100.

As explained in connection with FIG. 1B, housing or shell 130 provides the external structure or skeleton for the optical transceiver device 100 and provides protection to components within the optical transceiver device 100 from external forces and elements. As shown in FIG. 2B, the shell 130 may include a shell base 210 that forms the bottom surface of the optical transceiver device 100. Shell cover 220 may form a top surface of the optical transceiver device 100 along with one or more sidewalls of the optical transceiver device 100. As noted above, between the shell cover 220 and the shell base 210, the optical transceiver device 100 includes various components such as optical subassemblies, integrated chips (ICs), Application-Specific Integrated Circuits (ASICs), controllers, processors such as digital signal processors (DSPs), analog-to-digital converters, digital-to-analog converters, amplifiers, storage devices, filters, and/or photodiodes (not all are labeled in the figures).

In particular, a DSP ASIC 240 may be disposed on a DSP printed circuit board (PCB) or substrate 230. The DSP ASIC 240 may execute many of the protocols and functions of the optical transceiver device 100 and may generate a substantially high amount of heat. With heat management mechanisms, the heat generated by the DSP ASIC 230 may cause damage to other components, and, in particular, optical subassemblies or heat-sensitive components such as lasers.

In some implementations, a conductive thermal interface material (250) may be disposed on a top surface of the DSP ASIC 240. The TIM 250 may also be used to transfer heat away from one or more regions of the optical transceiver device 100 such as the DSP ASIC 240 to another region of the optical transceiver device 100, or, more generally, to or from any device the TIM 250 is thermally connected to. In some implementations, the TIM 250 may be used to provide an additional thermal path to transfer heat to other heat relieving components. When disposed between the DSP ASIC 240 and slug 160, the TIM 250 may transfer heat from the DSP ASIC 240 to the slug 160 and/or any other heat-relieving component connected to the TIM 250 thereby facilitating heat management of the optical transceiver device 100.

Slug 160 may be disposed on the TIM 250 or, in implementations in which a TIM is not used, the slug 160 may be disposed directly on a top surface of the DSP ASCI 240. Slug 160 may extend vertically to a top surface of the optical transceiver device 100 and may be flush with the top exterior surface of the optical transceiver device 100. As explained above with reference to FIG. 1B, the slug 160 provides a vertical thermal path to remove heat away from the DSP ASIC 240.

A first insulation frame 150 and a second isolation frame 170 are disposed on two sides of the slug 160 at the top exterior surface of the optical transceiver device 100. On the sides of the first insulation frame 150 and the second isolation frame 170 in contact with the slug 160, a horizontal extension or tab of the slug 160 may be inserted into the gap between the first insulation frame 150 and the second isolation frame 170. In this manner, the slug 160 can be secured within the optical transceiver device 100.

On the sides of the first insulation frame 150 and the second isolation frame 170 that are not in contact with the slug 160, a portion of the shell cover 220 may fill the gap between the first insulation frame 150 and the second isolation frame 170. The first insulation frame 150 and the second isolation frame 170 are affixed to the optical transceiver device using a fastener such as screw 260 on both sides of the slug 160. A nut 270 may be used to fasten the screw 260 in place and to reduce the likelihood of the screw 260 coming loose.

The previous figures depict various views of the optical transceiver device 100. FIG. 3A depicts an example of an optical transceiver device 100 about to be engaged with a heat transfer device 310 and a cage 320. FIGS. 3B through 6 depict implementations when the optical transceiver device 100 is engaged with the heat transfer device 310.

Turning to FIG. 3A, to couple the optical transceiver device 100 to the heat transfer device 310, a cage 320 may be used. The example cage 320 shown in FIGS. 3A and 3b may include, among various other components, a housing or shell 340, a pluggable end 330, and an opening 350. Shell 340 provides the external structure or skeleton to provide structural support and protection to components within the shell 340. The components within the shell 340 provide an interface between the optical transceiver device 100 and the heat transfer device 310. In some implementations, the design, including thermal and mechanical specifications, of the shell 340 may comply with the specifications of the MSA.

The pluggable end 330 of the cage 320 may be configured to be engaged with the optical transceiver device 100. In particular, the pluggable end 330 of the cage 320 may have a first opening to allow the pluggable end 120 of the optical transceiver device 100 to be inserted into the cage 320, as shown in FIG. 3B. The pluggable end 330, and more generally the cage 320, may include one or more locking mechanisms such as, e.g., fasteners, that provide resistance to the decoupling of the cage 320 and the optical transceiver device 100 once the cage 320 and the optical transceiver device 100 are coupled together.

Cage 320 may also include a second opening 350 that exposes a cavity within the cage 320. The cavity accommodates the optical transceiver device 100 when inserted into and engaged with the cage 320. When the optical transceiver device 100 is inserted into the cage 320, the second opening 350 exposes a top surface of the optical transceiver device 100, e.g., a top surface of slug 160.

In FIG. 3B, a heat transfer device 310 is engaged with the cage 320 and the optical transceiver device 100. In general, the heat transfer device 310 may refer to a passive electronic component configured to transfer heat generated by an electronic or a mechanical device to another medium, e.g., air, liquid. In some implementations, the heat transfer device 310 may be a heat sink.

The heat transfer device 310 may be mechanically and electrically connected to the cage 320 and/or the optical transceiver device 100 in various configurations. In the implementation depicted in FIG. 3B, a spring-loaded heat transfer device 310 may be disposed on top of the cage 320 and the optical transceiver device 100. The cage