Copper Wire Bonding Apparatus Using A Purge Gas to Enhance Ball Bond Reliability | Patent Application Number 14252851

14252851
Not Appealed
Patent Number-
Publication NumberUS 20150243534 A1
Filled DateApr 15, 2014
Priority DateFeb 26, 2014
Inventor/Applicants
ExaminesPATEL, DEVANG R
Art Unit1735
Technology Center1700
Assignments
Agere Systems Broadcom
Current
Lsi Broadcom
Current
Lsi BroadcomBroadcom
Original
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