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Semiconductor Packaging > Summary

A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more semiconductor electronic components. Individual discrete components are typically etched in silicon wafer before being cut and assembled in a package. The package provides protection against impact and corrosoion, holds the contact pins or leads which are used to connect from external circuits to the device, and dissipates heat produced in the device. Thousands of standard package types are made,with some made to industry-wide standards and some particular to an individual manufacturer.
As the semiconductor assembly industry continues its movement toward finer pitch, combined with reduced copper pillar height, cleaning processes are increasingly... Read More »
Gallium Arsenide (GaAs)- based devices are often used in telecom applications because of their higher carrier motilities, but the use of conventional die attach pastes ... Read More »
Dealing with micro-scale parts at high production speeds brings challenges to dispensing anaerobic fluids. Nordson ASYMTEK's latest research details the equipment, ... Read More »
The global chip market will be $348 billion in 2015, a 2.2 percent increase from 2014, according to market research firm Gartner Inc.
Today announced the cornerstone safety Standard S2 (Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment) will be updated this month... Read More »
Corporate data centers are reluctant adopters of new technology. There is too much at stake to make quick changes, which accounts for a number of failed semiconductor... Read More »