The monoamine which is used as the end-capping agent is not particularly restricted so long as it has reactivity with a carboxy group. Examples thereof include aliphatic monoamines, such as methylamine, ethylamine, propylamine, butylamine, hexylamine, octylamine, decylamine, stearylamine, dimethylamine, diethylamine, dipropylamine, and dibutylamine; alicyclic monoamines, such as cyclohexylamine and dicyclohexylamine; aromatic monoamines, such as aniline, toluidine, diphenylamine, and naphthylamine; and any mixtures thereof. Among them, from the viewpoints of reactivity, high boiling point, stability of end-capping, price, etc., at least one selected from the group consisting of butylamine, hexylamine, octylamine, decylamine, stearylamine, cyclohexylamine, and aniline is preferred.

The polyamide (A) can be produced by using any method that is known as a method of producing a polyamide. For example, the polyamide (A) can be produced by a solution polymerization method or an interfacial polymerization method which uses an acid chloride and a diamine as raw materials, or a melt polymerization method, a solid polymerization method, or a melt extrusion polymerization method which uses a dicarboxylic acid and a diamine as raw materials.

The polyamide (A) can be produced, for example, by first collectively adding a diamine and a dicarboxylic acid, and optionally a catalyst or an end-capping agent, to produce a nylon salt, and then thermally polymerizing the nylon salt at a temperature of 200 to 250° C. to prepare a prepolymer, followed by solid phase polymerization or polymerization by a melt extruder. In the case where the final stage of the polymerization is performed through solid phase polymerization, it is preferred to perform the polymerization under reduced pressure or under an inert gas flow. When the polymerization temperature falls within a range of 200 to 280° C., a polymerization rate is large, productivity is good, and coloration or gelation can be effectively inhibited. The polymerization temperature in the final stage of polymerization performed by a melt extruder is preferably 370° C. or lower, and when the polymerization is performed under such a condition, a polyamide is obtained with almost no decomposition and less deterioration.

Examples of the catalyst which can be used in production of the polyamide (A) include phosphoric acid, phosphorous acid, hypophosphorous acid, and a salt or an ester thereof. Examples of the salt or ester include a salt of phosphoric acid, phosphorous acid, or hypophosphorous acid with a metal, such as potassium, sodium, magnesium, vanadium, calcium, zinc, cobalt, manganese, tin, tungsten, germanium, titanium, or antimony; an ammonium salt of phosphoric acid, phosphorous acid, or hypophosphorous acid; an ethyl ester, an isopropyl ester, a butyl ester, a hexyl ester, an isodecyl ester, an octadecyl ester, a decyl ester, a stearyl ester, a phenyl ester of phosphoric acid, phosphorous acid, or hypophosphorous acid.

The polyamide resin composition can contain any of a crystalline polyamide, an amorphous polyamide, and a mixture thereof to the extent that the effect of the present invention is not impaired.

Examples of the crystalline polyamide include polycaproamide (polyamide 6), polyhexamethylene adipamide (polyamide 66), polytetramethylene adipamide (polyamide 46), polyhexamethylene sebacamide (polyamide 610), polyhexamethylene dodecamide (polyamide 612), polyundecamethylene adipamide (polyamide 116), polybis(4-aminocyclohexyl)methane dodecamide (polyamide PACM12), polybis(3-methyl-4-aminocyclohexyl) methane dodecamide (polyamide dimethyl PACM 12), polyundecamethylene terephthalamide (polyamide 11T), polyundecamethylene hexahydroterephthalamide (polyamide 11T(H)), polyundecamide (polyamide 11), polydodecamide (polyamide 12), polytrimethylhexamethylene terephthalamide (polyamide TMDT), poly-m-xylylene adipamide (polyamide MXD6), polyhexamethylene terephthalamide (polyamide 6T), polyhexamethylene isophthalamide (polyamide 61), a copolymer of polyamide 61 and polyamide 6T (polyamide 6116T), and a copolymer of polyamide 6T and polyundecanamide (polyamide 11) (polyamide 6T/11), and a copolymer and mixture thereof. The crystalline polyamide includes one in which a benzene ring in terephthalic acid and/or isophthalic acid is substituted with an alkyl group or a halogen atom. One of the crystalline polyamides may be used alone or two or more thereof may be used in combination.

Examples of the amorphous polyamide include a polycondensation product of terephthalic acid/isophthalic acid/1,6-hexanediamine, a polycondensation product of terephthalic acid/isophthalic acid/1,6-hexanediamine/bis(3-methyl-4-aminocyclohexyl)methane, a polycondensation product of terephthalic acid/2,2,4-trimethyl-1,6-hexanediamine/2,4,4-trimethyl-1,6-hexanediamine, a polycondensation product of isophthalic acid/bis(3-methyl-4-aminocyclohexyl)methane/ω-laurolactam, a polycondensation product of isophthalic acid/2,2,4-trimethyl-1,6-hexanediamine/2,4,4-trimethyl-1,6-hexanediamine, and a polycondensation product of terephthalic acid/isophthalic acid/2,2,4-trimethyl-1,6-hexanediamine/2,4,4-trimethyl-1,6-hexanediamine. The amorphous polyamide includes one in which a benzene ring in terephthalic acid and/or isophthalic acid is substituted with an alkyl group or a halogen atom. One of the amorphous polyamides may be used alone or two or more thereof may be used in combination.

The melting point of the polyamide (A) is preferably 280° C. or higher, more preferably 285° C. or higher, and further preferably 295° C. or higher. When the melting point of the polyamide (A) is the above temperature or higher, sufficient heat resistance can be maintained even when a molded object of the polyamide resin composition containing the polyamide (A) is used in an application in which the molded object is subjected to a heating process such as a reflow process.

[Inorganic fibrous reinforcing material (B)]

The inorganic fibrous reinforcing material (B) is at least one selected from glass fibers having a circular or non-circular cross section. Among them, a glass fiber having a circular cross section and a glass fiber having a non-circular cross section are preferably used in combination. By using the both in combination, the polyamide resin composition is superior in the mold-processability and mechanical strength.

When glass fibers respectively having a circular and non-circular cross section are used in combination, the ratio of the contents thereof is not particularly limited, but the ratio (circular cross section/non-circular cross section) is preferably 20/80 to 80/20, more preferably 30/70 to 60/40, and further preferably 30/70 to 50/50.

A cross-sectional shape of the glass fiber having a circular cross section is, for example, a true circular shape or a roughly circular shape. A cross-sectional shape of the glass fiber having a non-circular cross section is, for example, a cocoon shape in which a central portion in the longitudinal direction of the cross section is constricted, an ellipse shape having parts which are symmetrical about the center of gravity of the cross section and are substantially parallel to each other, or an oval shape.

In addition, from the viewpoints of flame retardance and mechanical strength of a resulting molded object, a periphery of a cross section of the glass fiber having a non-circular cross section is preferably 1.05 to 1.8 larger than a periphery of a glass fiber having a circular cross section that has the same cross-sectional area as that of the non-circular cross section.

The average fiber length of the glass fiber is preferably 1.0 to 10 mm, more preferably 1.0 to 7.0 mm, and further preferably 2.0 to 4.0 mm.

The average fiber diameter of the glass fiber is, from the viewpoints of flame retardance, mechanical strength, and appearance of a resulting molded object, preferably 6 to 20 μm, more preferably 7 to 16 μm, and further preferably 8 to 14 μm.

The average fiber length and average fiber diameter of the glass fiber are measured as follows. Four hundred glass fibers are arbitrarily selected by image analysis using an electron microscopy and the fiber lengths and fiber diameters of the respective fibers are measured. Then, the weight average of the fiber lengths and the weight average of the fiber diameters are determined.

The polyamide resin composition contains 45 to 120 parts by mass of the inorganic fibrous reinforcing material (B) based on 100 parts by mass of the polyamide (A). When the content of the inorganic fibrous reinforcing material (B) is less than 45 parts by mass, the strength of an injection-molded object is reduced and a strength for enduring the practical use as a connector and the like is not achieved. When the content is more than 120 parts by mass, flowability decreases to reduce injection moldability and reduce productivity in compounding. The content of the inorganic fibrous reinforcing material (B) is preferably 48 parts by mass or more, and more preferably 50 parts by mass or more. In addition, the content of the inorganic fibrous reinforcing material (B) is preferably 100 parts by mass or less, and more preferably 80 parts by mass or less.

[Phosphinate Salt (C)]

By containing the phosphinate salt (C), the polyamide resin composition can be a halogen-free polyamide resin composition that provides a molded object having superior flame retardance.

The phosphinate salt (C) is at least one represented by the following formula (I) or the following formula (II). Specifically, the phosphinate salt (C) is a phosphinate salt represented by the following formula (I), a diphosphinate salt represented by the following formula (II), or a mixture thereof.

[Image Omitted]

In the formula (I) and formula (II), R^1,R^2,R^4,and R⁵each independently represent a linear or branched alkyl group having 1 to 16 carbon atoms. Among them, an alkyl group having 1 to 8 carbon atoms is preferred, a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a tert-butyl group, an n-pentyl group, or an n-octyl group is more preferred, and an ethyl group is further preferred. R¹and R²may bind to each other to form a ring and R⁴and R⁵may bind to each other to form a ring.

Besides the above, R^1,R^2,R^4,and R⁵can each independently represent an aryl group having 6 to 10 carbon atoms. Examples of the aryl group having 6 to 10 carbon atoms include a phenyl group and a naphthyl group.

R³represents a linear or branched alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 10 carbon atoms, an alkylarylene group having 7 to 20 carbon atoms, a cycloalkylene group having 3 to 10 carbon atoms, an aralkylene group having 7 to 10 carbon atoms, or an arylalkylene group having 7 to 20 carbon atoms.

Examples of the linear or branched alkylene group having 1 to 10 carbon atoms include a methylene group, an ethylene group, an n-propylene group, an isopropylene group, an isopropylidene group, an n-butylene group, a tert-butylene group, an n-pentylene group, and an n-octylene group.

Examples of the arylene group having 6 to 10 carbon atoms include a phenylene group and a naphthylene group.

Examples of the alkylarylene group having 7 to 20 carbon atoms include a methylphenylene group, an ethylphenylene group, a tert-butylphenylene group, a methylnaphthylene group, an ethylnaphthylene group, and a tert-butylnaphthylene group.

Examples of the cycloalkylene group having 3 to 10 carbon atoms include a cyclohexylene group and a cyclohexadimethylene group.

Examples of the aralkylene group having 7 to 10 carbon atoms include a phenylene methylene group, a phenylene ethylene group, and a xylylene group.

Examples of the arylalkylene group having 7 to 20 carbon atoms include a phenylmethylene group, a phenylethylene group, a phenylpropylene group, and a phenylbutylene group.

M represents calcium, aluminum, magnesium, or zinc. Aluminum or zinc is preferred, and aluminum is more preferred.

m is an integer of 1 to 4. n is an integer of 1 to 4. x is an integer of 1 to 4. In the formula (II), m, x, and n satisfy a relational expression: mx=2n (that is, the product of m and x is equal to the product of 2 and n).

Examples of the phosphinic acid constituting the phosphinate salt (C) include dimethylphosphinic acid, ethylmethylphosphinic acid, diethylphosphinic acid, methyl-n-propylphosphinic acid, isobutylmethylphosphinic acid, octylmethylphosphinic acid, methylphenylphosphinic acid, and diphenylphosphinic acid. Among them, diethylphosphinic acid is preferred.

Specific examples of the phosphinate salt represented by the formula (I) include calcium dimethylphosphinate, magnesium dimethylphosphinate, aluminum dimethylphosphinate, zinc dimethylphosphinate, calcium ethylmethylphosphinate, magnesium ethylmethylphosphinate, aluminum ethylmethylphosphinate, zinc ethylmethylphosphinate, calcium diethylphosphinate, magnesium diethylphosphinate, aluminum diethylphosphinate, zinc diethylphosphinate, calcium methyl-n-propylphosphinate, magnesium methyl-n-propylphosphinate, aluminum methyl-n-propylphosphinate, zinc methyl-n-propylphosphinate, calcium methylphenylphosphinate, magnesium methylphenylphosphinate, aluminum methylphenylphosphinate, zinc methylphenylphosphinate, calcium diphenylphosphinate, magnesium diphenylphosphinate, aluminum diphenylphosphinate, and zinc diphenylphosphinate.

Examples of the diphosphinic acid constituting the diphosphinate salt include methane di(methylphosphinic acid) and benzene-1,4-di(methylphosphinic acid).

Specific examples of the diphosphinate salt represented by the formula (II) include calcium methane di(methylphosphinate), magnesium methane di(methylphosphinate), aluminum methane di(methylphosphinate), zinc methane di(methylphosphinate), calcium benzene-1,4-di(methylphosphinate), magnesium benzene-1,4-di(methylphosphinate), aluminum benzene-1,4-di(methylphosphinate), and zinc benzene-1,4-di(methylphosphinate).

From the viewpoint of more superior flame retardance, the phosphinate salt (C) is preferably aluminum diethylphosphinate, zinc diethylphosphinate, aluminum methane di(methylphosphinate), or zinc methane di(methylphosphinate). Among them, aluminum diethylphosphinate is more preferred.

From the viewpoints of flame retardance, mechanical strength, and appearance of a resulting molded object, the number average particle diameter of the phosphinate salt (C) is preferably 100 μm or less, more preferably 50 μm or less, and further preferably 40 μm or less. The lower limit of the number average particle diameter is preferably 1 μm or more, more preferably 5 μm or more, and further preferably 10 μm or more. When a powder having a number average particle diameter in the above range is used, not only higher flame retardance is developed but also higher mechanical strength of a resulting molded object is obtained.

Note that the number average particle diameter is a particle diameter at 50% weight accumulation in a particle diameter distribution measured using a particle size distribution meter of a laser scattering particle size distribution analyzer.

The polyamide resin composition contains 25 to 40 parts by mass of the phosphinate salt (C) based on 100 parts by mass of the polyamide (A). When the content of the phosphinate salt (C) is less than 25 parts by mass, it is difficult for a molded object to develop a superior flame retardance in small and large thickness ranges. When the content is more than 40 parts by mass, the polyamide resin composition may be inferior in mold-processing ability and mechanical strength. The content of the phosphinate salt (C) is preferably 26 parts by mass or more, and more preferably 27 parts by mass or more. In addition, the content of the phosphinate salt (C) is preferably 38 parts by mass or less, and more preferably 35 parts by mass or less.

[Phosphite Salt (D)]

By containing the phosphite salt (D), the polyamide resin composition can develop superior flame retardance, and in addition, melt-kneading and mold-processing of the polyamide resin composition are performed well.

The phosphite salt (D) is not particularly limited, and examples thereof include sodium phosphite, potassium phosphite, calcium phosphite, zinc phosphite, ammonium phosphite, and aluminum hydrogen phosphite. From the viewpoint of developing more superior flame retardance, aluminum phosphite and aluminum hydrogen phosphite are preferred. One of the phosphite salts may be used alone or two or more thereof may be used in combination.

The polyamide resin composition contains 2 to 15 parts by mass of the phosphite salt (D) based on 100 parts by mass of the polyamide (A). When the content of the phosphite salt (D) is less than 2 parts by mass, it is difficult for a molded object to develop superior flame retardance in small and large thickness ranges. When the content is more than 15 parts by mass, the polyamide resin composition may be inferior in mold-processing ability and mechanical strength. The content of the phosphite salt (D) is preferably 2.5 parts by mass or more, and more preferably 3 parts by mass or more. The content of the phosphite salt (D) is preferably 13 parts by mass or less, and more preferably 10 parts by mass or less.

In the polyamide resin composition, the total amount of the phosphinate salt (C) and the phosphite salt (D) is 16 to 25% by mass based on 100% by mass of the polyamide resin composition. When the sum of the contents of the phosphinate salt (C) and the phosphite salt (D) is less than 16% by mass, it is difficult for a molded object to develop superior flame retardance in small and large thickness ranges. When the sum of the contents is more than 25% by mass, the polyamide resin composition may be inferior in mechanical strength and mold-processing ability. The sum of the contents is preferably 16.5% by mass or more, and more preferably 17% by mass or more. In addition, the sum of the contents is preferably 23% by mass or less, and more preferably 22.5% by mass or less.

In the polyamide resin composition, the mass ratio ((C)/(D)) of the phosphinate salt (C) to the phosphite salt (D) is 70/30 to 94/6. When the mass ratio is out of the above range, it is difficult for a molded object to develop superior flame retardance in small and large thickness ranges. The mass ratio is preferably 75/25 to 93/7, and more preferably 80/20 to 92/8.

The sum of the contents of the polyamide (A), the inorganic fibrous reinforcing material (B), the phosphinate salt (C), and the phosphite salt (D) based on 100% by mass of the polyamide resin composition is preferably 90 to 99.9% by mass, more preferably 95 to 99.9% by mass, and further preferably 95 to 99.5% by mass. When the sum of the contents is in the above range, such a polyamide resin composition is suitable as a polyamide resin composition that provides a molded object having a more superior flame retardance.

[Other Components]

The polyamide resin composition can contain other components, such as an antioxidant, a mold releasing agent, an inorganic material other than the inorganic fibrous reinforcing material (B), to the extent that the effect of the present invention is not impaired.

Examples of the antioxidant include a hindered phenol compound, a phosphorus compound, a lactone compound, and a hydroxy compound.

Examples of the mold releasing agent include a silicone-based agent, a fluorine-based agent, a long chain alkyl-based agent, and a fatty acid amide-based agent.

Examples of the inorganic material include carbon nanotube, fullerene, talc, wollastonite, zeolite, sericite, mica, kaolin, clay, pyrophyllite, silica, bentonite, alumina silicate, silicon oxide, magnesium oxide, alumina, zirconium oxide, titanium oxide, iron oxide, calcium carbonate, magnesium carbonate, dolomite, calcium sulfate, barium sulfate, calcium hydroxide, magnesium hydroxide, aluminum hydroxide, glass fiber, milled fiber, glass powder, ceramic bead, boron nitride, silicon carbide, carbon black, graphite, and various clay minerals, such as halloysite and vermiculite.

The polyamide resin composition may further contain, as needed, other components, such as a thermal stabilizer, a photostabilizer, a styrene-maleic anhydride copolymer (SMA), a lubricant, a nucleating agent, a crystallization delay material, a hydrolysis inhibitor, an anti-static agent, a free radical inhibitor, a matting agent, an ultraviolet ray absorber, an anti-dripping agent, and a slidability imparting agent.

The other components may be contained in the polyamide resin composition in any amount so long as the effect of the present invention is not impaired. From the viewpoint of easily developing flame retardance, the content is preferably 10% by mass or less, and more preferably 5% by mass or less.

[Method of Producing Polyamide Resin Composition]

The method of producing the polyamide resin composition is not particularly limited and any known method can be used. For example, the polyamide (A), the inorganic fibrous reinforcing material (B), the phosphinate salt (C), the phosphite salt (D), and the other components to be blended as needed, are dry-blended to make a mixture, which is subjected to melt-kneading, whereby the polyamide resin composition can be produced.

The technique of melt-kneading is not particularly limited, and a method in which the above components can be uniformly mixed is preferably adopted. For example, a single screw extruder, a twin screw extruder, a kneader, and a Banbury mixer are preferred, and from the viewpoint of good dispersion of an elastomer and an industrial productivity, a twin screw extruder is more preferred.

After the polyamide resin composition is produced, a pelleted product, for example, is subjected to various molding methods, whereby a molded object can be obtained. A method of molding a molded object may be appropriately selected according to the application, and a method of injection molding, extrusion molding, hollow molding, compression molding, press molding, calendar molding, or the like can be adopted.

In particular, since the polyamide resin composition of this embodiment not only endures a reflow process but also provides a molded object having superior flame retardance in a thickness in which it has heretofore been difficult to develop flame retardance, the polyamide resin composition is suitable for an injection-molded object which is used in an application with a surface mount process.

The thickness in which it has heretofore been difficult to develop flame retardance means that a molded object develops superior flame retardance in either a small or a large thickness. Even when the polyamide resin composition of this embodiment is formed into molded objects, for example, having a thickness of about 0.15 mm, about 0.40 mm, about 0.75 mm, and about 3.0 mm, a superior flame retardance can be developed. That is, a molded object of the polyamide resin composition of this embodiment can develop a superior flame retardance in a thickness in the range of 0.15 mm or more. Note that development of a superior flame retardance of a molded object in this embodiment is not limited to the case of the thickness of 0.15 mm or more.

The polyamide resin composition of this embodiment is superior in heat resistance for enduring a reflow process and flame retardance, and thus is useful as external connection terminals, such as an FPC connector, a B-to-B connector, a card connector, an SMT connector, a coaxial connector, and a memory card connector; an SMT relay; an SMT bobbin; sockets, such as a memory socket and a CPU socket; switches, such as a command switch and an SMT switch; sensors, such as a rotating sensor and an acceleration sensor; automobile components, such as an inverter IGBT module member, an ECU housing, an insulator, a connector for automobiles, an engine mount, an intercooler, and a bearing retainer. Among them, the polyamide resin composition is useful as an SMT connector, an SMT relay, and an IGBT module member for automobiles and electronic devices, and particularly preferably useful as an SMT connector.

Since a molded object of the polyamide resin composition of this embodiment develops a superior flame retardance particularly in small and large thickness ranges, the polyamide resin composition of this embodiment can be suitably used in an application in an SMT connector or an SMT relay.

Examples of the electronic device including a molded object obtained from the polyamide resin composition of this embodiment include, but are not limited to, portable electronic devices, such as a smartphone and a personal computer, and an automobile.

EXAMPLES

The present invention will be more specifically described below with reference to examples and comparative examples, but the present invention is not to be limited thereto.

The melting point and glass transition temperature of the polyamide (A) used in the examples and comparative examples were measured according to the following method.

(Melting Point and Glass Transition Temperature of Polyamide (A))

The melting point of a polyamide (PA9T described later, sample) used as the polyamide (A) was determined as follows. Using a differential scanning calorimetry (DSC 7020) manufactured by Hitachi High-Tech Science Corporation, a peak temperature of a melting peak observed while the temperature was increased under a nitrogen atmosphere from 30° C. to 360° C. at a rate of 10° C./min was taken as the melting point (° C.). When two or more melting peaks were observed, the peak temperature of the melting peak of the highest temperature was taken as the melting point.

Subsequently, the sample was kept at a temperature 30° C. higher than the melting point for 10 minutes to completely melt the sample, and then the sample was cooled to 40° C. at a rate of 10° C./min and was kept at 40° C. for 10 minutes. The temperature was increased again to the temperature 30° C. higher than the melting point at a rate of 10° C./min, and the midpoint of the step-wise change in the DSC curve during the above temperature rising was taken as the glass transition temperature.

Examples 1 to 6 and Comparative Examples 1 to 4

The polyamide (A) and other components in amounts shown in Table 1 were fed into a twin screw extruder manufactured by Research Laboratory of Plastics Technology Co., Ltd. (screw diameter: 32 mmφ, L/D=30, number of rotations: 150 rpm, discharge: 10 kg/h) through a hopper on the uppermost-stream side of the extruder. The inorganic fibrous reinforcing material (B), the phosphinate salt (C), and the phosphite salt (D) in amounts shown in Table 1 were further fed through a side feeder, and the mixture was melt-kneaded. The melt-kneaded polyamide resin composition was extruded in a strand form, was cooled and then cut, thereby obtaining pellets of a polyamide resin composition.

The amounts of the polyamide (A), the inorganic fibrous reinforcing material (B), the phosphinate salt (C), the phosphite salt (D), and the other components shown in Table 1 are all in “parts by mass”.

Using the resulting pellets, the [flame retardance] of the molded object was evaluated according to the following method.

[Flame Retardance]

Using an injection molding machine UH-1000 manufactured by NISSEI PLASTIC INDUSTRIAL CO., LTD. at the highest cylinder temperature of 320° C., a mold temperature of 140° C., and an injection rate of 750 to 150 mm/s, pellets of the polyamide resin composition obtained in each Example or Comparative Example were subjected to injection molding to form tabular test pieces of 12.5 mm width and 125 mm length (thickness: 0.40 mm, 0.75 mm, 3.0 mm), which were used as test pieces. The test pieces of the respective thicknesses were evaluated for the flame retardance according to the criteria of the UL94 standard as below.

An upper end of each of the test pieces was fastened with a clamp to fix the test piece in a vertical posture. A prescribed flame was applied to a lower end of the test piece for 10 seconds and then was removed away, and the burning time (first time) of the test piece was measured. Immediately after the fire went out, a flame was again applied to the lower end for 10 seconds and then was removed away, and the burning time (second time) of the test piece was measured. The same measurement was repeated for 5 pieces to obtain 5 data of the first burning time and 5 data of the second burning time, i.e., 10 data in total. The sum of the 10 data was taken as T and the maximum value of the 10 data was taken as M. When T is 50 seconds or less, M is 10 seconds or less, the flame does not extend up to the clamp, and the flamed molten material, even if falls, does not ignite a cotton piece located 12 inches below the test piece, the evaluation point is “V-0”. When T is 250 seconds or less, M is 30 seconds or less, and the same conditions as for V-0 are satisfied in the other requirements, the evaluation point is “V-1”. When T is 250 seconds or less, M is 30 seconds or less, the flame does not extend up to the clamp, and the flamed molten material falls to ignite a cotton piece located 12 inches below the test piece, the evaluation point is “V-2”.

The components shown in Table 1 are as follows.

[Polyamide (A)]

PA9T: “GENESTAR GC51010”, manufactured by Kuraray Co., Ltd., PA9T (polyamide in which the dicarboxylic acid unit is a terephthalic acid unit and the diamine unit is a 1,9-nonanediamine unit and a 2-methyl-1,8-octanediamine unit (molar ratio: 85/15)), melting point: 305° C., glass transition temperature: 125° C.

[Inorganic Fibrous Reinforcing Material (B)]

Circular cross section: glass fiber “ECSO3T-262H” (manufactured by Nippon Electric Glass Co., Ltd., cross-sectional shape: circular, 3 mm chopped strand, fiber diameter: 10.5 μm)