and includes a plurality of sub-electrode layers 30 which are respectively disposed in the plurality of sub-pixel regions 20 in a one-to-one correspondence way, that is, the first electrode layer 32 is not continuous at the positions where the adjacent sub-pixels are connected, so that the OLED device layer 3 may enable the display module 100 to be used in a Micro OLED display. Thus, the problem of light leakage and crosstalk between adjacent sub-pixels is solved by disposing the blocking layer 7.

In some embodiments of the present disclosure, the blocking layer 7 may be a metal layer, that is, a layer made of a metal material, so as to simply and effectively satisfy a requirement of ultra-high resolution, meet a requirement of ultra-high PPI of the Micro OLED display, reduce an adverse effect on an aperture ratio of pixels, and meet a display brightness requirement; moreover, by taking use of the characteristic of low transmittance of the metal, light is shielded at a position corresponding to a portion where two adjacent sub-filter regions 40 are connected, so as to avoid the problem of light leakage and crosstalk caused by light emission of the adjacent sub-pixels. Apparently, the blocking layer 7 according to the embodiments of the present disclosure is not limited to being applied to the Micro OLED display, for example, in some other embodiments of the present disclosure, the organic light emitting layer 31 may also be disconnected or discontinuous, for example, the organic light emitting layer 31 is disconnected or discontinuous at the positions where the adjacent sub-pixels are connected, which will not be described in detail here. In some embodiments of the present disclosure, the organic light emitting layer 31 may include one or more light emitting unit layers, and the light emitting unit layers include a hole injection layer, a hole transport layer, an emission layer, an electron transport layer and an electron injection layer, which are sequentially stacked along a direction away from the drive substrate 1.

In some embodiments of the present disclosure, as shown in FIG. 1, the second electrode layer 33 is provided with second recesses 331 recessed toward the drive substrate 1, and each second recess 331 is arranged to face portions of two adjacent sub-filter regions 40 at which the adjacent sub-filter regions 40 are connected to each other, along the thickness direction of the drive substrate 1. That is to say, the second electrode layer 33 is provided with the second recesses 331 each at a position corresponding to spliced positions of two adjacent sub-electrode layers 30, so that the problem of light leakage and crosstalk between adjacent sub-pixels can be effectively improved, and the possibility of the intrusion by water and oxygen from the spliced positions of the adjacent sub-pixels can be reduced, so as to prevent the drive substrate 1 from being in contact with water and oxygen, thereby further improving the reliability and the display effect of the display module 100.

Further, as shown in FIG. 1, when the second electrode layer 33 is provided with the second recesses 331, the light shielding regions 702 are provided with the first recesses 7021 recessed toward the drive substrate 1, and each first recess 7021 is disposed to face portions of the two adjacent sub-filter regions 40 at which the adjacent sub-filter regions 40 are connected to each other, along the thickness direction of the drive substrate 1, the problem of light leakage and crosstalk between adjacent sub-pixels can be further alleviated by disposing the first recesses 7021 and the second recesses 331, and the possibility of the intrusion by water and oxygen from the spliced positions of the adjacent sub-pixels can be better reduced, so as to prevent the drive substrate 1 from being in contact with water and oxygen, thereby further improving the reliability and the display effect of the display module 100.

Moreover, as shown in FIG. 1, in some embodiments, on the cross section perpendicular to the drive substrate 1, a width of each first recess 7021 (a width of the first recess 7021 along a left-right direction shown in FIG. 1, or the length of the connecting line between the two ends of the first recess 7021) is less than a width of each second recess 331 (a width of the second recess 331 along the left-right direction shown in FIG. 1, or a length of a connecting line between the two ends of the second recess 331). Thus, an adverse effect of the light shielding regions 702 on the aperture ratio of the pixels can be reduced, and the aperture ratio of the pixels can be ensured to be large enough to meet the display brightness requirement.

In the embodiments of the present disclosure, a specific location of the blocking layer 7 is not limited, and can be specifically selected according to actual requirements. For example, some specific embodiments will be given below, but the present disclosure is not limited thereto.

In some embodiments, as shown in FIG. 1, the blocking layer 7 is disposed on a side of the color filter layer 4 away from the OLED device layer 3. That is, at least one blocking layer 7 is disposed on the side of the color filter layer 4 away from the OLED device layer 3. Thus, it is easy to process, and the problem of light leakage and crosstalk between adjacent sub-pixels can be effectively improved.

In an example illustrated by FIG. 1, a first blocking layer 71 is disposed on the side of the color filter layer 4 away from the OLED device layer 3, the first blocking layer 71 is directly disposed on the color filter layer 4, and the light shielding regions 702 of the first blocking layer 71 are located on a portion where every two adjacent sub-filter regions 40 are connected, which facilitates processing.

In some embodiments, as shown in FIG. 3, the display module 100 further includes: a packaging layer 5, which is at least a single layer and includes an inner packaging layer 5A disposed between the OLED device layer 3 and the color filter layer 4 and/or an outer packaging layer 5B disposed on the side of the color filter layer 4 away from the OLED device layer 3. That is, the display module 100 includes: at least one inner packaging layer 5A and/or at least one outer packaging layer 5B, the inner packaging layer 5A is disposed between the OLED device layer 3 and the color filter layer 4, the outer packaging layer 5B is disposed on the side of the color filter layer 4 away from OLED device layer 3, and the blocking layer 7 is disposed on a side of at least one packaging layer 5 away from the OLED device layer 3. For example, each of a second blocking layer 72, a third blocking layer 73, and a fourth blocking layer 74, which are described below, is disposed on a side of at least one packaging layer 5 away from the OLED device layer 3. Thus, it is easy to process, a packaging effect can be ensured, and the problem of light leakage and crosstalk between adjacent sub-pixels can be effectively improved. The packaging layer 5 may be a Thin-Film Encapsulation (TFE) layer.

In some embodiments, as shown in FIG. 3, at least one packaging layer 5 is provided with third recesses 50 recessed toward the drive substrate 1, and each third recess 50 is disposed to face portions of two adjacent sub-filter regions 40 at which the two adjacent sub-filter regions 40 are connected to each other, along the thickness direction of the drive substrate 1. Thus, the problem of light leakage and crosstalk between adjacent sub-pixels can be further alleviated, and the possibility of the intrusion by water and oxygen from the spliced positions of the adjacent sub-pixels can be better reduced, so as to prevent the drive substrate 1 from being in contact with water and oxygen, thereby further improving the reliability and the display effect of the display module 100.

According to some embodiments of the present disclosure, as shown in FIG. 3, the display module 100 includes the inner packaging layer 5A and a planarization (PLN) layer 6, the inner packaging layer 5A is at least a single layer and is disposed between the OLED device layer 3 and the color filter layer 4, the planarization layer 6 is disposed between the inner packaging layer 5A and the color filter layer 4 (as shown in FIG. 3), the blocking layer 7 (e.g., the second blocking layer 72 described below) is disposed between the planarization layer 6 and the color filter layer 4, and/or the blocking layers 7 (e.g., the third blocking layer 73 and the fourth blocking layer 74 described below) are disposed between at least one inner packaging layer 5A and the planarization layer 6. Thus, it is easy to process, and the problem of light leakage and crosstalk between adjacent sub-pixels can be effectively improved.

In the examples illustrated by FIG. 3 and FIG. 4, the second blocking layer 72 is disposed on a side of the planarization layer 6 away from the OLED device layer 3, the second blocking layer 72 is directly disposed on the planarization layer 6, and the light shielding regions 702 of the second blocking layer 72 are located under a portion where every two adjacent sub-filter regions 40 are connected, which facilitates the processing.

In an example illustrated by FIG. 5, the packaging layer 5 is multi-layered and includes a first packaging layer 51, and a second packaging layer 52 disposed on a side of the first packaging layer 51 away from the OLED device layer 3. In some specific examples, the first packaging layer 51 and the second packaging layer 52 may be an organic TFE layer and an inorganic TFE layer, respectively. For example, in some other embodiments, the packaging layer 5 may further include a third packaging layer 53 disposed between the first packaging layer 51 and the second packaging layer 52, in which case both the first packaging layer 51 and the second packaging layer 52 may be inorganic TFE layers and the third packaging layer 53 may be an organic TFE layer. However, the present disclosure is not limited thereto.

In the example illustrated by FIG. 5, the third blocking layer 73 is disposed between the second packaging layer 52 and the planarization layer 6, the third blocking layer 73 is directly disposed on the second packaging layer 52, and the light shielding regions 702 of the third blocking layer 73 are located under a portion where every two adjacent sub-filter regions 40 are connected, which facilitates the processing and can effectively improve the problem of light leakage and crosstalk between adjacent sub-pixels; moreover, when the second packaging layer 52 is the inorganic TFE layer, a stable location of the third blocking layer 73 and a reliable blocking effect can be ensured.

In an example illustrated by FIG. 6, the fourth blocking layer 74 is disposed between the first packaging layer 51 and the planarization layer 6, the fourth blocking layer 74 is directly disposed on the first packaging layer 51, and the light shielding regions 702 of the fourth blocking layer 74 are located under a portion where every two adjacent sub-filter regions 40 are connected, which facilitates the processing and can effectively improve the problem of light leakage and crosstalk between adjacent sub-pixels; moreover, when the first packaging layer 51 is the inorganic TFE layer, a stable location of the fourth blocking layer 74 and the reliable blocking effect can be ensured.

The display module 100 according to the embodiments of the present disclosure may include more than one (any two or more) of the blocking layers 7 described above at the same time. Thus, when the plurality of blocking layers 7 are provided, the problem of light leakage and crosstalk between adjacent sub-pixels can be improved more reliably and effectively. In addition, it should be understood that, when only one blocking layer 7 is provided, processing procedures can be simplified, and a relatively small overall thickness of the display module 100 can be ensured.

For example, the display module 100 according to some embodiments of the present disclosure includes a plurality of inner packaging layers 5A, which include the first packaging layer 51, the second packaging layer 52, and the third packaging layer 53, the second packaging layer 52 is disposed on a side of the first packaging layer 51 away from the OLED device layer 3, the third packaging layer 53 is disposed between the first packaging layer 51 and the second packaging layer 52, a packaging layer 5 (e.g., the fourth blocking layer 74 shown in FIG. 6) is disposed between the first packaging layer 51 and the third packaging layer 53 and/or a packaging layer 5 (e.g., the third blocking layer 73 shown in FIG. 5) is disposed on a side of the second packaging layer 52 away from the first packaging layer 51. Thus, it is easy to process, and the problem of light leakage and crosstalk between adjacent sub-pixels can be effectively solved; moreover, when the first packaging layer 51 and the second packaging layer 52 are the inorganic TFE layers, stable locations of the blocking layers 7 and the reliable blocking effect can be ensured.

In a specific example illustrated by FIG. 7, the display module 100 further includes: the packaging layer 5 and the planarization layer 6, the packaging layer 5 is disposed on a side of the OLED device layer 3 away from the drive substrate 1, the planarization layer 6 is disposed between the packaging layer 5 and the color filter layer 4, the packaging layer 5 is multi-layered and includes the first packaging layer 51, the second packaging layer 52 and the third packaging layer 53, the second packaging layer 52 is disposed on a side of the first packaging layer 51 away from the OLED device layer