>FIG. 3, dielectric layer 130 is patterned to form trenches therein, such as a trench 138A, a trench 138B, and a trench 138C. In some embodiments, trenches 138A-138C expose dielectric layer 125. In some embodiments, dielectric layer 130 can be patterned using a suitable combination of photolithography processes (e.g., photoresist deposition, exposure, and development) to form a first etch mask, a first etching process(es) using the first etch mask to pattern hard mask layer 135, thereby forming a second etch mask (e.g., patterned hard mask layer 135′), and a second etching process(es) using the second etch mask to pattern dielectric layer 130 (i.e., form trenches 138A-138C in dielectric layer 130). The first etching process and/or the second etching process can be a dry etch, a wet etch, or combinations thereof.

Turing to FIG. 4, a lower contact 140A, a lower contact 140B, and a lower contact 140C are formed in trench 138A, trench 138B, and trench 138C, respectively, of dielectric layer 130. Although lower contacts 140A-140C are disposed below upper contacts (discussed below), lower contacts 140A-140C are sometimes referred to as top metal (TM) contacts because they represent a top metal layer of an MLI structure. Lower contact 140A includes a plug 142A, lower contact 140B includes a plug 142B, and lower contact 140C includes a plug 142C. In some embodiments, lower contact 140A includes a liner 144A, lower contact 140B includes a liner 144B, and lower contact 140C includes a liner 144C. Plugs 142A-142C can also be referred to as fill layers, bulk layers, etc. Liners 144A-144C can also be referred to as barrier layers. Plugs 142A-142C and liners 144A-144C include electrically conductive material, such as aluminum, copper, titanium, tantalum, tungsten, ruthenium, molybdenum, cobalt, iridium, palladium, platinum, nickel, tin, gold, silver, other suitable metals, alloys thereof (e.g., TiN, TaN, TaC, TaCN, TiAl, TiAlN, etc.), silicides thereof (e.g., NiSi, CoSi, CuSi, TaSiN, etc.), or combinations thereof. In some embodiments, plugs 142A-142C are copper plugs. In some embodiments, liners 144A-144C include TiN, Ta, TaN, or combinations thereof.

In some embodiments, forming lower contacts 140A-140C includes forming a barrier layer over dielectric layer 130 that partially fills trenches 138A-138C, forming a metal fill layer over the barrier layer that fills remainders of trenches 138A-138C, and performing a planarization process that removes the barrier layer and the metal fill layer from a top surface of dielectric layer 130, such that remainders of the barrier layer and the metal fill layer form liners 144A-144C and plugs 142A-142C, respectively. The planarization process can be a chemical mechanical planarization (CMP) process. The barrier layer and/or the metal fill layer can be deposited by ALD, CVD, PVD, other deposition process (e.g., plating), or combinations thereof. The barrier layer and/or the metal fill layer may include multiple layers. In some embodiments, the barrier layer has a thickness of about 0.5 nm to about 20 nm. In some embodiments, the metal fill layer has a thickness of about 80 nm to about 2,000 nm. In some embodiments, lower contacts 140A-140C have a thickness of about 750 nm to about 950 nm.

Turning to FIG. 5, a passivation layer 150 is formed over lower contacts 140A-140C. Passivation layer 150 may include multiple layers, such as a dielectric layer 152 and a dielectric layer 154. For example, dielectric layer 152 is formed over lower contacts 140A-140C and dielectric layer 154 is formed over dielectric layer 152. In some embodiments, dielectric layer 152 includes a nitrogen-containing material and/or a carbon-containing material, and dielectric layer 154 includes a silicon-and-oxygen containing material. For example, dielectric layer 152 is a silicon nitride layer, and dielectric layer 154 is a USG layer and/or a PEOX-USG layer. Dielectric layer 152 can be deposited by CVD, ALD, PVD, other deposition process, or combinations thereof. Dielectric layer 154 can be deposited by PECVD, HDP-CVD, SACVD, ALD, PVD, other deposition process, or combinations thereof. In some embodiments, dielectric layer 152 may prevent and/or inhibit oxidation of lower contacts 140A-140C. In some embodiments, dielectric layer 152 has a thickness of about 65 nm to about 85 nm. In some embodiments, dielectric layer 154 has a thickness of about 150 nm to about 350 nm.

Turning to FIGS. 6-12, a metal-insulator-metal (MIM) capacitor structure, such as a MIM structure 160, is formed over device substrate 102. As discussed below, fabricating MIM structure 160 involves multiple processes, such as deposition and patterning of various conductor layers (e.g., a bottom conductor plate, a middle conductor plate, and a top conductor plate), as well as forming insulators between adjacent conductor plates. Thus, as shown in FIG. 12, in some embodiments, MIM structure 160 includes multiple metal layers, such as a conductor layer 162, a conductor layer 166, a conductor layer 170 (including, for example, a conductor layer 170A and a conductor layer 170B), and a conductor layer 174 (including, for example, a conductor layer 174A and a conductor layer 174B), which function as metal plates of capacitors. MIM structure 160 also includes multiple insulator layers, such as an insulator layer 164, an insulator layer 168, and an insulator layer 172. Insulator layer 164 is between conductor layer 162 and conductor layer 166 and between conductor layer 162 and conductor layer 170B. Insulator layer 168 is between conductor layer 166 and conductor layer 170A, between conductor layer 166 and conductor layer 170B, and between conductor layer 162 and conductor layer 170B. Insulator layer 172 is between conductor layer 170A and conductor layer 174A and between conductor layer 170B and conductor layer 174B.

MIM structure 160 thus has four conductor layers (electrodes), which can be referred to as a first conductor layer (MIM1) (i.e., conductor layer 162), a second conductor layer (MIM2) (i.e., conductor layer 166), a third conductor layer (MIM3) (i.e., conductor layer 170), and a fourth conductor layer (MIM4) (i.e., conductor layer 174). By way of example, the MIM structure 160 may be used to implement one or more capacitors, which may be connected to other microelectronic components (e.g., including active devices and/or passive devices, described above). For example, a capacitor can be provided by conductor layer 162, conductor layer 166, and conductor layer 170B, where conductor layer 162 is a CBM, conductor layer 166 is a CMM, and conductor layer 170B is a CTM of the capacitor. In another example, a capacitor can be provided by conductor layer 166, conductor layer 170B, and conductor layer 174A, where conductor layer 166 is a CBM, conductor layer 170B is a CMM, and conductor layer 174A is a CTM of the capacitor. In addition, and in some embodiments, MIM structure 160 allows capacitors to be closely packed together in both vertical directions and lateral directions, thereby reducing an amount of lateral space needed for implementing capacitors. As a result, MIM structure 160 may accommodate super high-density capacitors.

Turning to FIG. 6, patterned conductor layer 162 is formed over dielectric layer 154, for example, by depositing and patterning an electrically conductive material over dielectric layer 154. The patterning can include a photolithography process (e.g., forming a patterned etch mask over the electrically conductive material) and an etching process (e.g., etching the electrically conductive material using the patterned etch mask). In some embodiments, conductor layer 162 is a metal nitride layer, such as a TiN layer. Conductor layer 162 may undergo a surface treatment, such as sidewall passivation using a nitrous oxide (N₂O) gas. In some embodiments, conductor layer 162 has a thickness of about 35 nm to about 45 nm.

Turning to FIGS. 7-12, insulator layer 164 is formed over conductor layer 162 (FIG. 7), patterned conductor layer 166 is formed over insulator layer 164 (FIG. 8), insulator layer 168 is formed over conductor layer 166 (FIG. 9), patterned conductor layer 170 is formed over insulator layer 168 (FIG. 10), insulator layer 172 is formed over conductor layer 170 (FIG. 11), and patterned conductor layer 174 is formed over insulator layer 172 (FIG. 12). Conductor layer 166, conductor layer 170, and conductor layer 174 can be formed in a manner similar to that used to form conductor layer 162, but patterns of conductor layer 166, conductor layer 170, and conductor layer 174 can be different from a pattern of conductor layer 166 and/or different from one another, such as depicted. In some embodiments, conductor layer 166, conductor layer 170, and conductor layer 174 are metal nitride layers, such as TiN layers. In some embodiments, conductor layer 166, conductor layer 170, and conductor layer 174 have a thickness of about 35 nm to about 45 nm. In the depicted embodiment, conductor layer 162, conductor layer 166, conductor layer 170, and conductor layer 174 have different patterns but are formed from the same materials and have the same thicknesses. In some embodiments, conductor layer 162, conductor layer 166, conductor layer 170, conductor layer 174, or combinations thereof are formed from different materials and/or have different thicknesses. In some embodiments, conductor layer 162, conductor layer 166, conductor layer 170, conductor layer 174, or combinations thereof include any suitable electrically conductive material.

Insulator layer 164, insulator layer 168, insulator layer 172, or combinations thereof can be deposited by ALD, CVD, PVD, other deposition process, or combinations thereof. In some embodiments, insulator layer 164 is conformally deposited and has a generally uniform thickness (e.g., insulator layer 164 has about the same thickness on top and sidewall surfaces of conductor layer 162). In some embodiments, insulator layer 168 is conformally deposited and has a generally uniform thickness (e.g., insulator layer 168 has about the same thickness on top and sidewall surfaces of conductor layer 166). In some embodiments, insulator layer 172 is conformally deposited and has a generally uniform thickness (e.g., insulator layer 172 has about the same thickness on top and sidewall surfaces of conductor layer 170).

In some embodiments, insulator layer 164, insulator layer 168, insulator layer 172, or combinations thereof include high-k dielectric material(s) having a dielectric constant (k-value) greater than that of silicon oxide. In some embodiments, insulator layer 164, insulator layer 168, insulator layer 172, or combinations thereof has a tri-layer structure including, from bottom to top, a first zirconium oxide (e.g., ZrO₂) layer, an aluminum oxide (Al₂O₃) layer, and a second zirconium oxide (ZrO₂) layer. In such embodiments, insulator layer 164, insulator layer 168, insulator layer 172, or combinations thereof may be referred to as a ZAZ layer. In such embodiments, each of layer of the ZAZ layer may have a thickness of about 1.5 nm to about 2.5 nm. In some embodiments, insulator layer 164, insulator layer 168, insulator layer 172, or combinations thereof may be relatively thin to increase capacitance values, while maintaining sufficient thickness to avoid potential dielectric breakdown of capacitors in MIM structure 160 (e.g., when two capacitor plates have high potential difference, current may leak between the plates, causing breakdown). In some embodiments, insulator layer 164, insulator layer 168, insulator layer 172, or combinations thereof has a thickness of about 5 nm to about 7 nm.

Turning to FIG. 13, a passivation layer 175 is formed over MIM structure 160. In some embodiments, passivation layer 175 includes a silicon-and-oxygen containing material. For example, passivation layer 175 is a USG layer and/or a PEOX-USG layer. Passivation layer 175 can be deposited by PECVD, HDP-CVD, SACVD, ALD, PVD, other deposition process, or combinations thereof. In some embodiments, a planarization process (e.g., CMP) and/or an etching process is performed on passivation layer 175, for example, to reduce its thickness. In some embodiments, passivation layer 175 has a thickness of about 450 nm to about 650 nm. In some embodiments, passivation layer 175 includes multiple layers.

Turning to FIG. 14, contact openings are formed to expose lower contacts 140A-140C, such as a contact opening 184A, a contact opening 184B, and a contact opening 184C, respectively. Contact opening 184A extends through, from top to bottom, passivation layer 175, insulator layer 172, insulator layer 168, insulator layer 164, and passivation layer 150 (e.g., dielectric layer 154 and dielectric layer 152) to expose a top surface of lower contact 140A. Contact opening 184B extends through, from top to bottom, passivation layer 175, a portion of MIM structure 160 (including, for example, conductor layer 174A, insulator layer 172, conductor layer 170A, insulator layer 168, conductor layer 166, and insulator layer 164), and passivation layer 150 to expose a top surface of lower contact 140B. Contact opening 184C extends through, from top to bottom, passivation layer 175, a portion of MIM structure 160 (including, for example, conductor layer 174B, insulator layer 172, conductor layer 170B, insulator layer 168, insulator layer 164, and conductor layer 162), and passivation layer 150 to expose a top surface of lower contact 140C. Contact openings 184A-184C may expose sidewalls of the various layers through which contact openings 184A-184C respectively extend.

In some embodiments, forming contact openings 184A-184C includes forming a patterned etch mask over passivation layer 175 (e.g., by a photolithography process) and etching passivation layer 175, conductor layer 174A, conductor layer 174B, insulator layer 172, conductor layer 170A, conductor layer 170B, insulator layer 168, conductor layer 166, insulator layer 164, conductor layer 162, and passivation layer 150. The etching is a dry etch, a wet etch, other suitable etch, or combinations thereof. The etching may be a multistep process. For example, the etching may alternate etchants when etching conductor layers and insulator layers. In some embodiments, patterns of conductor layers are configured to ensure that contact openings 184A-184C pass through a same number of conductor layers, which can improve uniformity during the etching. For example, in FIG. 14, contact opening 184B and contact opening 184C extend through three conductor layers. Contact opening 184B passes through conductor layer 174A, conductor layer 170A, and conductor layer 166 (i.e., through MIM 4, MIM3, and MIM2). Contact opening 184C passes through conductor layer 174B, conductor layer 170B, and conductor layer 162 (i.e., through MIM 4, MIM3, and MIM1).

Turning to FIG. 15, upper contacts are formed in and over contact openings 184A-184C, such as an upper contact 190A, an upper contact 190B, and an upper contact 190C, respectively. Upper contacts 190A-190C may be referred to as contact vias, metal vias, metal lines, or combinations thereof. In some embodiments, upper contacts 190A-190C may be referred to as contact pads. Upper contact 190A includes a plug 192A, lower contact 190B includes a plug 192B, and lower contact 190C includes a plug 192C. In some embodiments, upper contact 190A includes a liner 194A, upper contact 190B includes a liner 194B, and upper contact 190C includes a liner 194C. Plugs 192A-192C can also be referred to as fill layers, bulk layers, etc. Liners 194A-194C can also be referred to as barrier layers and/or seed layers. Plugs 192A-192C and liners 194A-194C include electrically conductive material, such as aluminum, copper, titanium, tantalum, tungsten, ruthenium, molybdenum, cobalt, iridium, palladium, platinum, nickel, tin, gold, silver, other suitable metals, alloys thereof (e.g., TiN, TaN, TaC, TaCN, TiAl, TiAlN, etc.), silicides thereof (e.g., NiSi, CoSi, CuSi, TaSiN, etc.), or combinations thereof. In some embodiments, plugs 192A-192C are AlCu plugs. In some embodiments, liners 194A-194C are seed layers that include materials configured for AlCu plugs.

In some embodiments, forming upper contacts 190A-190C includes forming a barrier layer over passivation layer 175 that partially fills contact openings 184A-184C, forming a metal fill layer over the barrier layer that fills remainders of contact openings 184A-184C, and patterning the metal fill layer and the barrier layer to form liners 194A-194C and plugs 192A-192C, respectively. The patterning can include forming a patterned mask layer (e.g., forming a patterned SiON layer over the metal fill layer using a photolithography process and an etching process) and etching the metal fill layer and the barrier layer using the patterned mask layer as an etch mask. The metal fill layer and the barrier layer are patterned to provide plugs 192A-192C and liners 194A-194C with upper portions that extend from contact openings 184A-184C and over a top surface of passivation layer 175. The barrier layer and/or the metal fill layer can be deposited by ALD, CVD, PVD, other deposition process (e.g., plating), or combinations thereof. The barrier layer and/or the metal fill layer may include multiple layers. In some embodiments, a thickness of plugs 192A-192C is about 1,000 nm to about 3,000 nm.

Upper contacts 190A-190C provide electrical contact to lower contacts 140A-140C, respectively. In addition, and as shown in the depicted embodiment, upper contact 190B is electrically coupled to conductor layer 174A, conductor layer 170A, and conductor layer 166, while being electrically isolated from conductor layer 174B, conductor layer 170B, and conductor layer 162. Further, upper contact 190C is electrically coupled to conductor layer 174B, conductor layer 170B, and conductor layer 162, while being electrically isolated from conductor layer 174A, conductor layer 170A, and conductor layer 166. Thus, upper contact 190B provides electrical contact to a first terminal of MIM structure 160, and upper contact 190C provides electrical contact to a second terminal of MIM structure 160. In some embodiments, upper contacts 190A-190C are part of a redistribution layer (RDL) that includes various metal lines for redistributing bonding pads to different locations, such as from peripheral locations to locations uniformly distributed on a chip surface. Upper contacts 190A-190C may thus be referred to as redistribution vias. In some embodiments, the RDL may couple the multi-layer interconnect (MLI) structure to the bonding pads for connection to external circuitry.

Turning to FIG. 16, a passivation layer 200 is formed over upper contacts 190A-190C and passivation layer 175. Passivation layer 200 may include multiple layers, such as a dielectric layer 205 and a dielectric layer 210. For example, dielectric layer 205 is formed over upper portions of upper contacts 190A-190C and passivation layer 175, and dielectric layer 210 is formed over dielectric layer 205. In some embodiments, dielectric layer 205 includes a silicon-and-oxygen containing material, and dielectric layer 210 includes a nitrogen-containing material and/or a carbon-containing material. For example, dielectric layer 205 is a USG layer and/or a PEOX-USG layer, and dielectric layer 210 is a silicon nitride layer and/or a plasma-enhanced (PE) silicon nitride layer. Dielectric layer 205 can be deposited by PECVD, HDP-CVD, SACVD, ALD, PVD, other deposition process, or combinations thereof. Dielectric layer 210 can be deposited by CVD, ALD, PVD, other deposition process, or combinations thereof.

Turning to FIG. 17, openings (trenches) are formed in passivation layer 200 that expose upper contacts 190A-190C, such as an opening 212A, an opening 212B, and an opening 212C, respectively. Openings 212A-212C extend through, from top to bottom, dielectric layer 210 and dielectric layer 205 to expose top surfaces of upper contacts 190A-190C, respectively. In some embodiments, forming openings 212A-212C includes forming a patterned etch mask over passivation layer 200 (e.g., by a photolithography process) and etching dielectric layer 210 and/or dielectric layer 205 using the patterned etch mask. The etching may include a dry etch, a wet etch, other suitable etch, or combinations thereof. In some embodiments, dielectric layer 205 may be etched using patterned dielectric layer 210 as an etch mask. The etching may be a multistep process. In some embodiments, openings 212A-212C may expose sidewalls of the various layers through which openings 212A-212C extend.

Turning to FIG. 18, in some embodiments, a patterned polyimide (PI) layer 215 is formed over passivation layer 200. In some embodiments, forming PI layer 215 includes depositing a polymide material over passivation layer 200 that partially fills openings 212A-212C and patterning the polymide material, for example, to expose top surfaces of upper contacts 190A-190C. In some embodiments, the polymide material is conformally deposited by spin-coating and/or other suitable deposition process. In some embodiments, a baking process is performed after deposition the polymide material. In some embodiments, the patterning includes forming a patterned mask layer over the polymide material (e.g., by a photolithography process) and etching the polymide material using the patterned mask layer as an etch mask. In some embodiments, PI layer 215 includes a photosensitive chemical, such that PI layer 215 can be directly patterned by a photolithography process, without a subsequent etch process.

In some embodiments, a bumping process is performed to form under-bump metallization (UBM), metal pillars (or metal bumps), and solder bumps. For example, a UBM 220A, a copper (Cu) pillar 225A, and a solder bump 230A are formed over PI layer 215 and upper contact 190A; a UBM 220B, a Cu pillar 225B, and a solder bump 230B are formed over PI layer 215 and upper contact 190B; and a UBM 220C, a Cu pillar 225C, and a solder bump 230C are formed over PI layer 215 and upper contact 190C. UBMs 220A-220C and Cu pillars 225A-225C fill openings 212A-212C, respectively, and extend over top surface of PI layer 215. Cu pillars 225A-225C are disposed over UBMs 220A-220C, respectively, and solder bumps 230A-230C are disposed over, respectively. In some embodiments, UBMs 220A-220C, Cu pillars 225A-225C, and solder bumps 230A-230C provide contact structures of device 100 that can facilitate connection to external circuitry.

In some embodiments, UBMs 220A-220C provide low resistance electrical connections to the RDL within upper portions of upper contacts 190A-190C. UBMs 220A-220C can also hermetically seal and prevent diffusion of other bump metals into device 100. In some embodiments, UBMs 220A-220C include multiple layers of different metals, such as an adhesion layer (e.g., Ti, Cr, Al, other metal, or combinations thereof), a diffusion barrier layer (e.g., CrCu alloy and/or other suitable metal(s)), a solderable layer, and an oxidation barrier layer (e.g., Au and/or other suitable metal(s)). Various layers of UBMs 220A-220C can be deposited by electroplating, sputtering, evaporation, other method, or combinations thereof. In some embodiments, Cu seed layers are formed between Cu pillars 225A-225C and UBMs 220A-220C, for example, by an electroplating process. In some embodiments, diffusion barriers (e.g., Ni and/or other suitable metal (s)) are formed between Cu pillars 225A-225C and solder bumps 230A-230C, for example, to prevent formation of an intermetallic layer therebetween and/or to prevent the formation of microvoids. UBMs 220A-220C, Cu pillars 225A-225C, and solder bumps 230A-230C can be deposited by electroplating, sputtering, evaporation, other methods, or combinations thereof. After deposition of the various materials for UBMs 220A-220C, Cu pillars 225A-225C, and solder bumps 230A-230C. Patterning processes (e.g., lithography processes and/or etching processes) may be performed to pattern one or more of the various material layers deposited during the bumping process. In some embodiments, a reflow process may be performed after deposition of a solder material to form solder bumps 230A-230C.

FIG. 19A and FIG. 19B are fragmentary diagrammatic views of a via array that can be implemented in device 100, in portion or entirety, according to some embodiments of the present disclosure. FIG. 19A depicts a top view of a one by three (1×3) via array of device 100, which may correspond with top via array 25 of FIG. 1A, and FIG. 19B is a cross-sectional view of device 100 in a Y-Z plane, such as cross-sectional view of device 100 along a line C-C of FIG. 19A, which may correspond with line C-C of FIG. 1A. FIG. 19A and FIG. 19B have been simplified for the sake of clarity to better understand the inventive concepts of the present disclosure. Additional features can be added in the via array, and some of the features described below can be replaced, modified, or eliminated in other embodiments of the via array.

In FIG. 19A and FIG. 19B, the via array includes a first via (VIA1) (e.g., upper contact 190C), a second via (VIA2) (e.g., an upper contact 190D), and a third via (VIA3) (e.g., an upper contact 190E) arranged and aligned with one another along the y-direction. For example, VIA1 is spaced from VIA2 along the y-direction by a distance Y1, and VIA2 is spaced from VIA3 along the y-direction by distance Y1. VIA1, VIA2, and VIA3 each extend through a respective top conductor layer (i.e., MIM4), a respective middle conductor layer (i.e., MIM3), and a bottom conductor layer (i.e., MIM1). In other words, MIM3 and MIM4 are patterned to provide each via (e.g., contacts 190C-190E) with a respective MIM3 and a respective MIM4 through which it extends. Each respective MIM4 wraps and covers the respective MIM3 and a respective portion of insulator layer 172 therebetween (i.e., insulator layer 172 is patterned to provide each via with a respective portion through which it extends). With such configuration, in the top view (FIG. 19A), VIA1, VIA2, and VIA3 are surrounded by respective MIM4s, and insulator layer 164 surrounds the MIM4s. Extending VIA1, VIA2, and VIA3 through a same number of layers and/or materials can reduce stress and/or cracking.

Incorporating independent MIM3s and/or independent MIM4s into the via array leaves exposed portions of insulator layer 164, such as portions of insulator layer 164 extending between adjacent vias that are not covered by MIM3s and/or MIM4s. Exposed, underlying portions of insulator layer 164 may be damaged during patterning of overlying conductor layers, such as by etching processes used to pattern conductive layers to form MIM3s and/or MIM4s and/or associated with fabrication of a MIM structure as described with reference to FIGS. 8-12. In FIG. 19B, a portion of insulator layer 164 is exposed between MIM4 through which VIA1 extends and MIM4 through which VIA2 extends, and a portion of insulator layer 164 is exposed between MIM4 through which VIA2 extends and MIM4 through which VIA3 extends. Such exposed portions of insulator layer 164 extend a distance Y2 between adjacent vias. In some embodiments, a ratio of Y2 to Y1 (i.e., Y2/Y1) corresponds with an amount of insulator layer 164 exposed between adjacent vias when independent MIM3s and/or independent MIM4s are implemented into the via array. It has been observed that such via configurations can yield ratios that correspond with about 40% to about 80% of insulator layer 164 (and/or other underlying insulator layers) being exposed between adjacent vias of the via array. It has further been observed that an amount of insulator layer exposed increases as dimensions of the via array are reduced (i.e., more compact via arrays expose more insulator layer).

FIG. 20A and FIG. 20B are fragmentary diagrammatic views of another via array that can be implemented in device 100, in portion or entirety, according to some embodiments of the present disclosure. FIG. 20A depicts a top view of a one by three (1×3) via array of device 100, which may correspond with top via array 25 of FIG. 1A, and FIG. 20B is a cross-sectional view of device 100 in a Y-Z plane, such as cross-sectional view of device 100 along a line C-C of FIG. 20A, which may correspond with line C-C of FIG. 1A. FIG. 20A and FIG. 20B have been simplified for the sake of clarity to better understand the inventive concepts of the present disclosure. Additional features can be added in the via array, and some of the features described below can be replaced, modified, or eliminated in other embodiments of the via array.

In FIG. 20A and FIG. 20B, the via array includes VIA1, VIA2, and VIA3 arranged and aligned with one another along the y-direction. VIA1 is spaced from VIA2 along the y-direction by distance Y1, and VIA2 is spaced from VIA3 along the y-direction by distance Y1. Instead of having respective MIM3s and MIM4s, in FIG. 20A and FIG. 20B, MIM3s and MIM4s of vias of the via array are merged together between adjacent vias. For example, VIA1, VIA2, and VIA3 each extend through a top conductor layer (i.e., MIM4), a middle conductor layer (i.e., MIM3), and bottom conductor layer (i.e., MIM1). With such configuration, MIM3 and MIM4 extend distance Y1 between adjacent vias, such that MIM3 covers insulator layer 164 between VIA1 and VIA2 and between VIA2 and VIA3 and MIM4 covers insulator layer 172 between VIA1 and VIA2 and between VIA2 and VIA3. In the top view (FIG. 20A), VIA1, VIA2, and VIA3 are surrounded MIM4 (and/or MIM3), and insulator layer 172 surrounds MIM4.

FIG. 21A and FIG. 21B are fragmentary diagrammatic views of another via array that can be implemented in device 100, in portion or entirety, according to some embodiments of the present disclosure. FIG. 21A depicts a top view of a one by three (1×3) via array of device 100, which may correspond with top via array 25 of FIG. 1A, and FIG. 21B is a cross-sectional view of device 100 in a Y-Z plane, such as cross-sectional view of device 100 along a line C-C of FIG. 21A, which may correspond with line C-C of FIG. 1A. The via array of FIG. 21A and FIG. 21B is similar to the via array of FIG. 20A and FIG. 20B, except vias have independent MIM3s in the via array of FIG. 21A and FIG. 21B. In other words, MIM4s of vias of the via array are merged together between adjacent vias, while MIM3s of the vias of the via array are not merged between adjacent vias. For example, VIA1, VIA2, and VIA3 each extend through a top conductor layer (i.e., MIM4), a respective middle conductor layer (i.e., MIM3), and bottom conductor layer (i.e., MIM1). With such configuration, MIM4 extends distance Y1 between adjacent vias, such that MIM4 covers insulator layer 172 between VIA1 and VIA2 and between VIA2 and VIA3. In the top view (FIG. 21A), VIA1, VIA2, and VIA3 are surrounded MIM4, and insulator layer 172 surrounds MIM4. FIG. 21A and FIG. 21B have been simplified for the sake of clarity to better understand the inventive concepts of the present disclosure. Additional features can be added in the via array, and some of the features described below can be replaced, modified, or eliminated in other embodiments of the via array.

Merging MIM3s and/or MIM4s, such as provided in FIG. 20A, FIG. 20B, FIG. 21A, and FIG. 21B, significantly reduces an amount of exposed insulator layer of a MIM structure and thus prevents damage to the MIM structure's insulator layers, such as damage that may result when patterning conductor layers thereof. Reducing and/or preventing damage to the insulator layers can improve reliability and/or performance of the MIM structure. Different embodiments may have different advantages, and no particular advantage is required of any embodiment.

In some embodiments, VIA2 and VIA3 may be dummy vias that are not electrically connected to a voltage and/or external circuitry. In such embodiments, dummy conductor layers (also referred to as dummy conductor pads) may be incorporated into contact/via areas of device 100, such that the contacts/vias extend through a same number of layers and/or materials, which can reduce stress and/or cracking. For example, in some embodiments, MIM3s and MIM4s through which VIA2 and VIA3 extend may be dummy conductor layers, such as dummy middle conductor layers (CDMM) and dummy top conductor layers (CDTM), respectively.

The present disclosure contemplates implementing merging of MIM3s and/or MIM4s (e.g., top conductor layers and/or middle conductor layers of a MIM structure) in via arrays having various configurations. For example, in FIG. 20A and FIG. 21A, the via arrays are one-dimensional arrays. In some embodiments, MIM3s and/or MIM4s are merged in two-dimensional via arrays, such as depicted in FIG. 22. FIG. 22 is a fragmentary diagrammatic top view of a two by three (2×3) via array that can be implemented in device 100, in some embodiments. In the via array, a first column of vias is arranged and aligned along the y-direction, such as VIA1, VIA2, and VIA3, and a second column of vias is arranged and aligned along the y-direction, such as a VIA4, a VIA5, and a VIA6. Vias of the first column are aligned with respective vias of the second column. For example, VIA1, VIA2, and VIA3 are aligned with VIA4, VIA5, and VIA6, respectively, along the x-direction. MIM4 and/or MIM3 surrounds VIA1, VIA2, VIA3, VIA4, VIA5, and VIA6. MIM4 and/or MIM3 extends between adjacent vias, such that MIM4 covers insulator layer