L shaped with the same dimensions as the eleventh electrode portion 46 and is located at the same place as the eleventh electrode portion 46 when the seventh layer L7 is viewed in the first negative direction X2. Therefore, the thirteenth electrode portion 47 is stacked on a surface of the eleventh electrode portion 46 that faces in the first negative direction X2. Since the thirteenth electrode portion 47 has the same dimensions as the eleventh electrode portion 46, the largest dimension of the thirteenth electrode portion 47 in a direction along the third axis Z is smaller than the largest dimension of the first electrode portion 41 in the direction along the third axis Z.

The fourteenth electrode portion 57 is composed of the same material as the second electrode portion 51. The fourteenth electrode portion 57 is L shaped with the same dimensions as the twelfth electrode portion 56 and is located at the same place as the eleventh electrode portion 46 when the seventh layer L7 is viewed in the first negative direction X2. Therefore, the fourteenth electrode portion 57 is stacked on a surface of the twelfth electrode portion 56 that faces in the first negative direction X2. Since the fourteenth electrode portion 57 has the same dimensions as the twelfth electrode portion 56, the largest dimension of the fourteenth electrode portion 57 in a direction along the third axis Z is smaller than the largest dimension of the second electrode portion 51 in the direction along the third axis Z.

The fourth wiring portion 37 is composed of the same material as the first wiring portion 31. The fourth wiring portion 37 extends in a spiral shape around the center of the seventh layer L7 on the whole when the seventh layer L7 is viewed in the first negative direction X2. Specifically, the position of a first end portion 37A of the fourth wiring portion 37 lies on a surface of the via 36 that faces in the first negative direction X2. Therefore, the first end portion 37A of the fourth wiring portion 37 is connected to the via 36. The wiring width of the fourth wiring portion 37 is substantially constant except for at the first end portion 37A and a second end portion 37B thereof. The position of the second end portion 37B of the fourth wiring portion 37 in a direction along the third axis Z is on the third positive direction Z1 side relative to the center in a direction along the third axis Z. In addition, the position of the second end portion 37B of the fourth wiring portion 37 in a direction along the second axis Y is on the second negative direction Y2 side relative to the center in the direction along the second axis Y and is on the second negative direction Y2 side relative to the position of the first end portion 37A in the direction along the second axis Y. The fourth wiring portion 37 extends clockwise from the first end portion 37A to the second end portion 37B when the fourth wiring portion 37 is viewed in the first negative direction X2. In addition, the fourth wiring portion 37 has rotational symmetry with the second wiring portion 33 with the axis of rotation being an axis in a direction along the third axis Z passing through the center in the direction of extension of the inductor wiring 30.

The parts of the seventh layer L7 other than the thirteenth electrode portion 47, the fourteenth electrode portion 57, and the fourth wiring portion 37 are constituted by the seventh insulating portion 27. The seventh insulating portion 27 consists of a non-magnetic insulator composed of the same material as the first insulating portion 21.

The eighth layer L8 is stacked on a main surface of the seventh layer L7 that faces in the first negative direction X2. The eighth layer L8 has the same rectangular shape as the first layer L1 when the eighth layer L8 is viewed in the first negative direction X2. The eighth layer L8 consists of an fifteenth electrode portion 48, a sixteenth electrode portion 58, a via 38, and an eighth insulating portion 28.

The fifteenth electrode portion 48 is composed of the same material as the first electrode portion 41. The fifteenth electrode portion 48 is L shaped with the same dimensions as the thirteenth electrode portion 47 and is located at the same place as the thirteenth electrode portion 47 when the eighth layer L8 is viewed in the first negative direction X2. Therefore, the fifteenth electrode portion 48 is stacked on a surface of the thirteenth electrode portion 47 that faces in the first negative direction X2. Since the fifteenth electrode portion 48 has the same dimensions as the thirteenth electrode portion 47, the largest dimension of the fifteenth electrode portion 48 in a direction along the third axis Z is smaller than the largest dimension of the first electrode portion 41 in the direction along the third axis Z.

The sixteenth electrode portion 58 is composed of the same material as the second electrode portion 51. The sixteenth electrode portion 58 is L shaped with the same dimensions as the fourteenth electrode portion 57 and is located at the same place as the fourteenth electrode portion 57 when the eighth layer L8 is viewed in the first negative direction X2. Therefore, the sixteenth electrode portion 58 is stacked on a surface of the fourteenth electrode portion 57 that faces in the first negative direction X2. Since the sixteenth electrode portion 58 has the same dimensions as the fourteenth electrode portion 57, the largest dimension of the sixteenth electrode portion 58 in a direction along the third axis Z is smaller than the largest dimension of the second electrode portion 51 in the direction along the third axis Z.

The via 38 is composed of the same material as the first wiring portion 31. The via 38 has a cylindrical shape that extends in a direction along the first axis X. The via 38 is stacked on a surface of the second end portion 37B of the fourth wiring portion 37 that faces in the first negative direction X2. Therefore, the via 38 is electrically connected to the second end portion 37B of the fourth wiring portion 37. The via 38 extends in the first negative direction X2 from the second end portion 37B of the fourth wiring portion 37.

The parts of the eighth layer L8 other than the fifteenth electrode portion 48, the sixteenth electrode portion 58, and the via 38 are constituted by the eighth insulating portion 28. The eighth insulating portion 28 consists of a non-magnetic insulator composed of the same material as the first insulating portion 21.

The ninth layer L9 is stacked on a main surface of the eighth layer L8 that faces in the first negative direction X2. The ninth layer L9 has the same rectangular shape as the first layer L1 when the ninth layer L9 is viewed in the first negative direction X2. The ninth layer L9 consists of a seventeenth electrode portion 49, an eighteenth electrode portion 59, a fifth wiring portion 39, and a ninth insulating portion 29.

The seventeenth electrode portion 49 is composed of the same material as the first electrode portion 41. The seventeenth electrode portion 49 is L shaped with the same dimensions as the first electrode portion 41 and is located at the same place as the first electrode portion 41 when the ninth layer L9 is viewed in the first negative direction X2. Therefore, the seventeenth electrode portion 49 is stacked on a surface of the fifteenth electrode portion 48 that faces in the first negative direction X2.

The eighteenth electrode portion 59 is composed of the same material as the second electrode portion 51. The eighteenth electrode portion 59 is L shaped with the same dimensions as the second electrode portion 51 and is located at the same place as the second electrode portion 51 when the ninth layer L9 is viewed in the first negative direction X2. Therefore, the eighteenth electrode portion 59 is stacked on a surface of the sixteenth electrode portion 58 that faces in the first negative direction X2.

The fifth wiring portion 39 is composed of the same material as the first wiring portion 31. The fifth wiring portion 39 extends in a spiral shape around the center of the ninth layer L9 on the whole when the ninth layer L9 is viewed in the first negative direction X2. Specifically, the position of a first end portion 39A of the fifth wiring portion 39 lies on a surface of the via 38 that faces in the first negative direction X2. Therefore, the first end portion 39A of the fifth wiring portion 39 is connected to the via 38. The wiring width of the fifth wiring portion 39 is substantially constant except for at the first end portion 39A thereof. A second end portion 39B of the fifth wiring portion 39 is connected to an end portion of the eighteenth electrode portion 59 on the third positive direction Z1 side in a direction along the third axis Z. The fifth wiring portion 39 extends clockwise from the first end portion 39A to the second end portion 39B when the fifth wiring portion 39 is viewed in the first negative direction X2. The second end portion 39B of the fifth wiring portion 39 forms the second end of the inductor wiring 30. Furthermore, the fifth wiring portion 39 has rotational symmetry with the first wiring portion 31 with the axis of rotation being an axis in a direction along the third axis Z passing through the center in the direction of extension of the inductor wiring 30.

The parts of the ninth layer L9 other than the seventeenth electrode portion 49, the eighteenth electrode portion 59, and the fifth wiring portion 39 are constituted by the ninth insulating portion 29. The ninth insulating portion 29 consists of an insulator composed of the same material as the first insulating portion 21.

The element body 11 includes a first coating insulating layer 61 and a second coating insulating layer 62. The first coating insulating layer 61 has the same rectangular shape as the first layer L1 when the first coating insulating layer 61 is viewed in the first negative direction X2. The first coating insulating layer 61 is stacked on a main surface of the first layer L1 that faces in the first positive direction X1. The second coating insulating layer 62 has the same rectangular shape as the first layer L1 when the second coating insulating layer 62 is viewed in the first positive direction X1. The second coating insulating layer 62 is stacked on a main surface of the ninth layer L9 that faces in the first negative direction X2.

The first coating insulating layer 61 and the second coating insulating layer 62 are different colors from the first to ninth insulating portions 21 to 29. For example, the first coating insulating layer 61 and the second coating insulating layer 62 contain pigments such as blue and black. This makes it possible to determine the orientation of the inductor component 10 from the outer surfaces of the element body 11.

The first to ninth insulating portions 21 to 29, the first coating insulating layer 61, and the second coating insulating layer 62 described above are integrated with each other. Hereafter, when there is no need to distinguish between these components, the components are collectively referred to as an insulating portion 20.

In addition, the first wiring portion 31, the second wiring portion 33, the third wiring portion 35, the fourth wiring portion 37, the fifth wiring portion 39, the via 32, the via 34, the via 36, and the via 38 are integrated with each other. Hereafter, when there is no need to distinguish between these components, the components are collectively referred to as the inductor wiring 30. The inductor wiring 30 is wound in a spiral shape on the whole. A center axis around which the inductor wiring 30 is wound is an axis that extends in a direction along the first axis X.

In addition, the first electrode portion 41, the third electrode portion 42, the fifth electrode portion 43, the seventh electrode portion 44, the ninth electrode portion 45, the eleventh electrode portion 46, the thirteenth electrode portion 47, the fifteenth electrode portion 48, and the seventeenth electrode portion 49 described above are integrated with each other. Together these portions form the first electrode 40.

Similarly, the second electrode portion 51, the fourth electrode portion 52, the sixth electrode portion 53, the eighth electrode portion 54, the tenth electrode portion 55, the twelfth electrode portion 56, the fourteenth electrode portion 57, the sixteenth electrode portion 58, and the eighteenth electrode portion 59 described above are integrated with each other. Together these portions form the second electrode 50.

In this embodiment, the element body 11 of the inductor component 10 is formed of the insulating portion 20, the first electrode 40, and the second electrode 50. The inductor wiring 30 extends inside the element body 11. The inductor wiring 30, the first electrode 40, and the second electrode 50 may be integrated with each other. In other words, there does not have to be a physical boundary between the inductor wiring 30 and the first electrode 40.

The first to ninth layers L1 to L9, the first coating insulating layer 61, and the second coating insulating layer 62 are stacked on top of one another, and as a result, the element body 11 has an overall rectangular shape, as illustrated in FIG. 1. As illustrated in FIG. 3, the first electrode 40 is exposed to outside the element body 11 in a region spanning from the first end surface 11C to the bottom surface 11E. In addition, the second electrode 50 is exposed to outside the element body 11 in a region spanning from the second end surface 11D to the bottom surface 11E.

As illustrated in FIG. 1, the inductor component 10 includes a first coating electrode 71 and a second coating electrode 72. The first coating electrode 71 covers a surface of the first electrode 40 that is exposed to the outside from the element body 11. Although not illustrated, the first coating electrode 71 has a two-layer structure consisting of a nickel plating layer and a tin plating layer.

The second coating electrode 72 covers a surface of the second electrode 50 that is exposed to the outside from the element body 11. Although not illustrated, the second coating electrode 72 has a two-layer structure consisting of a nickel plating layer and a tin plating layer. Note that illustration of the first coating electrode 71 and the second coating electrode 72 is omitted from FIG. 2.

Height Dimension of First Electrode

As described above, the first wiring portion 31 extends parallel to a direction along the first main surface 11A from the first end of the inductor wiring 30. In addition, the via 32 extends from the first wiring portion 31 in a direction along the first axis X, which is a direction perpendicular to the first main surface 11A.

As illustrated in FIG. 4, the first layer L1, which is the layer where the first wiring portion 31 is present, is referred to as a first wiring layer LW1 in a direction along the first axis X. In addition, the second layer L2 in which the via 32 that extends from the first wiring portion 31 in a direction along the first axis X is present is referred to as a first via layer LV1. A dimension in a direction perpendicular to the bottom surface 11E is referred to as a height dimension.

The range of the first wiring layer LW1 in a direction along the first axis X is a range from the end of the first wiring portion 31 on the first positive direction X1 side to the end of the first wiring portion 31 on the first negative direction X2 side. In other words, the range of the first wiring layer LW1 in a direction along the first axis X matches the size of the dimension of the first wiring portion 31 in a direction along the first axis X. Similarly, the range of the first via layer LV1 in a direction along the first axis X is a range from the end of the first wiring portion 31 on the first negative direction X2 side to the end of the second wiring portion 33 on the first positive direction X1 side. In other words, the range of the first via layer LV1 in a direction along the first axis X is a range from the end of the via 32 on the first positive direction X1 side to the end of the via 32 on the first negative direction X2 side. Therefore, the range of the first via layer LV1 in a direction along the first axis X matches the size of the dimension of the via 32 in a direction along the first axis X.

The maximum height dimension of the first electrode 40 in the first wiring layer LW1 is referred to as a first wiring layer height WH1. In other words, the first wiring layer height WH1 is the dimension, in a direction along the third axis Z, of the part of the first electrode portion 41 in the first wiring layer LW1 that extends along the first end surface 11C. The maximum height dimension of the first electrode 40 in the first via layer LV1 is referred to as a first via layer height VH1. In other words, the first via layer height VH1 is the dimension, in a direction along the third axis Z, of the part of the third electrode portion 42 in the first via layer LV1 that extends along the first end surface 11C. The first wiring layer height WH1 is larger than the first via layer height VH1. The value obtained by dividing the first wiring layer height WH1 by the first via layer height VH1 is from 1.05 to 1.95. Specifically, the value obtained by dividing the first wiring layer height WH1 by the first via layer height VH1 is 1.8.

In addition, as illustrated in FIG. 2, the distance from the bottom surface 11E to the end of the via 32 on the third negative direction Z2 side in a direction along the third axis Z is referred to as a first via height D1. The first wiring layer height WH1 is larger than the first via height D1. Furthermore, as illustrated in FIG. 2, the first via layer height VH1 is smaller than the first via height D1.

As illustrated in FIG. 4, an axis that is parallel to the third axis Z and passes through the center of the first electrode 40 in a direction along the first axis X is referred to as a first symmetry axis AX1. The ninth layer L9, which is a layer located symmetrical to the first wiring layer LW1 with respect to the first symmetry axis AX1, is referred to as a first symmetrical layer LS1. In this case, the maximum height dimension of the first electrode 40 in the first symmetrical layer LS1 is referred to as a first symmetrical layer height SH1. Therefore, the first symmetrical layer height SH1 is the dimension, in a direction along the third axis Z, of the part of the seventeenth electrode portion 49 in the first symmetrical layer LS1 that extends along the first end surface 11C. The first symmetrical layer height SH1 is larger than the first via layer height VH1 and the first symmetrical layer height SH1 is identical to the first wiring layer height WH1. In other words, in this embodiment, the shape of the part of the first electrode 40 that is exposed to outside the element body 11 is a shape having linear symmetry with the first symmetry axis AX1 being the axis of symmetry.

As described above, the fifth wiring portion 39 extends parallel to a direction along the first main surface 11A from the second end of the inductor wiring 30. Furthermore, the via 38 extends from the fifth wiring portion 39 in a direction along the first axis X, which is a direction perpendicular to the first main surface 11A.

As illustrated in FIG. 2, the ninth layer L9, which is the layer where the fifth wiring portion 39 is present, is referred to as a second wiring layer LW2 in a direction along the first axis X. Furthermore, the eighth layer L8 in which the via 38 that extends from the fifth wiring portion 39 in a direction along the first axis X is present is referred to as a second via layer LV2.

The maximum height dimension of the first electrode 40 in the second wiring layer LW2 is the dimension, in a direction along the third axis Z, of the part of the seventeenth electrode portion 49 in the second wiring layer LW2 that extends along the first end surface 11C. In this embodiment, the maximum height dimension of the first electrode 40 in the second wiring layer LW2 matches the first symmetrical layer height SH1. The maximum height dimension of the first electrode 40 in the second wiring layer LW2 is larger than the first via layer height VH1.

Height Dimension of Second Electrode

The maximum height dimension of the second electrode 50 in the second wiring layer LW2 is referred to as a second wiring layer height WH2. In other words, the second wiring layer height WH2 is the dimension, in a direction along the third axis Z, of the part of the eighteenth electrode portion 59 in the second wiring layer LW2 that extends along the second end surface 11D. In addition, the maximum height dimension of the second electrode 50 in the second via layer LV2 is referred to as a second via layer height VH2. In other words, the second via layer height VH2 is the dimension, in a direction along the third axis Z, of the part of the sixteenth electrode portion 58 in the second via layer LV2 that extends along the second end surface 11D. The second wiring layer height WH2 is larger than the second via layer height VH2. The value obtained by dividing the second wiring layer height WH2 by the second via layer height VH2 is from 1.05 to 1.95. Specifically, the value obtained by dividing the second wiring layer height WH2 by the second via layer height VH2 is 1.8. In addition, regarding the second wiring layer height WH2, the distance from the bottom surface 11E to the end of the via 38 in the third negative direction Z2 in a direction along the third axis Z is referred to as a second via height D2. The second wiring layer height WH2 is larger than the second via height D2. Furthermore, the second via layer height VH2 is smaller than the second via height D2.

Here, an axis that is parallel to the third axis Z and passes through the center of the second electrode 50 in a direction along the first axis X is referred to as a second symmetry axis. The first layer L1, which is a layer located symmetrical to the second wiring layer LW2 with respect to the second symmetry axis, is referred to as a second symmetrical layer LS2. In this case, a second symmetrical layer height SH2, which is the height dimension of the second electrode 50 in the second symmetrical layer LS2, is larger than the second via layer height VH2. In addition, the second symmetrical layer height SH2 is equal to the second wiring layer height WH2. In other words, in this embodiment, the shape of the part of the second electrode 50 that is exposed to outside the element body 11 is a shape having linear symmetry with the second symmetry axis being the axis of symmetry.

An axis that is parallel to the third axis Z and passes through the center of the element body 11 when the element body 11 is viewed in the third negative direction Z2 is referred to as a rotational center axis. At this time, the first electrode 40 and the second electrode 50 have two-fold symmetrical shapes around the rotational center axis.

In addition, the maximum height dimension of the second electrode 50 in the first wiring layer LW1 is the dimension, in a direction along the third axis Z, of the part of the second electrode portion 51 in the first wiring layer LW1 that extends along the second end surface 11D. In this embodiment, the maximum height dimension of the second electrode 50 in the first wiring layer LW1 matches the second symmetrical layer height SH2. The maximum height dimension of the second electrode 50 in the first wiring layer LW1 is larger than the second via layer height VH2.

Height Dimensions of Coating Electrodes

When the inductor component 10 is viewed in the second negative direction Y2, the part of the first coating electrode 71 located in a range where the first wiring layer LW1 exists in a direction along the first axis X is referred to as a position corresponding to the first wiring layer LW1. In this case, the maximum height dimension of the first coating electrode 71 at the position corresponding to the first wiring layer LW1 is larger than the maximum height dimension of the first coating electrode 71 at a position corresponding to the first via layer LV1. Furthermore, the maximum height dimension of the first coating electrode 71 at the position corresponding to the first wiring layer LW1 is smaller than the maximum height dimension of the first end surface 11C of the element body 11.

When the inductor component 10 is viewed in the second positive direction Y1, the part of the second coating electrode 72 located in a range where the second wiring layer LW2 exists in a direction along the first axis X is referred to as a position corresponding to the second wiring layer LW2. In this case, it is larger than the maximum height dimension of the second coating electrode 72 at the position corresponding to the second wiring layer LW2. Furthermore, the maximum height dimension of the second coating electrode 72 at the position corresponding to the second wiring layer LW2 is smaller than the maximum height dimension of the second end surface 11D of the element body 11.

It is assumed that the first electrode portion 41 and the seventeenth electrode portion 49 have the same shape as the third electrode portion 42 and that the second electrode portion 51 and the eighteenth electrode portion 59 have the same shape as the fourth electrode portion 52. In other words, the first electrode 40 and the second electrode 50 are assumed to be shaped on the whole like a letter L obtained by bending a rectangular plate at a right angle. In this case, the height dimension of the first electrode 40 is the same regardless of the position in a direction along the first axis X. If the height dimension of the first electrode 40 is small, the area of the first electrode 40 exposed to outside the element body 11 is small. In this case, when the inductor component 10 is mounted on a substrate, the amount of solder adhered to the first electrode 40 may be small or solder may be adhered to the first electrode 40 in a localized manner. Consequently, the posture of the inductor component 10 with respect the substrate is unstable, and therefore the inductor component 10 may be mounted on the substrate in a tilted state. This would also be the case for the second electrode 50.

Effects of First Embodiment

The First Embodiment exhibits the following effects. Note that effects that are common to both the first electrode 40 and the second electrode 50 are described using the first electrode 40 as a representative example and description for the second electrode 50 is omitted.

(1-1) According to the First Embodiment, the first wiring layer height WH1 is larger than the first via layer height VH1. Therefore, for example, the area of the first electrode 40 exposed to outside the element body 11 is larger than in the case where the first wiring layer height WH1 is equal to the first via layer height VH1. Therefore, when the inductor component 10 is mounted on a substrate or the like, solder or the like spreads across the surface of the first electrode 40, and therefore the posture of the inductor component 10 with respect to the substrate is stabilized.

(1-2) According to the First Embodiment, the first via layer height VH1 is smaller than the first wiring layer height WH1. Therefore, for example, a stray capacitance generated between the first electrode 40 and the via 32 in the first via layer LV1 can be reduced compared to the case where the first via layer height VH1 is the same as the first wiring layer height WH1.

(1-3) According to the First Embodiment, the first via layer height VH1 is smaller than the first via height D1. Therefore, the first electrode 40 does not overlap the via 32 when the inductor component 10 is viewed in the second negative direction Y2. Therefore, a stray capacitance generated between the first electrode 40 and the via 32 can be reduced.

(1-4) According to the First Embodiment, the first symmetrical layer height SH1 is larger than the first via layer height VH1. In other words, the height dimension of the first electrode 40 in the first wiring layer LW1 and the height dimension of the first electrode 40 in the first symmetrical layer LS1, which are layers located symmetrical to each other, are both larger than the first via layer height VH1. In other words, there are parts where the first electrode 40 is exposed to outside the element body 11 across large areas at symmetrical positions across the first symmetry axis AX1. Therefore, the inductor component 10 can be firmly fixed to a substrate at parts on both sides of the first symmetry axis AX1.

(1-5) According to the First Embodiment, the first symmetrical layer height SH1 is equal to the first via layer height VH1. Therefore, the inductor component 10 is easily fixed to a substrate with the same degree of firmness at parts on both sides of the first symmetry axis AX1. In addition, due to the height dimension of the first electrode 40 being identical in the parts on both sides of the first symmetry axis AX1 in this way, the amounts of solder on the first positive direction X1 side and the first negative direction X2 side become uniform and this contributes to stabilizing the posture of the inductor component 10.

(1-6) According to the First Embodiment, a value obtained by dividing the first wiring layer height WH1 by the first via layer height VH1 is from 1.05 to 1.95. The first wiring layer height WH1 is at least 5% larger than the first via layer height VH1, and therefore a larger area of the first electrode 40 exposed to outside the element body 11 in the first wiring layer LW1 can be secured. Furthermore, since the first wiring layer height WH1 is not more than 95% larger than the first via layer height VH1, the area of the first electrode 40 in the first via layer LV1 exposed to outside the element body 11 does not have to be excessively reduced.

(1-7) According to the First Embodiment, the first electrode 40 and the second electrode 50 have shapes having two-fold symmetry around a rotational center axis that is parallel to the third axis Z and passes through the center of the element body 11 when the element body 11 is viewed in the third negative direction Z2. Therefore, when mounting the inductor component 10 on a substrate, it is possible to suppress tilting of the posture of the inductor component 10 between the first electrode 40 side and the second electrode 50 side when looking along the rotational center axis.

(1-8) According to the First Embodiment, the maximum height dimension of the first electrode 40 in the second wiring layer LW2 is larger than the first via layer height VH1. In other words, the maximum height dimension of the first electrode 40 in the first wiring layer LW1 and the maximum height dimension of the first electrode 40 in the second wiring layer LW2, which are the layers at positions at both ends in a direction along the first axis X, are both larger than the first via layer height VH1. There are large parts of the first electrode 40 that are exposed to outside the element body 11 on both sides of the first via layer LV1. Therefore, the inductor component 10 can be firmly fixed to a substrate at parts on both sides of the first symmetry axis AX1.

(1-9) According to the First Embodiment, the maximum height dimension of the first coating electrode 71 at the position corresponding to the first wiring layer LW1 is larger than the maximum height dimension of the first coating electrode 71 at the position corresponding to the first via layer LV1. Therefore, the posture of the inductor component 10 with respect to the substrate is stable when the inductor component 10 is mounted on a substrate or the like even when the first coating electrode 71 covers the first electrode 40.

(1-10) According to the First Embodiment, the maximum height dimension of the first coating electrode 71 at the position corresponding to the first wiring layer LW1 is smaller than the maximum height dimension of the first end surface 11C of the element body 11. Therefore, the first coating electrode 71 does not reach the top surface 11F. Therefore, in the inductor component 10, electrical leakage from the first coating electrode 71 to the top surface 11F can be prevented. For example, in the case where the inductor component 10 is mounted on a substrate or the like, a short circuit with a component disposed on the top surface 11F side of the inductor component 10 can be prevented.

Second Embodiment

Hereafter, an inductor component of a Second Embodiment will be described while referring to the drawings. In an inductor component 110 of the Second Embodiment, the shape of the part of the first electrode 40 that is exposed to outside the element body 11 is different from that in the inductor component 10 of the First Embodiment. Hereafter, the description will focus on points that are different from in the inductor component 10 of the First Embodiment, and description of points that are the same will be simplified or omitted.

As illustrated in FIG. 5, in the inductor wiring 30 of the inductor component 110, the position of the first wiring layer LW1 in a direction along the first axis X is different from in the First Embodiment. More specifically, compared to the inductor wiring 30 in the First Embodiment, the first wiring layer LW1 is located nearer the center in a direction along the first axis X. Similarly, in the inductor wiring 30 of the inductor component 110, the position of the first symmetrical layer LS1 in a direction along the first axis X is different from that in the First Embodiment. More specifically, compared to the inductor wiring 30 in the First Embodiment, the first symmetrical layer LS1 is located nearer the center in a direction along the first axis X. Although not illustrated, the inductor wiring 30 of the Second Embodiment has a smaller number of wound turns than the inductor wiring 30 of the First Embodiment. Therefore, the positions of the first wiring layer LW1 and the first symmetrical layer LS1 are closer to the center in a direction along the first axis X compared to the First Embodiment.

The end of the first electrode 40 on the first main surface 11A side in a direction along the first axis X is located towards the first main surface 11A side looking from the first wiring layer LW1. In addition, the end of the first electrode 40 on the second main surface 11B side in a direction along the first axis X is located towards the second main surface 11B side looking from the first symmetrical layer LS1. In other words, the dimension of the first electrode 40 in a direction along the first axis X is larger than the distance from the end of the first wiring layer LW1 on the first main surface 11A side to the end of the first symmetrical layer LS1 on the second main surface 11B side. The second electrode 50 is configured in the same way as the first electrode 40.

Effects of Second Embodiment

In addition to the effects (1-1) to (1-10) of the First Embodiment, the Second Embodiment exhibits the following effect.

(2-1) According to the Second Embodiment, the dimension of the first electrode 40 in a direction along the first axis X can be increased compared to the case where the end of the first electrode 40 on the first main surface 11A side is aligned with the end of the first wiring layer LW